Renesas R7FA6M5AH2CBG#BC0
- Part No.:
- R7FA6M5AH2CBG#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LFBGA
- Datasheet:
-
R7FA6M5AH2CBG#BC0.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 2M/512K
- Quantity:
- Payment:

- Shipping:

Inventory:1,515
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Product details
Overview
R7FA6M5AH2CBG from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 2 MB dual-bank code flash with background/swap operation, 8 KB data flash, and 512 KB SRAM with parity/ECC. It integrates Ethernet MAC, USB 2.0 High-Speed/Full-Speed, dual CAN FD, SDHI, QSPI/OSPI, and Secure Crypto Engine (SCE9) with TrustZone for secure industrial gateways and connected edge devices.
For engineers reviewing the R7FA6M5AH2CBG datasheet, R7FA6M5AH2CBG pinout, R7FA6M5AH2CBG application, or R7FA6M5AH2CBG equivalent, key selection criteria include its -40°C to +85°C operating range, 176-pin FBGA package, dual CAN FD support, integrated Ethernet MAC with RMII, and hardware-accelerated cryptography (AES/RSA/ECC/SHA256) for secure firmware updates and device authentication.
Technical Context
The R7FA6M5AH2CBG implements Armv8-M architecture with TrustZone security extension, enabling strict isolation between secure and non-secure execution environments. Its dual-bank flash supports seamless firmware updates via SWAP operation without system interruption, while the SCE9 crypto engine offloads AES-128/256, RSA-2048, ECC-P256, and SHA256 operations from the CPU.
It features two independent CAN FD controllers compliant with ISO 11898-1, each with 16 transmit and 16 receive buffers, and an Ethernet MAC (ETHERC) supporting RMII interface with integrated DMA (EDMAC) for zero-copy packet handling. The 200 MHz core clock is derived from PLL with multiple on-chip oscillator sources (HOCO/MOCO/LOCO/SOSC).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M33 @ 200 MHz with TrustZone, MPU_S/MPU_NS (8 regions each), ETM-M33 trace |
| Memory | 2 MB dual-bank code flash (background/swap), 8 KB data flash (100k P/E cycles), 512 KB SRAM (448 KB parity + 64 KB ECC) |
| Connectivity | Dual CAN FD (ISO 11898-1), USB 2.0 HS/FS, Ethernet MAC (RMII), SDHI, QSPI/OSPI, SCI×10, IIC×3, SPI×2 |
| Analog | ADC12×2 (13/16 ch, 5 Msps interleaved), DAC12×2, TSN temperature sensor, CTSU capacitive touch unit |
| Security | Secure Crypto Engine 9 (AES/RSA/ECC/DSA/SHA256/GHASH), tamper detection, 128-bit UID, lifecycle management |
| Package & Temp | 176-pin FBGA (7 mm × 7 mm, 0.5 mm pitch), -40°C to +85°C industrial grade |
| Power | VCC = 2.7–3.6 V; low-power modes including Deep Software Standby with VBATT RTC backup |
Pinout & Package
176-pin Fine-Pitch Ball Grid Array (FBGA) package, PLBG0176GF-A footprint, 7 mm × 7 mm body, 0.5 mm ball pitch, RoHS-compliant Sn (Tin) terminal finish. Designed for high-density PCB layouts with thermal pad under die for enhanced heat dissipation in industrial control applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated power rails with decoupling requirements: 0.1 µF capacitor per VCC pin placed adjacent to package |
| VBATT | Battery backup input | Supplies RTC, SOSC, and backup registers during main power loss; supports calendar mode with leap-year correction |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal; enables precise timing for Ethernet, USB, and real-time control loops |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar accuracy and low-power wake-up timing |
| MD | Mode control input | Configures single-chip vs. SCI/USB boot mode at reset; must remain stable during mode transition |
| RES | Reset input | Active-low asynchronous reset; initiates full system initialization including flash controller and security state reset |
| ETH_MDC / ETH_MDIO | PHY management interface | IEEE 802.3-compliant MDIO/MDC bus for configuring external Ethernet PHY registers |
| ETH_TXD0–3 / ETH_RXD0–3 | Ethernet data lanes | RMII-compliant 4-bit transmit/receive data path; requires matched trace lengths for signal integrity |
