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Renesas R7FA6M5AH3CBM#BC0
- Part No.:
- R7FA6M5AH3CBM#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LFBGA
- Datasheet:
-
R7FA6M5AH3CBM#BC0.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 2M/512K
- Quantity:
- Payment:
- Shipping:
Inventory:2,080
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Product details
Overview
R7FA6M5AH3CBM#BC0 from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1 MB dual-bank code flash with background/swap operation, 8 KB data flash, 256 KB SRAM with parity/ECC, integrated Ethernet MAC, USB 2.0 Full-Speed, SDHI, QSPI/OSPI, dual CAN, and Secure Crypto Engine (SCE9) with TrustZone for secure embedded applications in industrial gateways and connected edge devices.
For engineers reviewing the R7FA6M5AH3CBM#BC0 datasheet, R7FA6M5AH3CBM#BC0 pinout, R7FA6M5AH3CBM#BC0 application, or R7FA6M5AH3CBM#BC0 equivalent, this page delivers verified technical context, package mapping, real-world use cases, and validated alternative options aligned with industrial temperature (-40°C to +105°C), BGA144 packaging, and RA6M4 group functional compatibility.
Technical Context
The R7FA6M5AH3CBM#BC0 implements Armv8-M architecture with TrustZone security extension, supporting secure/non-secure execution environments via dual MPU instances (8 regions each) and dedicated SysTick timers. Its memory subsystem includes dual-bank flash enabling seamless firmware updates without runtime interruption and ECC-protected SRAM for fault-tolerant operation in safety-critical systems.
Connectivity integrates hardware-accelerated peripherals: Ethernet MAC with DMA coupling for zero-CPU packet handling, dual CAN 2.0B controllers with 32 configurable mailboxes, QSPI/OSPI interfaces for external XIP-capable memory, and USBFS with internal transceiver supporting host/device roles and 10-pipe endpoint management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M33 @ 200 MHz max - enables real-time deterministic execution with TrustZone isolation for secure boot and firmware updates. |
| Memory | 1 MB dual-bank code flash + 8 KB data flash + 256 KB SRAM (parity/ECC) - supports background programming, SWAP operations, and error-resilient data storage. |
| Security | Secure Crypto Engine 9 (AES/RSA/ECC/SHA256) + Arm TrustZone - provides hardware-accelerated cryptography, tamper detection, and lifecycle-managed secure element functionality. |
| Connectivity | Ethernet MAC/EDMAC, USB 2.0 FS, SDHI, QSPI, OSPI, 2×CAN, 10×SCI, 2×I²C, 2×SPI, SSIE - enables full-stack connectivity for industrial IoT edge nodes. |
| Analog & Timers | 2×12-bit ADC (5 Msps interleaved), 2×12-bit DAC, TSN, 4×GPT32, 6×GPT16, 6×AGT - supports motor control, sensor fusion, and precise timing in closed-loop systems. |
| Package & Temp | 144-pin FBGA (7 mm × 7 mm, 0.50 mm pitch), -40°C to +105°C - qualified for extended-temperature industrial and automotive under-hood applications. |
Pinout & Package
Package: 144-pin Fine-Pitch Ball Grid Array (FBGA), 7 mm × 7 mm, 0.50 mm ball pitch, Pb-free Sn terminal finish. Designed for high-density PCB layouts with thermal and signal integrity optimization for industrial-grade reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated power/ground pairs per I/O bank; decoupling required with 0.1 µF capacitors placed adjacent to pins for noise suppression. |
| XTAL / EXTAL | Main clock oscillator interface | Supports 8–24 MHz crystal; enables precise timing for Ethernet, USB, and real-time control loops requiring sub-100 ppm accuracy. |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar mode, battery-backed timekeeping, and low-power wake-up events. |
| ETH_RXD[0:3] / ETH_TXD[0:3] | Ethernet PHY interface | RMII-compliant 4-bit receive/transmit data bus; requires external PHY with 50 Ω impedance matching and AC coupling. |
| USB_DP / USB_DM | USB 2.0 Full-Speed differential pair | On-chip transceiver eliminates need for external PHY; supports plug-and-play device/host enumeration with internal pull-ups. |
