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Renesas R7FA6M5BG3CBM#BC0
- Part No.:
- R7FA6M5BG3CBM#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LFBGA
- Datasheet:
-
R7FA6M5BG3CBM#BC0.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 1.5M/512
- Quantity:
- Payment:
- Shipping:
Inventory:2,080
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Product details
Overview
R7FA6M5BG3CBM#BC0 from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1 MB dual-bank code flash with background SWAP, 8 KB data flash, 256 KB SRAM with ECC/parity, integrated Ethernet MAC, USB 2.0 Full-Speed, SDHI, QSPI/OSPI, dual CAN, and Secure Crypto Engine 9 with TrustZone. It targets industrial gateways, secure IoT edge nodes, and networked HMI systems requiring real-time connectivity and hardware-enforced security.
For engineers reviewing the R7FA6M5BG3CBM#BC0 datasheet, R7FA6M5BG3CBM#BC0 pinout, R7FA6M5BG3CBM#BC0 application, or R7FA6M5BG3CBM#BC0 equivalent, key selection criteria include its -40°C to +105°C extended temperature rating, 144-pin BGA (7 mm × 7 mm, 0.50 mm pitch) package, dual CAN 2.0B support, Ethernet MAC+EDMAC co-processor, and SCE9-accelerated AES/RSA/ECC for secure boot and OTA updates.
Technical Context
The R7FA6M5BG3CBM#BC0 implements Armv8-M architecture with TrustZone, enabling strict isolation between secure firmware (e.g., bootloader, key storage) and non-secure application code. Its dual-bank flash supports seamless firmware updates via background SWAP operation without system interruption.
It integrates dedicated hardware accelerators including SCE9 for symmetric (AES), asymmetric (RSA/ECC), and hash (SHA256/GHASH) operations, alongside a full-featured Ethernet MAC compliant with IEEE 802.3 and RMII interface, coupled with an 8-channel DMAC and DTC for zero-CPU data movement between peripherals and memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ 200 MHz max - enables deterministic real-time execution with TrustZone-based secure/non-secure world separation. |
| Memory | 1 MB dual-bank code flash + 8 KB data flash + 256 KB SRAM (ECC/parity) - supports atomic firmware updates and robust data integrity in harsh environments. |
| Connectivity | Ethernet MAC (RMII), USB 2.0 FS, dual CAN 2.0B, QSPI/OSPI, SDHI, 10× SCI, 2× I²C, 2× SPI - provides native wired networking and multi-protocol peripheral expansion. |
| