Renesas R7FA6M5BF2CBG#AC0
- Part No.:
- R7FA6M5BF2CBG#AC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LFBGA
- Datasheet:
-
R7FA6M5BF2CBG#AC0.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 176LFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:200
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7FA6M5BF2CBG from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1 MB code flash, 8 KB data flash, 512 KB SRAM with parity/ECC, dual CAN FD controllers, Ethernet MAC, USB 2.0 HS/FS, QSPI/OSPI, and integrated Secure Crypto Engine (SCE9) with TrustZone for secure embedded applications in industrial gateways and connected edge devices.
For engineers reviewing the R7FA6M5BF2CBG datasheet, R7FA6M5BF2CBG pinout, R7FA6M5BF2CBG application, or R7FA6M5BF2CBG equivalent, key selection considerations include its -40°C to +85°C temperature grade, 176-pin FBGA package (PLBG0176GF-A), 1 MB flash capacity (vs. 2 MB in AH/H variants), CAN FD support (B-series), and full peripheral integration including SDHI, SSIE, CEC, and CTSU.
Technical Context
The R7FA6M5BF2CBG implements Armv8-M architecture with TrustZone security extension, supporting secure/non-secure execution environments via dual MPU instances (8 regions each) and hardware-isolated memory regions for flash, SRAM, and peripherals. Its SCE9 accelerator offloads AES, RSA, ECC, SHA256, and GHASH operations while enabling tamper detection and power analysis resistance.
It integrates dual-bank flash with background operation and SWAP capability for robust firmware updates, alongside advanced timing resources: two 12-bit ADCs (5 Msps interleaved), two 12-bit DACs, six AGT timers, four GPT32 channels, and RTC with calendar mode and VBATT backup - all coordinated via Event Link Controller (ELC) for CPU-free peripheral chaining.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M33 @ 200 MHz max; supports TrustZone and PMSAv8 memory protection |
| Memory | 1 MB code flash (dual-bank, background/SWAP), 8 KB data flash (100k P/E cycles), 512 KB SRAM with parity/ECC |
| Connectivity | Dual CAN FD (ISO 11898-1), Ethernet MAC (RMII), USB 2.0 HS/FS, QSPI/OSPI, SDHI, 10× SCI, 3× I²C, 2× SPI, CEC, SSIE |
| Analog | Two 12-bit ADCs (13/16 ch, 5 Msps interleaved), two 12-bit DACs, on-die temperature sensor (TSN) |
| Security | Secure Crypto Engine 9 (AES/RSA/ECC/SHA256/GHASH), 128-bit unique ID, tamper pins, lifecycle management |
| Package & Temp | 176-pin FBGA (7 mm × 7 mm, 0.5 mm pitch), -40°C to +85°C operating range |
Pinout & Package
Package: 176-pin Fine-Pitch Ball Grid Array (FBGA), PLBG0176GF-A footprint (7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant Sn-only terminal finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated analog/digital power and ground pins with local 0.1 µF decoupling; VCL/VCL0 for internal LDO stabilization |
| XTAL / EXTAL | Main clock oscillator interface | Supports 8–24 MHz crystal or external clock input for system timing reference |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC and low-power timing |
| VBATT | Battery backup supply | Enables RTC, SOSC, and backup memory retention during main power loss |
| RES | Reset input | Active-low asynchronous reset pin; initiates cold start and system recovery sequence |
| MD | Mode control | Configures single-chip or SCI/USB boot mode at power-on; must remain stable during reset release |
| SWDIO / SWCLK | Debug interface | 2-pin Serial Wire Debug (SWD) for programming, trace, and real-time debugging |
| ETH_MDC / ETH_MDIO | Ethernet management | IEEE 802.3-compliant MDIO/MDC interface for PHY configuration and status polling |
| ETH_TXD0–1 / ETH_RXD0–1 | Ethernet data | RMII-compliant 2-bit transmit/receive data lines; requires external PHY for physical layer |
| CANFD0_TX / CANFD0_RX | CAN FD channel 0 | Differential signaling pair for ISO 11898-1 compliant CAN FD communication up to 5 Mbps |
