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Renesas R7FA6M5BF2CBG#AC0

Part No.:
R7FA6M5BF2CBG#AC0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
176-LFBGA
Datasheet:
AetrixR7FA6M5BF2CBG#AC0.pdf
Description:
IC MCU 32BIT 1MB FLASH 176LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:200

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Product details

Overview

R7FA6M5BF2CBG from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1 MB code flash, 8 KB data flash, 512 KB SRAM with parity/ECC, dual CAN FD controllers, Ethernet MAC, USB 2.0 HS/FS, QSPI/OSPI, and integrated Secure Crypto Engine (SCE9) with TrustZone for secure embedded applications in industrial gateways and connected edge devices.

For engineers reviewing the R7FA6M5BF2CBG datasheet, R7FA6M5BF2CBG pinout, R7FA6M5BF2CBG application, or R7FA6M5BF2CBG equivalent, key selection considerations include its -40°C to +85°C temperature grade, 176-pin FBGA package (PLBG0176GF-A), 1 MB flash capacity (vs. 2 MB in AH/H variants), CAN FD support (B-series), and full peripheral integration including SDHI, SSIE, CEC, and CTSU.

Technical Context

The R7FA6M5BF2CBG implements Armv8-M architecture with TrustZone security extension, supporting secure/non-secure execution environments via dual MPU instances (8 regions each) and hardware-isolated memory regions for flash, SRAM, and peripherals. Its SCE9 accelerator offloads AES, RSA, ECC, SHA256, and GHASH operations while enabling tamper detection and power analysis resistance.

It integrates dual-bank flash with background operation and SWAP capability for robust firmware updates, alongside advanced timing resources: two 12-bit ADCs (5 Msps interleaved), two 12-bit DACs, six AGT timers, four GPT32 channels, and RTC with calendar mode and VBATT backup - all coordinated via Event Link Controller (ELC) for CPU-free peripheral chaining.

Key Specifications

ParameterValue and Actual Design Meaning
CoreArm Cortex-M33 @ 200 MHz max; supports TrustZone and PMSAv8 memory protection
Memory1 MB code flash (dual-bank, background/SWAP), 8 KB data flash (100k P/E cycles), 512 KB SRAM with parity/ECC
ConnectivityDual CAN FD (ISO 11898-1), Ethernet MAC (RMII), USB 2.0 HS/FS, QSPI/OSPI, SDHI, 10× SCI, 3× I²C, 2× SPI, CEC, SSIE
AnalogTwo 12-bit ADCs (13/16 ch, 5 Msps interleaved), two 12-bit DACs, on-die temperature sensor (TSN)
SecuritySecure Crypto Engine 9 (AES/RSA/ECC/SHA256/GHASH), 128-bit unique ID, tamper pins, lifecycle management
Package & Temp176-pin FBGA (7 mm × 7 mm, 0.5 mm pitch), -40°C to +85°C operating range

Pinout & Package

Package: 176-pin Fine-Pitch Ball Grid Array (FBGA), PLBG0176GF-A footprint (7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant Sn-only terminal finish.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower supply / GroundDedicated analog/digital power and ground pins with local 0.1 µF decoupling; VCL/VCL0 for internal LDO stabilization
XTAL / EXTALMain clock oscillator interfaceSupports 8–24 MHz crystal or external clock input for system timing reference
XCIN / XCOUTSub-clock oscillator interface32.768 kHz crystal connection for RTC and low-power timing
VBATTBattery backup supplyEnables RTC, SOSC, and backup memory retention during main power loss
RESReset inputActive-low asynchronous reset pin; initiates cold start and system recovery sequence
MDMode controlConfigures single-chip or SCI/USB boot mode at power-on; must remain stable during reset release
SWDIO / SWCLKDebug interface2-pin Serial Wire Debug (SWD) for programming, trace, and real-time debugging
ETH_MDC / ETH_MDIOEthernet managementIEEE 802.3-compliant MDIO/MDC interface for PHY configuration and status polling
ETH_TXD0–1 / ETH_RXD0–1Ethernet dataRMII-compliant 2-bit transmit/receive data lines; requires external PHY for physical layer
CANFD0_TX / CANFD0_RXCAN FD channel 0Differential signaling pair for ISO 11898-1 compliant CAN FD communication up to 5 Mbps
USB_VBUS / USB_DP / USB_DMUSB 2.0 HS/FS interfaceIntegrated transceiver supports host/device roles; VBUS sensing enables OTG functionality
QSPI_IO0–3 / OSPI_IO0–7Quad/Octa SPI interfaceDirect memory-mapped external flash access; OSPI supports OctaFlash/OctaRAM with XIP capability

