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Renesas R7FA6M5BG2CBM#BC0
- Part No.:
- R7FA6M5BG2CBM#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LFBGA
- Datasheet:
-
R7FA6M5BG2CBM#BC0.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 1.5M/512
- Quantity:
- Payment:
- Shipping:
Inventory:2,080
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Product details
Overview
R7FA6M5BG2CBM#BC0 from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1.5 MB code flash, 8 KB data flash, 512 KB SRAM with ECC/parity, dual CAN FD controllers, Ethernet MAC, USB 2.0 HS/FS, QSPI/OSPI, and integrated Secure Crypto Engine (SCE9) with TrustZone for secure embedded applications in industrial gateways and connected edge devices.
For engineers reviewing the R7FA6M5BG2CBM#BC0 datasheet, R7FA6M5BG2CBM#BC0 pinout, R7FA6M5BG2CBM#BC0 application, or R7FA6M5BG2CBM#BC0 equivalent, key selection considerations include its -40°C to +85°C temperature grade, 144-pin FBGA package (7 mm × 7 mm, 0.5 mm pitch), dual-bank flash support for seamless firmware updates, hardware-accelerated AES/RSA/ECC, and full peripheral set including SDHI, SSIE, CEC, and capacitive touch sensing (CTSU).
Technical Context
The R7FA6M5BG2CBM#BC0 implements Armv8-M architecture with TrustZone security extension, supporting secure/non-secure execution states via dual MPU instances (8 regions each) and configurable memory region attribution for flash, SRAM, and peripherals. Its clock system integrates PLL/PLL2, HOCO/MOCO/LOCO oscillators, and CAC for real-time frequency accuracy monitoring.
Peripheral integration includes two independent CAN FD controllers (16 TX/RX buffers each), ETHERC/EDMAC with RMII support, USBHS/USBFS with internal transceivers and 10-pipe FIFOs, and dual 12-bit ADC units (13/16 channels, 5 Msps interleaved) with shared analog input pins and on-die temperature sensor interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ 200 MHz max; supports TrustZone, dual MPU, and SysTick timers for secure/non-secure contexts |
| Memory | 1.5 MB code flash (dual-bank, background/SWAP operation), 8 KB data flash (100k P/E cycles), 512 KB SRAM with ECC/parity |
| Connectivity | Dual CAN FD (ISO 11898-1), Ethernet MAC (RMII), USB 2.0 HS/FS, QSPI/OSPI, SDHI, 10× SCI, 3× I²C, 2× SPI, SSIE, CEC |
| Analog | Two 12-bit ADCs (ADC12): 13+16 channels, 5 Msps interleaved; two 12-bit DACs (DAC12); on-die temperature sensor (TSN) |
| Security | Secure Crypto Engine 9 (AES, RSA, ECC, SHA224/256, GHASH), 128-bit unique ID, tamper detection, power analysis resistance |
| Package & Temp | 144-pin FBGA (7 mm × 7 mm, 0.5 mm pitch), -40°C to +85°C operating range, 2.7–3.6 V supply |
Pinout & Package
144-pin Fine-Pitch Ball Grid Array (FBGA) package, 7 mm × 7 mm body, 0.5 mm ball pitch, RoHS-compliant Sn (tin) terminal finish. Pin mapping validated per Renesas PLBG0144KB-A package drawing and datasheet Table 1.15.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated power/ground pairs for core, analog, and I/O domains; decoupling required per datasheet layout guidelines |
| VBATT | Battery backup input | Supplies RTC, SOSC, and backup registers during main power loss; enables calendar retention and wake-up capability |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal; enables precise timing for USB, Ethernet, and high-speed serial interfaces |
| MD / RES | Mode select / Reset input | Configures boot mode (SCI/USB) at power-on; active-low asynchronous reset with glitch filtering |
| TXDn / RXDn (SCI) | UART transmit/receive | 10 independent SCI channels support UART, smart card, Manchester, and simple SPI/I²C modes with FIFO buffering |
| CANFD0_TX / CANFD0_RX | CAN FD channel 0 differential pair | Direct connection to external CAN FD transceiver; supports classical CAN and CAN FD frames up to 5 Mbps |
| ETXD0–3 / ERXD0–3 | Ethernet MAC RMII signals | 4-bit transmit/receive data bus for RMII PHY interface; requires 50 MHz reference clock (REF_CLK) |