| USB_VBUS / USB_DP / USB_DM | USB 2.0 HS/FS interface | Integrated transceiver supports host/device roles; VBUS sensing enables OTG functionality |
| QSPI_IO0–3 / OSPI_IO0–7 | Quad/Octa SPI interface | Direct memory-mapped external flash access; OSPI supports OctaFlash/OctaRAM with XIP capability |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP | Enables seamless firmware updates without application interruption; background operation allows concurrent read/write |
| Secure Crypto Engine 9 | Hardware-accelerated cryptographic primitives eliminate software overhead and protect keys in tamper-resistant storage |
| Event Link Controller (ELC) | Permits direct peripheral-to-peripheral triggering (e.g., ADC conversion → DMA transfer) without CPU involvement or interrupt latency |
| Capacitive Touch Sensing Unit (CTSU) | 15-channel capacitive sensing with noise immunity; supports slider, wheel, and proximity detection without external components |
| Low Power Asynchronous Timers (AGT) | Six independent 16-bit timers operable in deep sleep modes; enable wake-up on external events with sub-µA current draw |
Applications
| Industrial Gateway | Secure Edge Node |
|---|---|
Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT brokers over cellular/Wi-Fi. IC Role / Device Role / Timing Role: Central application processor managing dual CAN FD buses, Ethernet backhaul, USB device-mode configuration, and secure TLS handshake via SCE9. Use Value: Integrated dual CAN FD + Ethernet + USB eliminates external bridge ICs; TrustZone isolates secure boot and key storage from runtime firmware. | Use Scenario: Tamper-evident asset tracker with GPS, motion sensing, and encrypted log storage. IC Role / Device Role / Timing Role: Main controller executing secure firmware, sampling accelerometer/temperature via ADC, logging to QSPI flash, and transmitting via LTE modem over UART. Use Value: On-chip 1 MB flash stores firmware + encrypted logs; SCE9 performs AES-GCM encryption; AGT timers enable ultra-low-power motion wake-up. |
| Human-Machine Interface | Medical Data Logger |
Use Scenario: Touch-enabled patient monitor with display, audio alerts, and wired connectivity. IC Role / Device Role / Timing Role: HMI processor driving capacitive touch panel (CTSU), generating audio tones via SSIE, and communicating with backend via USB or Ethernet. Use Value: CTSU supports 15-button touch interface with noise rejection; SSIE delivers 50 MHz audio clock for high-fidelity tone generation. | Use Scenario: Battery-powered ECG recorder capturing analog signals, performing real-time filtering, and storing results securely. IC Role / Device Role / Timing Role: Signal acquisition controller using dual 12-bit ADCs (5 Msps interleaved), processing with FPU, and writing encrypted data to internal SRAM and QSPI. Use Value: Simultaneous high-speed ADC sampling across 26 channels enables multi-lead ECG capture; ECC-protected SRAM ensures data integrity during power brownouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M5BH2CBG | Same 176-pin FBGA package and -40°C to +85°C rating, but with 2 MB code flash and identical peripheral set | Required where firmware image size exceeds 1 MB or future-proofing for feature expansion is needed | Select R7FA6M5BH2CBG when larger code space is required without changing PCB layout or thermal design |
| R7FA6M5BF3CFC | Same 1 MB flash and B-series CAN FD feature set, but in 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch) and rated for -40°C to +105°C | Suitable for extended-temperature industrial environments where FBGA rework is undesirable | Choose R7FA6M5BF3CFC for higher ambient temperature operation or when LQFP assembly infrastructure is preferred |
Compared with R7FA6M5BF2CBG, R7FA6M5BH2CBG provides double the code flash for complex protocol stacks or OTA update partitions, while R7FA6M5BF3CFC trades FBGA density for wider temperature tolerance and through-hole-compatible packaging - both retain identical security, analog, and connectivity capabilities.
