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Renesas R7FA6M5BG2CBG#BC0

Part No.:
R7FA6M5BG2CBG#BC0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
176-LFBGA
Datasheet:
AetrixR7FA6M5BG2CBG#BC0.pdf
Description:
MCU RA6 ARM CM33 200MHZ 1.5M/512
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,676

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Product details

Overview

R7FA6M5BG2CBG from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1.5 MB code flash, 8 KB data flash, 512 KB SRAM with parity/ECC, dual CAN FD, Ethernet MAC, USB 2.0 HS/FS, QSPI/OSPI, and integrated Secure Crypto Engine (SCE9) with TrustZone for secure embedded applications in industrial gateways and connected edge devices.

For engineers reviewing the R7FA6M5BG2CBG datasheet, R7FA6M5BG2CBG pinout, R7FA6M5BG2CBG application, or R7FA6M5BG2CBG equivalent, key selection criteria include its -40°C to +85°C operating range, 176-pin FBGA package, 2 CAN FD channels, hardware-accelerated AES/RSA/ECC, and support for RMII Ethernet PHY interface without external PHY clock buffering.

Technical Context

The R7FA6M5BG2CBG implements Armv8-M architecture with TrustZone security extension, enabling strict isolation between secure and non-secure firmware execution environments. It integrates dual-bank flash for background programming and SWAP operations, plus SCE9 crypto accelerators supporting AES-128/256, RSA-2048/4096, ECC secp256r1/secp384r1, and SHA-224/256.

Its system-level integration includes an Ethernet MAC compliant with IEEE 802.3 (RMII only), USB 2.0 High-Speed device/host controller with internal transceiver, two independent CAN FD controllers (ISO 11898-1), and a 10-channel SCI with UART, SPI, I²C, smart card, and Manchester modes - all accessible via configurable pin multiplexing on 132 GPIOs.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M33 @ 200 MHz max; supports TrustZone, MPU_S/MPU_NS (8 regions each)
Memory1.5 MB code flash (dual-bank), 8 KB data flash (100k P/E cycles), 512 KB SRAM (448 KB parity + 64 KB ECC)
Connectivity2× CAN FD (16 TX/16 RX buffers per channel), Ethernet MAC (RMII only), USB 2.0 HS/FS, QSPI/OSPI, SDHI, 10× SCI, 3× I²C, 2× SPI
Analog2× 12-bit ADC (ADC12): 13+16 ch, 5 Msps interleaved; 2× 12-bit DAC (DAC12); on-die temperature sensor (TSN)
SecuritySecure Crypto Engine 9 (SCE9): AES/RSA/ECC/SHA acceleration, tamper detection, 128-bit unique ID, lifecycle management
Package & Temp176-pin FBGA (7 mm × 7 mm, 0.5 mm pitch), -40°C to +85°C operating range
PowerVCC = 2.7–3.6 V; includes LVD (3 thresholds), RTC with VBATT backup, low-power AGT timers, Deep Software Standby mode

Pinout & Package

176-pin Fine-Pitch Ball Grid Array (FBGA) package, PLBG0176GF-A footprint, 7 mm × 7 mm body, 0.5 mm ball pitch, RoHS-compliant Sn (tin) terminal finish. Compatible with standard reflow profiles for lead-free assembly.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower supply / GroundDedicated power pins with local 0.1 µF decoupling; VCL/VCL0 require external smoothing capacitor for internal LDO stability
VBATTBattery backup inputSupplies RTC, SOSC, and backup SRAM during main power loss; supports calendar mode with leap-year correction
XTAL / EXTALMain crystal oscillator interfaceSupports 8–24 MHz external crystal; EXTAL accepts external clock source for synchronous system startup
XCIN / XCOUTSub-clock oscillator interface32.768 kHz crystal connection for RTC and low-power timing; enables calendar mode with battery backup
RESActive-low reset inputAsynchronous reset assertion; triggers full system initialization including memory protection unit and TrustZone configuration
NMINon-maskable interruptHardware fault or security event trigger; cannot be disabled by software, used for tamper response and critical error handling
SWDIO / SWCLKSerial Wire Debug interface2-pin debug port supporting secure firmware update, real-time trace, and TrustZone-aware debugging sessions
MDMode controlConfigures single-chip vs. SCI/USB boot mode at reset; must remain stable during reset release to avoid undefined behavior