Key Features

FeatureDesign Value
Dual-bank flash with SWAPEnables seamless firmware updates without application interruption; background operation allows concurrent read/write
Secure Crypto Engine 9Hardware-accelerated cryptographic primitives eliminate software overhead and protect keys in tamper-resistant storage
Event Link Controller (ELC)Permits direct peripheral-to-peripheral triggering (e.g., ADC conversion → DMA transfer) without CPU involvement or interrupt latency
Capacitive Touch Sensing Unit (CTSU)15-channel capacitive sensing with noise immunity; supports slider, wheel, and proximity detection without external components
Low Power Asynchronous Timers (AGT)Six independent 16-bit timers operable in deep sleep modes; enable wake-up on external events with sub-µA current draw

Applications

Industrial GatewaySecure Edge Node

Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT brokers over cellular/Wi-Fi.

IC Role / Device Role / Timing Role: Central application processor managing dual CAN FD buses, Ethernet backhaul, USB device-mode configuration, and secure TLS handshake via SCE9.

Use Value: Integrated dual CAN FD + Ethernet + USB eliminates external bridge ICs; TrustZone isolates secure boot and key storage from runtime firmware.

Use Scenario: Tamper-evident asset tracker with GPS, motion sensing, and encrypted log storage.

IC Role / Device Role / Timing Role: Main controller executing secure firmware, sampling accelerometer/temperature via ADC, logging to QSPI flash, and transmitting via LTE modem over UART.

Use Value: On-chip 1 MB flash stores firmware + encrypted logs; SCE9 performs AES-GCM encryption; AGT timers enable ultra-low-power motion wake-up.

Human-Machine InterfaceMedical Data Logger

Use Scenario: Touch-enabled patient monitor with display, audio alerts, and wired connectivity.

IC Role / Device Role / Timing Role: HMI processor driving capacitive touch panel (CTSU), generating audio tones via SSIE, and communicating with backend via USB or Ethernet.

Use Value: CTSU supports 15-button touch interface with noise rejection; SSIE delivers 50 MHz audio clock for high-fidelity tone generation.

Use Scenario: Battery-powered ECG recorder capturing analog signals, performing real-time filtering, and storing results securely.

IC Role / Device Role / Timing Role: Signal acquisition controller using dual 12-bit ADCs (5 Msps interleaved), processing with FPU, and writing encrypted data to internal SRAM and QSPI.

Use Value: Simultaneous high-speed ADC sampling across 26 channels enables multi-lead ECG capture; ECC-protected SRAM ensures data integrity during power brownouts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R7FA6M5BH2CBGSame 176-pin FBGA package and -40°C to +85°C rating, but with 2 MB code flash and identical peripheral setRequired where firmware image size exceeds 1 MB or future-proofing for feature expansion is neededSelect R7FA6M5BH2CBG when larger code space is required without changing PCB layout or thermal design
R7FA6M5BF3CFCSame 1 MB flash and B-series CAN FD feature set, but in 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch) and rated for -40°C to +105°CSuitable for extended-temperature industrial environments where FBGA rework is undesirableChoose R7FA6M5BF3CFC for higher ambient temperature operation or when LQFP assembly infrastructure is preferred

Compared with R7FA6M5BF2CBG, R7FA6M5BH2CBG provides double the code flash for complex protocol stacks or OTA update partitions, while R7FA6M5BF3CFC trades FBGA density for wider temperature tolerance and through-hole-compatible packaging - both retain identical security, analog, and connectivity capabilities.