| USBHS_DP / USBHS_DM | USB 2.0 High-Speed differential pair | Integrated transceiver supports host/device mode at 480 Mbps; no external PHY required |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP operation | Enables zero-downtime firmware updates by switching active bank while background programming occurs in the inactive bank |
| Hardware crypto acceleration (SCE9) | Offloads AES-128/256, RSA-2048/4096, ECC NIST P-256/P-384, and SHA256 operations from CPU, reducing latency and power |
| TrustZone-enabled peripheral security | Allows individual secure/non-secure attribution per peripheral, enabling secure boot, isolated firmware partitions, and protected key storage |
| Event Link Controller (ELC) | Routes 128+ peripheral event sources directly to 16 target modules without CPU intervention, minimizing latency for time-critical responses |
| Capacitive Touch Sensing Unit (CTSU) | Supports up to 20 touch channels with noise immunity and auto-tuning; eliminates need for external touch controller ICs |
Applications
| Industrial Gateway | Secure Edge Node |
|---|---|
Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT over Ethernet/USB. IC Role / Device Role / Timing Role: Central MCU managing dual CAN FD buses, Ethernet MAC, USB host, and secure TLS stack via SCE9. Use Value: Dual-bank flash enables remote firmware updates without service interruption; TrustZone isolates secure boot and key management from application code. | Use Scenario: Tamper-resistant sensor aggregator in smart metering with battery backup and real-time clock. IC Role / Device Role / Timing Role: Secure data acquisition node using ADC12, TSN, RTC, VBATT, and SCE9 for encrypted data logging. Use Value: On-chip tamper pins and power analysis resistance prevent physical key extraction; 1 KB standby SRAM retains critical state during brownout. |
| Human-Machine Interface | Audio-Enabled IoT Hub |
Use Scenario: Touch-based control panel for HVAC systems with capacitive buttons and sliders. IC Role / Device Role / Timing Role: CTSU-driven HMI processor interfacing with display via SPI/SSIE and controlling relays via GPT PWM outputs. Use Value: Integrated CTSU reduces BOM cost and PCB area versus external touch controllers; AGT timers enable low-power touch polling. | Use Scenario: Voice-controlled home automation hub with audio input/output and local voice processing. IC Role / Device Role / Timing Role: Audio subsystem controller using SSIE (I²S/TDM), DAC12/ADC12, and USBHS for microphone/headphone interface. Use Value: SSIE supports 50 MHz audio clock and 32-stage FIFOs for jitter-free streaming; USBHS enables high-bandwidth firmware/audio updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M5BH2CBM#BC0 | 2 MB code flash (vs. 1.5 MB), same 144-pin FBGA, identical peripherals and security features | Suitable where larger firmware image size or future feature expansion is required without changing PCB layout | Select when firmware growth headroom or dual-bank update flexibility beyond current needs is prioritized |
| R7FA6M5BG3CBM#BC0 | Same 1.5 MB flash and peripherals, but rated for -40°C to +105°C (vs. +85°C) | Required for under-hood automotive or high-temperature industrial enclosures where ambient exceeds 85°C | Choose when extended temperature operation is mandatory and thermal derating of the +85°C part is not acceptable |
Compared with R7FA6M5BG2CBM#BC0, the R7FA6M5BH2CBM#BC0 offers 500 KB more flash for complex protocol stacks or OTA update partitions, while the R7FA6M5BG3CBM#BC0 maintains identical functionality with extended thermal reliability-neither requires PCB redesign due to shared 144-pin FBGA footprint and pin compatibility.
Availability
R7FA6M5BG2CBM#BC0 is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, human-machine interfaces, and audio-enabled IoT hubs requiring stable component supply across multi-year production cycles.
