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Renesas R7FA6M5BF3CBM#BC0
- Part No.:
- R7FA6M5BF3CBM#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LFBGA
- Datasheet:
-
R7FA6M5BF3CBM#BC0.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 1M/512K
- Quantity:
- Payment:
- Shipping:
Inventory:2,080
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Product details
Overview
R7FA6M5BF3CBM#BC0 from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1 MB dual-bank code flash with background/swap operation, 8 KB data flash, and 256 KB SRAM with parity/ECC. It integrates Ethernet MAC, USB 2.0 Full-Speed, SDHI, QSPI/OSPI, dual CAN, advanced analog (dual 12-bit ADC/DAC, temperature sensor), and hardware security (SCE9 + Arm TrustZone). It targets industrial gateways requiring secure, real-time connectivity and deterministic control.
For engineers reviewing the R7FA6M5BF3CBM#BC0 datasheet, R7FA6M5BF3CBM#BC0 pinout, R7FA6M5BF3CBM#BC0 application, or R7FA6M5BF3CBM#BC0 equivalent, key selection considerations include its -40°C to +105°C industrial temperature grade, 144-pin BGA (7 mm × 7 mm, 0.50 mm pitch) package, dual CAN 2.0B support, Ethernet MAC with RMII interface, and integrated Secure Crypto Engine for AES/RSA/SHA256 acceleration.
Technical Context
The R7FA6M5BF3CBM#BC0 implements Armv8-M architecture with TrustZone, enabling secure/non-secure execution environments. Its memory subsystem includes dual-bank flash supporting live firmware updates without interruption and ECC-protected SRAM for functional safety compliance.
Connectivity is centered on deterministic real-time interfaces: two CAN controllers compliant with ISO 11898-1, an Ethernet MAC with DMA coupling for zero-CPU packet handling, and USBFS supporting host/device roles with internal transceiver. Analog subsystems feature interleaved 5 Msps ADC sampling and dual DACs for closed-loop control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M33 @ 200 MHz with TrustZone and MPU (8 secure + 8 non-secure regions) |
| Memory | 1 MB dual-bank code flash (background/swap), 8 KB data flash (100k P/E cycles), 256 KB SRAM with parity/ECC |
| Operating Temp | -40°C to +105°C - qualified for extended industrial environments without derating |
| Package | 144-pin FBGA (7 mm × 7 mm, 0.50 mm pitch) - supports high-density PCB layouts and thermal dissipation |
| Security | Secure Crypto Engine 9 (AES-128/256, RSA-2048/4096, ECC, SHA224/256), tamper detection, lifecycle management |
| Connectivity | Ethernet MAC (RMII), USB 2.0 FS (host/device), dual CAN 2.0B, QSPI/OSPI, SDHI, 10× SCI, 2× I²C, 2× SPI, SSIE |
| Analog | Dual 12-bit ADC (5 Msps interleaved, 19-channel input), dual 12-bit DAC, on-die temperature sensor |
Pinout & Package
Package: 144-pin Fine-Pitch Ball Grid Array (FBGA), 7 mm × 7 mm body, 0.50 mm ball pitch, RoHS-compliant Sn (tin) terminations.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated power/ground pairs per quadrant - enables low-noise analog/digital separation and stable core voltage regulation |
| XTAL / EXTAL | Main clock oscillator interface | Supports 8–24 MHz crystal - provides precise timing source for system clock and USB synchronization |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection - enables RTC calendar operation and low-power wake-up during Deep Software Standby |
| ETH_RMII_RXD0–RXD1, ETH_RMII_TXD0–TXD1, ETH_RMII_CRS_DV, ETH_RMII_TX_EN, ETH_RMII_REF_CLK | Ethernet RMII physical layer interface | Direct connection to external PHY - eliminates need for MII-level glue logic and reduces pin count vs. full MII |
| CAN0_TX / CAN0_RX / CAN1_TX / CAN1_RX | Controller Area Network signal pairs | Differential signaling pins - require external CAN transceivers; support concurrent dual-network operation for redundancy or domain isolation |
| USB_DP / USB_DM / VCC_USB / VSS_USB | USB 2.0 Full-Speed transceiver interface | Integrated PHY - no external transceiver needed; VCC_USB isolated for noise immunity in mixed-signal designs |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP operation | Enables seamless over-the-air (OTA) firmware updates without system downtime or external memory |
| Secure Crypto Engine 9 (SCE9) | Hardware-accelerated AES/RSA/ECC/SHA - offloads cryptographic operations from CPU, reducing latency and power in secure boot and TLS |