Availability

R7FA6M5BF2CBG is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, human-machine interfaces, and medical data loggers requiring stable component supply, long-term lifecycle assurance, and consistent sourcing from authorized channels.

Supply support for R7FA6M5BF2CBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications, with expertise in microcontrollers, analog, power, and SoC technologies.

The RA6M5 Group, including R7FA6M5BF2CBG, is designed for secure, high-performance edge computing in industrial automation and connected devices - combining Arm TrustZone, cryptographic acceleration, rich connectivity, and functional safety readiness.

FAQ

What is the maximum operating frequency of the R7FA6M5BF2CBG?

The R7FA6M5BF2CBG features an Arm Cortex-M33 core with a maximum operating frequency of 200 MHz. This clock speed is achieved using the on-chip PLL driven by the main clock oscillator (MOSC) or high-speed on-chip oscillator (HOCO). The R7FA6M5BF2CBG maintains this performance across its full -40°C to +85°C operating temperature range with appropriate voltage regulation (VCC = 2.7–3.6 V).

Does the R7FA6M5BF2CBG support CAN FD, and how many channels are available?

Yes, the R7FA6M5BF2CBG supports CAN with Flexible Data-rate (CAN FD) as indicated by the "B" in its part number suffix. It integrates two independent CAN FD controllers compliant with ISO 11898-1, each supporting classical CAN and CAN FD frames up to 5 Mbps. Each channel provides 16 transmit and 16 receive buffers, enabling robust multi-node communication in automotive and industrial networks.

What type of package does the R7FA6M5BF2CBG use, and what are its key mechanical dimensions?

The R7FA6M5BF2CBG uses a 176-pin Fine-Pitch Ball Grid Array (FBGA) package with designation PLBG0176GF-A. Its mechanical dimensions are 7 mm × 7 mm with a 0.5 mm ball pitch. The package is RoHS-compliant with Sn-only (tin) terminal finish and supports automated surface-mount assembly with standard reflow profiles for lead-free processes.

How much on-chip memory does the R7FA6M5BF2CBG include, and what types are available?

The R7FA6M5BF2CBG includes 1 MB of code flash memory (dual-bank with background operation and SWAP capability), 8 KB of data flash memory rated for 100,000 program/erase cycles, and 512 KB of on-chip SRAM with configurable parity or ECC protection. Additionally, it provides 1 KB of standby SRAM powered by VBATT for RTC and critical state retention during power loss.

What security features are integrated into the R7FA6M5BF2CBG?

The R7FA6M5BF2CBG integrates Renesas' Secure Crypto Engine 9 (SCE9) with hardware acceleration for AES, RSA, ECC, DSA, SHA224, SHA256, and GHASH. It also includes Arm TrustZone for hardware-enforced secure/non-secure world separation, tamper detection circuitry, dedicated tamper pins, secure key management, and device lifecycle management - all coordinated to deliver secure element-level functionality without external components.

R7FA6M5BF2CBG#AC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
176-LFBGA
Series:
RA6M5
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
132
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R7FA6M5BF2CBG#AC0 FAQ

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Please submit a Request for Quotation (RFQ) for R7FA6M5BF2CBG#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of R7FA6M5BF2CBG#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M5BF2CBG#AC0 is usually 5 days.

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5.How can I obtain technical support or documentation for R7FA6M5BF2CBG#AC0?

For technical support, including R7FA6M5BF2CBG#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M5BF2CBG#AC0 requirements.

6.How does Aetrix verify that R7FA6M5BF2CBG#AC0 is sourced from the original manufacturer or authorized distributors?

All R7FA6M5BF2CBG#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5BF2CBG#AC0 meets industry standards.

7.What is the process for return or replacement of R7FA6M5BF2CBG#AC0?

All R7FA6M5BF2CBG#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5BF2CBG#AC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA6M5BF2CBG#AC0 part is unused and in its original packaging.

Return procedure for R7FA6M5BF2CBG#AC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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