Key Features

FeatureDesign Value
Dual-bank flash with SWAP operationEnables seamless firmware updates without halting real-time operation; supports background programming while executing from alternate bank
Hardware crypto acceleration (SCE9)Offloads AES-128/256 encryption/decryption, RSA-2048/4096 signing/verification, and SHA-224/256 hashing from CPU, reducing latency and power
TrustZone-enabled peripheral attributionEach peripheral (e.g., CAN FD, USBHS, ETHERC) can be assigned secure/non-secure access rights independently, enforcing hardware-enforced isolation
RMII-compliant Ethernet MACDirect interface to RMII PHY without external clock buffer; supports IEEE 802.3 MAC layer frame transmission/reception with DMA-driven packet handling
10-channel SCI with flexible protocolsSingle peripheral supports UART, SPI master/slave, I²C master, smart card (ISO/IEC 7816-3), and Manchester encoding - reducing pin count and BOM cost

Applications

Industrial GatewaySecure Edge Node

Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT over TLS.

IC Role / Device Role / Timing Role: Main application processor managing dual CAN FD buses, Ethernet MAC for LAN uplink, and SCE9 for TLS 1.3 handshake acceleration.

Use Value: Dual-bank flash enables zero-downtime OTA updates; TrustZone isolates secure key storage from application firmware.

Use Scenario: Tamper-resistant sensor aggregator in smart metering with encrypted data logging.

IC Role / Device Role / Timing Role: Secure host controller interfacing ADC12 (metering inputs), CTSU (tamper detection), and SDHI (encrypted log storage).

Use Value: SCE9 performs AES-256-GCM encryption of logs; tamper pins trigger immediate key erasure and non-maskable interrupt.

Medical Data HubAutomated Test Equipment

Use Scenario: Central controller aggregating ECG, SpO₂, and temperature data from multiple analog sensors.

IC Role / Device Role / Timing Role: Real-time data acquisition hub using dual ADC12 units (5 Msps interleaved), USBHS for PC host communication, and RTC with VBATT for timestamping.

Use Value: 512 KB SRAM with ECC ensures data integrity during burst acquisition; USBHS supports 480 Mbps bulk transfers for raw waveform streaming.

Use Scenario: Self-calibrating test fixture controlling precision DAC12 outputs and measuring DUT responses via ADC12.

IC Role / Device Role / Timing Role: Precision timing controller using GPT32 timers for sub-microsecond stimulus generation and AGT timers for low-power measurement windows.

Use Value: GPT32 PWM outputs drive calibrated reference signals; CAC module verifies clock accuracy against external reference for NIST-traceable calibration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance secure MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R7FA6M5BH3CFCSame core/peripherals but 2 MB flash, 176-pin LQFP, -40°C to +105°C ratingHigher temperature grade and larger flash for extended industrial deployments requiring wider thermal margin and firmware headroomSelect when needing extended temperature operation or >1.5 MB firmware space; LQFP simplifies prototyping but increases board area vs. FBGA
R7FA6M5BG3CBMSame flash/SRAM/security features, 144-pin FBGA, -40°C to +105°CSmaller package with identical functionality; reduced I/O count (109 vs. 132) and no external bus interfaceChoose for space-constrained designs where RMII Ethernet and dual CAN FD are retained but external memory expansion is unnecessary

Compared with R7FA6M5BG2CBG, R7FA6M5BH3CFC offers higher temperature tolerance and flash capacity in LQFP packaging, while R7FA6M5BG3CBM delivers identical security and connectivity in a smaller 144-pin FBGA - both retain SCE9, TrustZone, and dual CAN FD but trade off package size, thermal rating, or I/O count.

