Renesas R7FA6M5BF2CBG#BC0
- Part No.:
- R7FA6M5BF2CBG#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LFBGA
- Datasheet:
-
R7FA6M5BF2CBG#BC0.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 1M/512K
- Quantity:
- Payment:

- Shipping:

Inventory:1,943
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Product details
Overview
R7FA6M5BF2CBG from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1 MB code flash, 8 KB data flash, and 512 KB SRAM with parity/ECC. It integrates Ethernet MAC, USB 2.0 High-Speed/Full-Speed, dual CAN FD, QSPI/OSPI, SDHI, and Secure Crypto Engine (AES/RSA/ECC/SHA256) with Arm TrustZone for industrial gateway and secure edge node applications.
For engineers reviewing the R7FA6M5BF2CBG datasheet, R7FA6M5BF2CBG pinout, R7FA6M5BF2CBG application, or R7FA6M5BF2CBG equivalent, key selection criteria include its -40°C to +85°C temperature grade, 176-pin FBGA package, dual CAN FD support, integrated Ethernet MAC with RMII, and hardware-accelerated cryptography for secure boot and firmware updates.
Technical Context
The R7FA6M5BF2CBG implements Armv8-M architecture with TrustZone security extension, supporting secure/non-secure execution environments via dual MPU instances (8 regions each) and configurable memory region attribution. Its system-level integration includes ETHERC/EDMAC for zero-CPU packet handling, DTC and 8-channel DMAC for autonomous data movement, and ELC for peripheral-to-peripheral event chaining without CPU intervention.
Security is enforced through SCE9 crypto accelerators (AES-128/256, RSA-2048/4096, ECC-256/384, SHA224/256), tamper detection on up to three dedicated pins, and lifecycle management for secure provisioning. Clocking combines MOSC/SOSC/HOCO/MOCO/LOCO sources with PLL/PLL2 and CAC for frequency accuracy validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ 200 MHz max; supports TrustZone, dual MPU, and secure/non-secure SysTick timers |
| Memory | 1 MB code flash (dual-bank), 8 KB data flash (100k P/E cycles), 512 KB SRAM with parity/ECC |
| Connectivity | Dual CAN FD (16 TX/RX buffers per channel), Ethernet MAC (RMII only), USB 2.0 HS/FS, QSPI/OSPI, SDHI, 10× SCI, 3× I²C, 2× SPI |
| Analog | Two 12-bit ADCs (5 Msps interleaved, 26 total channels), two 12-bit DACs, on-die temperature sensor |
| Security | SCE9 crypto engine (AES/RSA/ECC/SHA256/GHASH), 128-bit unique ID, tamper pins, TrustZone memory/peripheral isolation |
| Package & Temp | 176-pin FBGA (7 mm × 7 mm, 0.5 mm pitch), -40°C to +85°C operating range |
| Power | 2.7–3.6 V supply; low-power modes including Deep Software Standby with VBATT RTC backup |
Pinout & Package
176-pin Fine-Pitch Ball Grid Array (FBGA) package, PLBG0176GF-A footprint, 7 mm × 7 mm body, 0.5 mm ball pitch, RoHS-compliant Sn (Tin) terminal finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Core logic power (2.7–3.6 V); decoupling required per datasheet layout guidelines |
| VBATT | Battery backup input | Supplies RTC, SOSC, and backup registers during main power loss |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal for precise system clock generation |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar and low-power timing |
| RES | Reset input | Active-low asynchronous reset; internal pull-up; compatible with external reset ICs |
| MD | Mode control | Configures single-chip vs. SCI/USB boot mode at power-on reset |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO bus for PHY configuration and status polling |
| ETH_TXD0–1 / ETH_RXD0–1 / ETH_TX_EN / ETH_CRS_DV | Ethernet physical layer signals | RMII interface pins; require controlled impedance routing and 50 Ω termination |
| CANFD0_TX / CANFD0_RX / CANFD1_TX / CANFD1_RX | CAN FD transceiver interface | Differential signaling pairs; require 120 Ω termination and common-mode choke |
| USB_VBUS / USB_DP / USB_DM | USB 2.0 High-Speed interface | Integrated transceiver; VBUS sensing enables host/device role negotiation |
Key Features
| Feature | Design Value |
|---|---|
| Dual CAN FD with 16 TX/RX buffers per channel | Enables deterministic real-time communication in automotive and industrial networks with payload up to 64 bytes and bit rates up to 5 Mbps |
| Ethernet MAC with RMII and integrated EDMAC | Offloads TCP/IP stack processing by enabling DMA-based frame transfers without CPU involvement |
| Secure Crypto Engine (SCE9) with AES-256/RSA-4096 | Accelerates cryptographic operations for secure boot, encrypted firmware updates, and TLS handshake offload |
| Event Link Controller (ELC) | Allows direct peripheral-to-peripheral triggering (e.g., ADC conversion completion → DMA transfer start) without interrupt latency or CPU overhead |
| Capacitive Touch Sensing Unit (CTSU) | Supports up to 15 touch channels with noise immunity algorithms, eliminating need for external touch controller ICs |
Applications
| Industrial Gateway | Secure Edge Node |
|---|---|
Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT brokers over cellular/Wi-Fi. IC Role / Device Role / Timing Role: Central application processor managing dual CAN FD buses, Ethernet backhaul, and secure TLS tunnel establishment. Use Value: Integrated SCE9 enables hardware-accelerated TLS 1.2/1.3 handshakes and certificate verification, reducing connection setup time by >60% versus software-only stacks. | Use Scenario: Tamper-resistant remote monitoring unit for utility metering with encrypted data logging and OTA firmware updates. IC Role / Device Role / Timing Role: Trusted execution environment hosting secure bootloader, encrypted filesystem, and signed firmware update agent. Use Value: TrustZone-enforced memory isolation prevents unauthorized access to keys stored in secure SRAM regions, meeting IEC 62443-3-3 SL2 requirements. |