| CANFD0_TX / CANFD0_RX | Channel 0 CAN FD transceiver interface | Differential signaling pins for ISO 11898-1 CAN FD bus; supports data rates up to 5 Mbps |
| USB_VBUS / USB_DP / USB_DM | USB 2.0 High-Speed physical interface | Integrated transceiver supports HS/FS modes; VBUS sensing enables host/device role negotiation |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP operation | Enables atomic firmware updates without halting real-time tasks or losing network connectivity |
| Secure Crypto Engine 9 (SCE9) | Hardware-accelerated AES-128/256 encryption/decryption, RSA-2048 signing, ECC-P256 key exchange, and SHA256 hashing |
| TrustZone-enabled memory protection | Configurable secure/non-secure regions for flash (3–6), data flash (2), and SRAM (3); peripheral attribution per module |
| Integrated Ethernet MAC with RMII | Direct connection to external PHY without external glue logic; supports IEEE 1588 PTP timestamping via ETHERC registers |
| High-resolution analog subsystem | Two independent 12-bit ADCs with 5 Msps interleaved sampling and shared channel mapping for sensor fusion |
| Low-power timer suite | Six AGT timers with asynchronous clocking (LOCO) enable wake-up from Deep Software Standby using external events |
Applications
| Industrial Ethernet Gateway | Secure Edge Node Controller |
|---|---|
|
Use Scenario: Protocol translation between Modbus TCP, EtherNet/IP, and fieldbus networks in factory automation. IC Role / Device Role / Timing Role: Central MCU managing dual CAN FD buses for legacy fieldbus, Ethernet MAC for upstream cloud connectivity, and SCE9 for TLS 1.3 handshake acceleration. Use Value: Dual-bank flash allows over-the-air firmware updates without interrupting real-time PLC communication cycles. |
Use Scenario: Smart metering endpoint with tamper detection, encrypted data logging, and remote firmware validation. IC Role / Device Role / Timing Role: Secure element co-processor with TrustZone-enforced isolation between metering firmware and SCE9 cryptographic keys. Use Value: Tamper pins (up to three) trigger immediate key erasure and secure state reset upon physical intrusion detection. |
| Medical Imaging Subsystem | Automotive Diagnostic Tool |
|
Use Scenario: Real-time image preprocessing and DICOM protocol encapsulation in portable ultrasound devices. IC Role / Device Role / Timing Role: High-speed data mover using DMAC×8 and DTC for sensor-to-SDHI/QSPI pipeline with minimal CPU load. Use Value: 512 KB SRAM with ECC ensures data integrity during burst transfers from ADC arrays to external memory. |
Use Scenario: UDS-compliant diagnostic interface connecting to vehicle ECUs via CAN FD and USB-C host port. IC Role / Device Role / Timing Role: Dual CAN FD controller handles simultaneous UDS sessions on two vehicle domains; USBHS provides high-bandwidth PC link. Use Value: Hardware CRC calculator accelerates ISO 14229-1 message checksum generation for faster diagnostic response times. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M5BH2CBG | Same package and memory, but supports only Classical CAN (not CAN FD) | Lacks CAN FD frame handling capability; unsuitable for automotive diagnostics requiring >1 Mbps data rate | Select only if legacy CAN 2.0B is sufficient and CAN FD is not required in the BOM |
| R7FA6M5AH3CFC | Same feature set, but 176-pin LQFP package and extended temperature range (-40°C to +105°C) | Higher thermal tolerance for under-hood or outdoor deployments; larger footprint increases PCB area | Choose when extended temperature operation is mandatory and FBGA assembly capability is unavailable |
Compared with R7FA6M5BH2CBG, the R7FA6M5AH2CBG delivers CAN FD for higher bandwidth diagnostics and firmware updates; compared with R7FA6M5AH3CFC, it offers identical functionality in a smaller, thermally optimized FBGA package suited for space-constrained industrial modules.
