Renesas R7FA6M5BF2CBM#BC0

Overview

R7FA6M5BF2CBM#BC0 from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1 MB code flash, 8 KB data flash, and 512 KB SRAM with parity/ECC. It integrates dual CAN FD controllers, USB 2.0 High-Speed and Full-Speed modules, Ethernet MAC, QSPI/OSPI, SDHI, and Secure Crypto Engine (SCE9) with TrustZone for secure embedded applications including industrial gateways and connected HMI systems.

For engineers reviewing the R7FA6M5BF2CBM#BC0 datasheet, R7FA6M5BF2CBM#BC0 pinout, R7FA6M5BF2CBM#BC0 application, or R7FA6M5BF2CBM#BC0 equivalent, key selection criteria include its -40°C to +85°C temperature grade, 144-pin FBGA package (7 mm × 7 mm, 0.5 mm pitch), dual CAN FD support, integrated Ethernet MAC, and SCE9-based hardware security for firmware integrity and key management in resource-constrained edge devices.

Technical Context

The R7FA6M5BF2CBM#BC0 implements Armv8-M architecture with TrustZone-enabled secure/non-secure execution environments, supporting dual-bank flash operation and background programming. Its memory subsystem includes 1 MB code flash with SWAP capability, 8 KB data flash rated for 100,000 P/E cycles, and 512 KB SRAM with configurable parity or ECC protection.

Connectivity is centered on two CAN FD channels (16 TX/RX buffers each), USBHS/USBFS dual-mode controllers with internal transceivers, IEEE 802.3-compliant ETHERC with EDMAC integration, and QSPI/OSPI interfaces for external memory expansion. Security is enforced via SCE9 accelerators (AES/RSA/ECC/SHA256), tamper detection pins, and lifecycle management.

Key Specifications

Pinout & Package

144-pin Fine-Pitch Ball Grid Array (FBGA), 7 mm × 7 mm body, 0.5 mm ball pitch, RoHS-compliant Sn (Tin) terminal finish. Package code BM per Renesas part numbering scheme.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.

Compared with R7FA6M5BF2CBM#BC0, the R7FA6M5BH3CBM#BC0 offers higher flash capacity and extended temperature range but shares identical peripheral set and security features; the R7FA6M5AF2CBG#AC0 trades CAN FD and FBGA density for LQFP manufacturability and classical CAN compatibility-neither is pin-compatible, requiring PCB redesign.

Availability

R7FA6M5BF2CBM#BC0 is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, HMI controllers, and motor drive interfaces requiring stable component supply across long product lifecycles.

Supply support for R7FA6M5BF2CBM#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.

The RA6M5 Group, including R7FA6M5BF2CBM#BC0, is designed for secure, high-performance edge computing with integrated connectivity (CAN FD, ETH, USB), real-time control, and hardware-enforced security for industrial automation and connected devices.

FAQ

What is the maximum operating frequency of the R7FA6M5BF2CBM#BC0?

The R7FA6M5BF2CBM#BC0 operates at a maximum frequency of 200 MHz using its Arm Cortex-M33 core. This speed is achieved with the on-chip PLL driven by the main clock oscillator (8–24 MHz) or high-speed on-chip oscillator (HOCO). The core supports dynamic clock scaling and low-power modes to balance performance and energy efficiency in real-time applications.

Does the R7FA6M5BF2CBM#BC0 support CAN FD, and how many channels are available?

Yes, the R7FA6M5BF2CBM#BC0 supports CAN with Flexible Data-rate (CAN FD) with two independent channels compliant with ISO 11898-1. Each channel provides 16 transmit and 16 receive buffers, enabling high-bandwidth deterministic communication for industrial and automotive applications requiring payloads up to 64 bytes and bit rates up to 5 Mbps.

What security features does the R7FA6M5BF2CBM#BC0 include?

The R7FA6M5BF2CBM#BC0 integrates Secure Crypto Engine 9 (SCE9) with hardware acceleration for AES-128/256, RSA-2048/4096, ECC, and SHA256, plus Arm TrustZone for secure/non-secure memory and peripheral partitioning. It also includes tamper detection pins, secure key management, and device lifecycle controls-enabling secure boot, firmware encryption, and trusted attestation without external security elements.

What package type and pin count does the R7FA6M5BF2CBM#BC0 use?

The R7FA6M5BF2CBM#BC0 uses a 144-pin Fine-Pitch Ball Grid Array (FBGA) package measuring 7 mm × 7 mm with 0.5 mm ball pitch. Per Renesas part numbering, "BM" denotes this FBGA variant. It provides 109 general-purpose I/O pins, 21 of which are 5-V tolerant, along with dedicated power, clock, debug, and peripheral interface balls.

Is the R7FA6M5BF2CBM#BC0 compatible with Renesas' Flexible Software Package (FSP)?

Yes, the R7FA6M5BF2CBM#BC0 is fully supported by Renesas' Flexible Software Package (FSP) v4.x and later. FSP provides HAL drivers, middleware (including USB Host/Device, Ethernet, CAN FD, TLS), and security libraries (SCE9 APIs, TrustZone initialization) validated for this device-enabling rapid development of secure, connected embedded applications with scalable code reuse across the RA6M5 family.