Availability

R7FA6M5BG2CBG is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, medical data hubs, and automated test equipment requiring stable component supply across long-lifecycle production programs.

Supply support for R7FA6M5BG2CBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.

The RA6M5 Group targets secure, high-performance edge computing with integrated Arm Cortex-M33, hardware crypto, and rich connectivity - designed specifically for industrial automation, building control, and medical devices demanding functional safety and cybersecurity compliance.

FAQ

What is the maximum operating frequency of the R7FA6M5BG2CBG?

The R7FA6M5BG2CBG operates at a maximum frequency of 200 MHz using its Arm Cortex-M33 core. This speed is achievable with the PLL clock source configured from the main oscillator (MOSC) or high-speed on-chip oscillator (HOCO). The device maintains full peripheral functionality-including Ethernet MAC, USB HS, and dual CAN FD-at this frequency, with timing validated across the -40°C to +85°C temperature range specified for the R7FA6M5BG2CBG.

Does the R7FA6M5BG2CBG support TrustZone-based secure boot?

Yes, the R7FA6M5BG2CBG supports TrustZone-based secure boot through hardware-enforced isolation between secure and non-secure worlds. Its Arm Cortex-M33 core implements the Security Extension (Armv8-M), and the Memory Protection Unit (MPU) allows configuration of up to six secure flash regions. Secure boot flow is enabled via option byte settings that lock the initial vector table in secure flash, ensuring only authenticated, signed firmware executes before transitioning to non-secure application code - a capability confirmed in the R7FA6M5BG2CBG datasheet section 1.4 and R01DS0366EJ0150 Rev.1.50.

What package type and pin count does the R7FA6M5BG2CBG use?

The R7FA6M5BG2CBG uses a 176-pin Fine-Pitch Ball Grid Array (FBGA) package with a 7 mm × 7 mm body and 0.5 mm ball pitch (package code PLBG0176GF-A). It provides 132 general-purpose I/O pins, 17 of which are 5-V tolerant, along with dedicated power, clock, debug, and peripheral interface balls. This package is optimized for high-density PCB layouts and thermal performance in industrial applications where the R7FA6M5BG2CBG is deployed.

Can the R7FA6M5BG2CBG interface directly with an RMII Ethernet PHY?

Yes, the R7FA6M5BG2CBG includes an Ethernet MAC (ETHERC) fully compliant with IEEE 802.3 that supports RMII interface mode. It provides all required RMII signals - TX_EN, TXD[1:0], RXD[1:0], CRS_DV, REF_CLK - and supports 50 MHz REF_CLK input from the PHY. No external clock buffer or level shifter is needed, and the MAC connects directly to the Ethernet DMA Controller (EDMAC) for zero-CPU packet handling - a feature explicitly documented for the R7FA6M5BG2CBG in the RA6M5 datasheet section 1.4 and Figure 1.1 block diagram.

What cryptographic algorithms are accelerated by the Secure Crypto Engine (SCE9) in the R7FA6M5BG2CBG?

The Secure Crypto Engine 9 (SCE9) in the R7FA6M5BG2CBG accelerates symmetric algorithms (AES-128/192/256 in ECB/CBC/CTR/GCM modes), asymmetric algorithms (RSA-2048/3072/4096, ECC secp256r1/secp384r1, DSA), and hash functions (SHA-224/256, GHASH). It also provides true random number generation, tamper detection via dedicated pins, and secure key management with hardware-protected storage - all confirmed in the R7FA6M5BG2CBG datasheet section "Security and Encryption" and R01DS0366EJ0150 Rev.1.50 page 1.

R7FA6M5BG2CBG#BC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
176-LFBGA
Series:
RA6M5
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
132
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

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All R7FA6M5BG2CBG#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5BG2CBG#BC0 meets industry standards.

7.What is the process for return or replacement of R7FA6M5BG2CBG#BC0?

All R7FA6M5BG2CBG#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5BG2CBG#BC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA6M5BG2CBG#BC0 part is unused and in its original packaging.

Return procedure for R7FA6M5BG2CBG#BC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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