Availability
R7FA6M5BF2CBG is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, human-machine interfaces, and medical data loggers requiring stable component supply, long-term lifecycle assurance, and consistent sourcing from authorized channels.
Supply support for R7FA6M5BF2CBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications, with expertise in microcontrollers, analog, power, and SoC technologies.
The RA6M5 Group, including R7FA6M5BF2CBG, is designed for secure, high-performance edge computing in industrial automation and connected devices - combining Arm TrustZone, cryptographic acceleration, rich connectivity, and functional safety readiness.
FAQ
What is the maximum operating frequency of the R7FA6M5BF2CBG?
The R7FA6M5BF2CBG features an Arm Cortex-M33 core with a maximum operating frequency of 200 MHz. This clock speed is achieved using the on-chip PLL driven by the main clock oscillator (MOSC) or high-speed on-chip oscillator (HOCO). The R7FA6M5BF2CBG maintains this performance across its full -40°C to +85°C operating temperature range with appropriate voltage regulation (VCC = 2.7–3.6 V).
Does the R7FA6M5BF2CBG support CAN FD, and how many channels are available?
Yes, the R7FA6M5BF2CBG supports CAN with Flexible Data-rate (CAN FD) as indicated by the "B" in its part number suffix. It integrates two independent CAN FD controllers compliant with ISO 11898-1, each supporting classical CAN and CAN FD frames up to 5 Mbps. Each channel provides 16 transmit and 16 receive buffers, enabling robust multi-node communication in automotive and industrial networks.
What type of package does the R7FA6M5BF2CBG use, and what are its key mechanical dimensions?
The R7FA6M5BF2CBG uses a 176-pin Fine-Pitch Ball Grid Array (FBGA) package with designation PLBG0176GF-A. Its mechanical dimensions are 7 mm × 7 mm with a 0.5 mm ball pitch. The package is RoHS-compliant with Sn-only (tin) terminal finish and supports automated surface-mount assembly with standard reflow profiles for lead-free processes.
How much on-chip memory does the R7FA6M5BF2CBG include, and what types are available?
The R7FA6M5BF2CBG includes 1 MB of code flash memory (dual-bank with background operation and SWAP capability), 8 KB of data flash memory rated for 100,000 program/erase cycles, and 512 KB of on-chip SRAM with configurable parity or ECC protection. Additionally, it provides 1 KB of standby SRAM powered by VBATT for RTC and critical state retention during power loss.
What security features are integrated into the R7FA6M5BF2CBG?
The R7FA6M5BF2CBG integrates Renesas' Secure Crypto Engine 9 (SCE9) with hardware acceleration for AES, RSA, ECC, DSA, SHA224, SHA256, and GHASH. It also includes Arm TrustZone for hardware-enforced secure/non-secure world separation, tamper detection circuitry, dedicated tamper pins, secure key management, and device lifecycle management - all coordinated to deliver secure element-level functionality without external components.
R7FA6M5BF2CBG#AC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LFBGA
- Series:
- RA6M5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 132
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b SAR; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M5BF2CBG#AC0 FAQ
1.How can I place an order for R7FA6M5BF2CBG#AC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M5BF2CBG#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M5BF2CBG#AC0 reliable?
The price and inventory of R7FA6M5BF2CBG#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M5BF2CBG#AC0 is usually 5 days.
3.What payment methods are accepted for R7FA6M5BF2CBG#AC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M5BF2CBG#AC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M5BF2CBG#AC0?
R7FA6M5BF2CBG#AC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M5BF2CBG#AC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M5BF2CBG#AC0?
For technical support, including R7FA6M5BF2CBG#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M5BF2CBG#AC0 requirements.
6.How does Aetrix verify that R7FA6M5BF2CBG#AC0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M5BF2CBG#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5BF2CBG#AC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M5BF2CBG#AC0?
All R7FA6M5BF2CBG#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5BF2CBG#AC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M5BF2CBG#AC0 part is unused and in its original packaging.
Return procedure for R7FA6M5BF2CBG#AC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7FA6M5BF2CBG#AC0 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