| QSPI_IO[0:3] / OSPI_IO[0:7] | Quad/Octa SPI data lines | Enables direct XIP execution from external flash; OSPI supports OctaFlash/OctaRAM with up to 200 MHz clock for high-bandwidth firmware/data access. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP | Enables atomic firmware updates: new image written to inactive bank while active bank continues execution; SWAP command triggers instant bank switch with no reset. |
| TrustZone + SCE9 co-processing | Hardware-enforced secure world isolates cryptographic key storage, secure boot verification, and tamper-resistant key injection without software overhead. |
| Integrated Ethernet MAC + EDMAC | Zero-CPU packet forwarding: DMA transfers frames directly between PHY and SRAM buffers; supports IEEE 1588 PTP timestamping for synchronized industrial networks. |
| 10-channel SCI with FIFO & Manchester | Full-duplex UART/ACIA with 16-byte FIFO per channel; Manchester encoding on SCI3/SCI4 enables robust RS-485 communication in noisy factory environments. |
| CTSU with 20-channel support | Capacitive touch sensing unit with built-in noise cancellation algorithms; supports up to 20 electrodes for HMI panels without external RC networks or calibration firmware. |
Applications
| Industrial Ethernet Gateway | Secure Edge Node Controller |
|---|---|
|
Use Scenario: Aggregating Modbus TCP, CANopen, and PROFINET fieldbus data into unified MQTT/OPC UA streams for cloud telemetry. IC Role / Device Role / Timing Role: Central protocol translation engine with real-time scheduling, Ethernet MAC offload, and deterministic CAN message filtering. Use Value: Dual-bank flash enables remote firmware patching during operational hours; TrustZone isolates protocol stacks from untrusted cloud agents. |
Use Scenario: Local AI inference at the edge using TinyML models deployed to SRAM, with encrypted sensor data ingestion and OTA update validation. IC Role / Device Role / Timing Role: Secure inference host with SCE9-accelerated model signature verification and hardware-secured key storage for model decryption. Use Value: 256 KB ECC SRAM ensures reliable inference buffer integrity; OSPI interface loads models directly from external OctaFlash at >160 MB/s bandwidth. |
| Automotive Body Control Module | Smart Energy Meter Hub |
|
Use Scenario: Managing door locks, lighting, HVAC, and battery monitoring in 12 V vehicle architectures with CAN FD gateway capability. IC Role / Device Role / Timing Role: CAN controller with 32-mailbox FIFO and hardware message filtering; AGT timers manage PWM dimming and wake-on-CAN events. Use Value: -40°C to +105°C rating meets AEC-Q100 Grade 2 requirements; VBATT pin sustains RTC and backup RAM during ignition-off periods. |
Use Scenario: Multi-tariff electricity meter with PLC/G3-PLC backhaul, tamper detection, and secure firmware updates over HAN. IC Role / Device Role / Timing Role: Secure crypto engine performs AES-128 encryption of consumption logs; TSN + ADC12 enable precise voltage/current sampling at 5 Msps. Use Value: Tamper pins detect enclosure intrusion; SCE9's GHASH acceleration validates firmware signatures in <5 ms, meeting DLMS/COSEM security mandates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M4AF3CBM | Same RA6M4 family, identical 200 MHz Cortex-M33 core, 1 MB flash, 256 KB SRAM, but lacks OSPI interface and has reduced QSPI pin count (4 vs. 8 IO lines). | Targeted at cost-optimized industrial HMI where external OctaFlash is unnecessary; retains full Ethernet, USB, CAN, and SCE9 capabilities. | Select when OSPI bandwidth is not required and BGA144 footprint compatibility is critical; verify QSPI peripheral pin mapping against layout. |
| STM32H743VI | Arm Cortex-M7 @ 480 MHz, 2 MB flash, 1 MB RAM, no integrated Ethernet MAC or SCE9; requires external PHY and crypto co-processor for equivalent security. | Suitable for compute-intensive DSP/audio tasks; lacks native TrustZone+crypto engine, demanding external secure element for firmware signing. | Choose only if higher CPU throughput outweighs added BOM cost and design complexity of external PHY/crypto ICs; no pin compatibility. |
Compared with R7FA6M5AH3CBM#BC0, R7FA6M4AF3CBM offers identical security and connectivity except OSPI, making it a lower-cost drop-in for non-XIP flash designs; STM32H743VI trades integrated peripherals for raw performance but increases system-level security and Ethernet implementation effort.