| Automotive Diagnostic Tool | Smart Building Controller |
Use Scenario: Handheld OBD-II scanner supporting UDS over CAN FD and DoIP over Ethernet for modern vehicle diagnostics. IC Role / Device Role / Timing Role: Dual-interface protocol handler with real-time CAN FD message filtering and Ethernet packet parsing. Use Value: Hardware timestamping in CAN FD modules ensures sub-microsecond synchronization of diagnostic events across multiple ECUs. | Use Scenario: HVAC and lighting controller interfacing with BACnet MS/TP fieldbus and cloud APIs via Ethernet/Wi-Fi. IC Role / Device Role / Timing Role: Real-time scheduler managing 10× SCI UARTs for legacy device polling and SSIE audio feedback for voice UI. Use Value: GPT32 timers with dead-time insertion enable precise PWM control of variable-speed compressors while maintaining ASHRAE 135 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M5BH2CBG | Same package and temperature grade, but 2 MB code flash and identical peripheral set | Required when firmware image size exceeds 1 MB or dual-bank flash operation is needed for safe OTA updates | Select R7FA6M5BH2CBG if future firmware growth or A/B bank switching is mandated by safety certification (e.g., ISO 26262 ASIL-B) |
| R7FA6M5AF2CBG | Same package and flash size, but supports Classical CAN only (no CAN FD) | Suitable for legacy industrial networks where CAN FD bandwidth and extended payload are unnecessary | Choose R7FA6M5AF2CBG to reduce BOM cost when CAN FD features remain unused and design must meet strict cost targets |
Compared with R7FA6M5BF2CBG, R7FA6M5BH2CBG provides headroom for larger firmware and robust OTA mechanisms, while R7FA6M5AF2CBG sacrifices CAN FD capability for lower unit cost-making the BF2 variant optimal for balanced performance, security, and cost in new CAN FD deployments.
Availability
R7FA6M5BF2CBG is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, automotive diagnostic tools, and smart building controllers requiring stable component supply across multi-year production cycles.
Supply support for R7FA6M5BF2CBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets, with annual revenue exceeding $10 billion.
The RA6M5 Group is designed for secure, high-performance edge computing applications demanding real-time connectivity, hardware-based security, and long-term reliability in harsh environments.
FAQ
What is the maximum operating frequency of the R7FA6M5BF2CBG?
The R7FA6M5BF2CBG operates at a maximum frequency of 200 MHz using its Arm Cortex-M33 core. This speed is achievable with the on-chip PLL driven by the main crystal oscillator (8–24 MHz) or high-speed on-chip oscillator (HOCO). The device maintains full peripheral functionality-including Ethernet MAC, USB HS, and dual CAN FD-at this clock rate, as verified in Renesas' R01DS0366EJ0150 datasheet Section 1.4.
Does the R7FA6M5BF2CBG support Ethernet connectivity, and what interface is used?
Yes, the R7FA6M5BF2CBG integrates an IEEE 802.3-compliant Ethernet MAC controller (ETHERC) with RMII interface support. It does not include a PHY; external RMII PHY (e.g., LAN8720A) is required. The ETHERC connects directly to the Ethernet DMA Controller (EDMAC) for zero-CPU packet transfers, and pinout includes ETH_MDC, ETH_MDIO, ETH_TXD0/1, ETH_RXD0/1, ETH_TX_EN, and ETH_CRS_DV as defined in Table 1.15 of the R7FA6M5BF2CBG datasheet.
What security features are implemented in the R7FA6M5BF2CBG?
The R7FA6M5BF2CBG includes SCE9 hardware crypto acceleration (AES-128/256, RSA-2048/4096, ECC-256/384, SHA224/256), Arm TrustZone for secure/non-secure memory and peripheral partitioning, tamper detection on up to three dedicated pins, and secure key storage with lifecycle management. These features are documented in Sections 1.1 and 1.4 of the R01DS0366EJ0150 datasheet and enable secure boot, encrypted firmware updates, and TLS offload without software-only bottlenecks.
How much SRAM and flash memory does the R7FA6M5BF2CBG have?
The R7FA6M5BF2CBG contains 512 KB of on-chip SRAM with parity/ECC protection and 1 MB of code flash memory with dual-bank capability and background operation. It also includes 8 KB of data flash memory rated for 100,000 program/erase cycles. These values are explicitly listed in Table 1.13 (Product List) and Section 1.1 (Function Outline) of the R01DS0366EJ0150 datasheet revision 1.50.
Which CAN protocol versions does the R7FA6M5BF2CBG support?
The R7FA6M5BF2CBG supports CAN with Flexible Data-rate (CAN FD) compliant with ISO 11898-1, including both classical CAN frames and CAN FD frames with payloads up to 64 bytes and bit rates up to 5 Mbps. This is confirmed by the "B" feature code in its part number (R7FA6M5B...) and detailed in Table 1.14 (Function Comparison) and Section 1.8 of the R01DS0366EJ0150 datasheet.
R7FA6M5BF2CBG#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LFBGA
- Series:
- RA6M5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 132
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M5BF2CBG#BC0 FAQ
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All R7FA6M5BF2CBG#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5BF2CBG#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M5BF2CBG#BC0?
All R7FA6M5BF2CBG#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5BF2CBG#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M5BF2CBG#BC0 part is unused and in its original packaging.
Return procedure for R7FA6M5BF2CBG#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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