Supply support for R7FA6M5BG2CBM#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor manufacturer headquartered in Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.
The RA6M5 Group, including R7FA6M5BG2CBM#BC0, is designed for secure, high-performance embedded applications demanding real-time connectivity, functional safety readiness, and robust cybersecurity-targeting industrial automation, building control, and edge AI endpoints.
FAQ
What is the maximum operating frequency and core architecture of the R7FA6M5BG2CBM#BC0?
The R7FA6M5BG2CBM#BC0 features an Arm Cortex-M33 core operating at a maximum frequency of 200 MHz. It implements the Armv8-M architecture with Security Extension (TrustZone), supports dual MPU instances (8 secure and 8 non-secure regions), and includes CoreSight ETM-M33 for trace debugging. This architecture enables secure partitioning of firmware and hardware resources for certified secure applications.
Does the R7FA6M5BG2CBM#BC0 support dual-bank flash operation and background programming?
Yes, the R7FA6M5BG2CBM#BC0 supports dual-bank flash operation with background programming and SWAP functionality. Its 1.5 MB code flash is organized into two banks, allowing one bank to execute code while the other is reprogrammed-enabling seamless firmware updates without system interruption. This capability is essential for remote maintenance in deployed industrial equipment.
What security features does the R7FA6M5BG2CBM#BC0 integrate beyond Arm TrustZone?
Beyond Arm TrustZone, the R7FA6M5BG2CBM#BC0 integrates the Secure Crypto Engine 9 (SCE9) with hardware accelerators for AES-128/256, RSA-2048/4096, ECC NIST P-256/P-384, and SHA224/256. It also provides tamper detection pins, power analysis resistance, a 128-bit unique ID, and device lifecycle management-forming a certified secure element foundation compliant with PSA Level 3 and SESIP requirements.
Which communication interfaces are supported by the R7FA6M5BG2CBM#BC0 for industrial networking?
The R7FA6M5BG2CBM#BC0 supports multiple industrial networking interfaces: dual CAN FD controllers (ISO 11898-1), Ethernet MAC with RMII PHY interface, USB 2.0 High-Speed and Full-Speed modules, SDHI for removable storage, and 10-channel Serial Communications Interface (SCI) with UART, smart card, and Manchester modes. These enable robust, multi-protocol connectivity in gateways and PLCs.
What is the package type and pin count of the R7FA6M5BG2CBM#BC0, and is it pin-compatible with other RA6M5 variants?
The R7FA6M5BG2CBM#BC0 uses a 144-pin Fine-Pitch Ball Grid Array (FBGA) package (7 mm × 7 mm, 0.5 mm pitch, PLBG0144KB-A). It is pin-compatible with other RA6M5 devices in the same 144-pin FBGA variant-including R7FA6M5BH2CBM#BC0 and R7FA6M5BG3CBM#BC0-ensuring PCB reuse across flash size and temperature grade changes within the same package family.
R7FA6M5BG2CBM#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LFBGA
- Series:
- RA6M5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 109
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 25x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M5BG2CBM#BC0 FAQ
1.How can I place an order for R7FA6M5BG2CBM#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M5BG2CBM#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M5BG2CBM#BC0 reliable?
The price and inventory of R7FA6M5BG2CBM#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M5BG2CBM#BC0 is usually 5 days.
3.What payment methods are accepted for R7FA6M5BG2CBM#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M5BG2CBM#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M5BG2CBM#BC0?
R7FA6M5BG2CBM#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M5BG2CBM#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M5BG2CBM#BC0?
For technical support, including R7FA6M5BG2CBM#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M5BG2CBM#BC0 requirements.
6.How does Aetrix verify that R7FA6M5BG2CBM#BC0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M5BG2CBM#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5BG2CBM#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M5BG2CBM#BC0?
All R7FA6M5BG2CBM#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5BG2CBM#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M5BG2CBM#BC0 part is unused and in its original packaging.
Return procedure for R7FA6M5BG2CBM#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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