| Event Link Controller (ELC) | Direct peripheral-to-peripheral triggering - eliminates CPU polling/interrupt overhead for time-critical sequences (e.g., ADC capture → DMA → GPT compare) |
| Capacitive Touch Sensing Unit (CTSU) | 20-channel capacitive sensing with noise immunity - supports robust HMI implementation without external ICs or calibration firmware |
| Realtime Clock with VBATT backup | Calendar mode (2000–2099) + battery-backed operation - maintains accurate time across power cycles for logging and scheduling |
Applications
| Industrial Gateway | Secure Edge Node |
|---|---|
Use Scenario: Aggregating Modbus TCP, CANopen, and fieldbus data into cloud-connected MQTT endpoints with TLS encryption. IC Role / Device Role / Timing Role: Central protocol translator and security enforcer - handles Ethernet/USB/SDHI for upstream comms, dual CAN for downstream device networks, and SCE9 for certificate-based authentication. Use Value: Dual-bank flash allows zero-downtime firmware updates during operational hours; TrustZone isolates secure boot and crypto keys from application firmware. |
Use Scenario: Deploying distributed sensor nodes in hazardous locations requiring tamper detection, encrypted telemetry, and long-term battery-backed logging. IC Role / Device Role / Timing Role: Trusted execution environment - SCE9 manages key injection and secure storage; RTC+VBATT maintains time-stamped logs; AGT timers enable ultra-low-power wake-up intervals. Use Value: Tamper pins detect physical intrusion attempts; ECC SRAM prevents silent data corruption in critical control paths. |
| Motor Control Hub | Human-Machine Interface Terminal |
Use Scenario: Controlling multiple BLDC motors in HVAC or factory automation using field-oriented control (FOC) with current feedback and thermal monitoring. IC Role / Device Role / Timing Role: Real-time motion controller - GPT32 timers generate synchronized 3-phase PWM; ADC12 captures current/voltage at 5 Msps; TSN monitors die temperature for thermal derating. Use Value: Interleaved ADC sampling ensures phase-aligned current measurements; dedicated hall sensor inputs (GTIU/GTIV/GTIW) simplify rotor position sensing. |
Use Scenario: Operating touch-enabled operator panels in manufacturing cells with glove-compatible UI and environmental resilience. IC Role / Device Role / Timing Role: Capacitive touch + display controller - CTSU drives 20 electrodes with noise rejection; SSIE outputs audio alerts; SDHI loads UI assets from eMMC. Use Value: CTSU's self-capacitance measurement tolerates moisture and contaminants; 5-V-tolerant GPIOs interface directly with legacy 5 V peripherals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M4AF3CBM | Same RA6M4 family, identical 1 MB flash, 256 KB SRAM, and -40°C to +105°C rating; differs in pin count (144-pin BGA vs. 144-pin LQFP) and I/O count (109 vs. 109, but different pin mapping) | LQFP package offers easier prototyping and rework; lacks BGA's thermal performance and board density advantages | Select R7FA6M4AF3CBM only if manual soldering or test fixture access is required; verify pin compatibility for existing layout reuse. |
| STM32H743VI | Arm Cortex-M7 @ 480 MHz, 2 MB flash, 1 MB RAM; no integrated Ethernet MAC (requires external PHY + glue logic), no SCE9, no TrustZone-enforced secure boot | Higher raw compute throughput but requires external components for Ethernet and crypto; less mature industrial security certification path | Choose STM32H743VI when maximum DSP performance dominates over integrated security and connectivity; expect added BOM cost and layout complexity. |
Compared with R7FA6M5BF3CBM#BC0, R7FA6M4AF3CBM offers identical core/peripheral functionality in a through-hole-friendly LQFP package, while STM32H743VI trades integrated security and Ethernet for higher clock speed and larger memory - making R7FA6M5BF3CBM#BC0 optimal for secure, space-constrained industrial edge deployments.
Availability
R7FA6M5BF3CBM#BC0 is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, motor control hubs, human-machine interface terminals, and embedded IoT gateways requiring stable component supply across extended product lifecycles.
Supply support for R7FA6M5BF3CBM#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power management solutions for automotive, industrial, and enterprise markets.