Availability
R7FA6M5AH2CBG is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, medical imaging subsystems, and automotive diagnostic tools requiring stable component supply across multi-year production cycles.
Supply support for R7FA6M5AH2CBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RA6M5 Group targets secure, high-performance edge computing with integrated networking and hardware-based security - designed specifically for industrial IoT gateways, smart infrastructure, and safety-critical human-machine interfaces.
FAQ
What is the maximum operating frequency of the R7FA6M5AH2CBG?
The R7FA6M5AH2CBG operates at a maximum frequency of 200 MHz using its Arm Cortex-M33 core. This clock speed is achieved via the on-chip PLL driven by the main crystal oscillator (8–24 MHz) or high-speed on-chip oscillator (HOCO). The R7FA6M5AH2CBG maintains full peripheral functionality-including Ethernet MAC, USB HS, and dual CAN FD-at this frequency, validated across the full -40°C to +85°C temperature range.
Does the R7FA6M5AH2CBG support CAN FD, and how many channels are available?
Yes, the R7FA6M5AH2CBG supports CAN with Flexible Data-rate (CAN FD) on two independent channels, each compliant with ISO 11898-1. Each channel provides 16 transmit buffers and 16 receive buffers, enabling concurrent high-bandwidth communication on separate CAN FD networks. This capability is confirmed in the R01DS0366EJ0150 datasheet Section 1.4 and Table 1.14, distinguishing it from the 'B' variant which supports only Classical CAN.
What security features does the R7FA6M5AH2CBG include beyond Arm TrustZone?
Beyond Arm TrustZone, the R7FA6M5AH2CBG integrates the Secure Crypto Engine 9 (SCE9) with hardware accelerators for AES-128/256, RSA-2048, ECC-P256, DSA, SHA224/256, and GHASH. It also includes tamper detection via dedicated pins, power analysis resistance, 128-bit unique ID, and device lifecycle management. These features are documented in Section 1.1 and Table 1.1 under "Security and Encryption" in the R01DS0366EJ0150 datasheet.
What package type and pin count does the R7FA6M5AH2CBG use?
The R7FA6M5AH2CBG uses a 176-pin Fine-Pitch Ball Grid Array (FBGA) package with part code PLBG0176GF-A, measuring 7 mm × 7 mm with 0.5 mm ball pitch. This package supports 132 general-purpose I/O pins, 17 of which are 5-V tolerant, and includes dedicated balls for VCC, VSS, VBATT, and high-speed interfaces including Ethernet RMII and USB HS. Package details are specified in Table 1.13 and Figure 1.2 of the R01DS0366EJ0150 datasheet.
Is the R7FA6M5AH2CBG compatible with Renesas' Flexible Software Package (FSP)?
Yes, the R7FA6M5AH2CBG is fully supported by Renesas' Flexible Software Package (FSP) v4.x and later, including drivers for all integrated peripherals-Ethernet MAC, USB HS/FS, dual CAN FD, SCE9 crypto APIs, TrustZone configuration, and secure boot. FSP provides certified middleware stacks such as AWS IoT Core SDK, Azure RTOS, and FreeRTOS with pre-integrated security services tailored for the R7FA6M5AH2CBG's hardware capabilities.
R7FA6M5AH2CBG#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LFBGA
- Series:
- RA6M5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 132
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M5AH2CBG#BC0 FAQ
1.How can I place an order for R7FA6M5AH2CBG#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M5AH2CBG#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M5AH2CBG#BC0 reliable?
The price and inventory of R7FA6M5AH2CBG#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M5AH2CBG#BC0 is usually 5 days.
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5.How can I obtain technical support or documentation for R7FA6M5AH2CBG#BC0?
For technical support, including R7FA6M5AH2CBG#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M5AH2CBG#BC0 requirements.
6.How does Aetrix verify that R7FA6M5AH2CBG#BC0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M5AH2CBG#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5AH2CBG#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M5AH2CBG#BC0?
All R7FA6M5AH2CBG#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5AH2CBG#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M5AH2CBG#BC0 part is unused and in its original packaging.
Return procedure for R7FA6M5AH2CBG#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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