Availability
R7FA6M5AH3CBM#BC0 is available at Aetrix Electronics and suitable for industrial gateways, secure edge controllers, automotive body electronics, and smart energy metering requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for R7FA6M5AH3CBM#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RA6M4 group - including R7FA6M5AH3CBM#BC0 - was designed for secure, connected industrial edge devices requiring integrated Ethernet, USB, CAN, advanced analog, and hardware-enforced security without external co-processors.
FAQ
What is the maximum operating frequency of the R7FA6M5AH3CBM#BC0?
The R7FA6M5AH3CBM#BC0 operates at a maximum frequency of 200 MHz using its Arm Cortex-M33 core. This speed is achieved with the on-chip PLL configured from the main clock oscillator (8–24 MHz crystal) or high-speed on-chip oscillator (HOCO). The core maintains full performance across its specified industrial temperature range (-40°C to +105°C), with voltage regulation maintained between 2.7 V and 3.6 V.
Does the R7FA6M5AH3CBM#BC0 support Ethernet connectivity out of the box?
Yes, the R7FA6M5AH3CBM#BC0 integrates a full IEEE 802.3-compliant Ethernet MAC controller (ETHERC) coupled with an Ethernet DMA controller (EDMAC). It supports RMII interface and requires only an external PHY IC and magnetics. The MAC includes hardware timestamping, multicast filtering, and zero-copy packet handling - no external Ethernet controller or bridge IC is needed for basic L2/L3 stack implementation.
How does the R7FA6M5AH3CBM#BC0 implement secure firmware updates?
The R7FA6M5AH3CBM#BC0 supports secure firmware updates via dual-bank flash with SWAP operation and TrustZone-protected boot ROM. Firmware images are validated using SCE9-accelerated SHA256 and RSA-2048 signatures before being written to the inactive bank. Upon successful verification, the SWAP command atomically switches execution to the updated bank - all within the secure world, preventing rollback or unsigned code execution.
What package type and pin count does the R7FA6M5AH3CBM#BC0 use?
The R7FA6M5AH3CBM#BC0 uses a 144-pin Fine-Pitch Ball Grid Array (FBGA) package measuring 7 mm × 7 mm with 0.50 mm ball pitch (package code BM). It provides 109 general-purpose I/O pins, 21 of which are 5-V tolerant, and includes dedicated pins for Ethernet RMII, USB DP/DM, QSPI/OSPI, CAN, and debug interfaces (SWD/SWO).
Is the R7FA6M5AH3CBM#BC0 pin-compatible with other RA6M4 variants?
Yes, the R7FA6M5AH3CBM#BC0 shares identical pinout and package dimensions with other RA6M4 devices in the 144-pin FBGA (BM) variant, including R7FA6M4AF3CBM and R7FA6M4AE3CBM. All share the same signal mapping, power/ground distribution, and peripheral pin assignments - enabling hardware reuse across flash size and feature-set variants within the RA6M4 family.
R7FA6M5AH3CBM#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LFBGA
- Series:
- RA6M5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 109
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 25x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M5AH3CBM#BC0 FAQ
1.How can I place an order for R7FA6M5AH3CBM#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M5AH3CBM#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M5AH3CBM#BC0 reliable?
The price and inventory of R7FA6M5AH3CBM#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M5AH3CBM#BC0 is usually 5 days.
3.What payment methods are accepted for R7FA6M5AH3CBM#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M5AH3CBM#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M5AH3CBM#BC0?
R7FA6M5AH3CBM#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M5AH3CBM#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M5AH3CBM#BC0?
For technical support, including R7FA6M5AH3CBM#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M5AH3CBM#BC0 requirements.
6.How does Aetrix verify that R7FA6M5AH3CBM#BC0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M5AH3CBM#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5AH3CBM#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M5AH3CBM#BC0?
All R7FA6M5AH3CBM#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5AH3CBM#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M5AH3CBM#BC0 part is unused and in its original packaging.
Return procedure for R7FA6M5AH3CBM#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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