The RA6M4 group - including R7FA6M5BF3CBM#BC0 - was designed for secure, real-time industrial edge applications demanding integrated Ethernet, dual CAN, cryptography acceleration, and functional safety-ready memory architecture.
FAQ
What is the package type and pin count of the R7FA6M5BF3CBM#BC0?
The R7FA6M5BF3CBM#BC0 uses a 144-pin Fine-Pitch Ball Grid Array (FBGA) package measuring 7 mm × 7 mm with a 0.50 mm ball pitch. This compact, thermally efficient package supports high-speed signal integrity for Ethernet and USB interfaces while enabling dense PCB layouts typical in industrial gateway designs. The R7FA6M5BF3CBM#BC0 pinout is fully documented in Renesas datasheet R01DS0365EJ0160, section 1.5.
Does the R7FA6M5BF3CBM#BC0 support Ethernet connectivity, and what interface does it use?
Yes, the R7FA6M5BF3CBM#BC0 integrates a full IEEE 802.3-compliant Ethernet MAC controller with DMA coupling (ETHERC/EDMAC), supporting RMII interface only. It requires an external PHY chip but eliminates MII-level routing complexity and pin count. The R7FA6M5BF3CBM#BC0 supports 10/100 Mbps operation with checksum offload and descriptor-based packet handling - enabling deterministic network stack performance in real-time industrial applications.
How does the R7FA6M5BF3CBM#BC0 implement hardware security, and what cryptographic algorithms are accelerated?
The R7FA6M5BF3CBM#BC0 features the Secure Crypto Engine 9 (SCE9), a dedicated hardware accelerator supporting AES-128/256 (ECB/CBC/CTR/GCM), RSA-2048/4096, ECC (NIST P-256/P-384), DSA, and SHA224/SHA256 hash generation. Combined with Arm TrustZone, it enables secure boot, key injection, tamper detection, and lifecycle management - all verified under Renesas' Common Criteria EAL5+ certification. The R7FA6M5BF3CBM#BC0 uses these capabilities to isolate secure firmware execution from application code.
What are the analog capabilities of the R7FA6M5BF3CBM#BC0, particularly regarding ADC performance?
The R7FA6M5BF3CBM#BC0 includes two independent 12-bit successive approximation ADC units (ADC12), each with configurable sampling rates up to 5 Msps in interleaved mode. Unit 0 supports up to 12 analog inputs, Unit 1 up to 10, with three shared channel pins (AN000/AN100, etc.) enabling synchronized dual-channel acquisition. The R7FA6M5BF3CBM#BC0 also integrates a temperature sensor (TSN) and internal reference voltage, both accessible to either ADC unit for calibration and thermal monitoring.
Is the R7FA6M5BF3CBM#BC0 pin-compatible with other RA6M4 variants, and what are the key layout considerations?
No, the R7FA6M5BF3CBM#BC0 is not pin-compatible with LQFP-packaged RA6M4 variants (e.g., R7FA6M4AF3CFB) due to differing package types (BGA vs. LQFP) and ball/pad mapping. While both use 144 terminations, the R7FA6M5BF3CBM#BC0's FBGA requires controlled impedance routing, thermal vias under the exposed pad, and strict decoupling near VCC/VSS balls. Layout must follow Renesas' AN1311 guidelines - especially for ETH_RMII and USB_DP/DM traces - to ensure signal integrity in the R7FA6M5BF3CBM#BC0 design.
R7FA6M5BF3CBM#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LFBGA
- Series:
- RA6M5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 109
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 25x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M5BF3CBM#BC0 FAQ
1.How can I place an order for R7FA6M5BF3CBM#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M5BF3CBM#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M5BF3CBM#BC0 reliable?
The price and inventory of R7FA6M5BF3CBM#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M5BF3CBM#BC0 is usually 5 days.
3.What payment methods are accepted for R7FA6M5BF3CBM#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M5BF3CBM#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M5BF3CBM#BC0?
R7FA6M5BF3CBM#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M5BF3CBM#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M5BF3CBM#BC0?
For technical support, including R7FA6M5BF3CBM#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M5BF3CBM#BC0 requirements.
6.How does Aetrix verify that R7FA6M5BF3CBM#BC0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M5BF3CBM#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5BF3CBM#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M5BF3CBM#BC0?
All R7FA6M5BF3CBM#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5BF3CBM#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M5BF3CBM#BC0 part is unused and in its original packaging.
Return procedure for R7FA6M5BF3CBM#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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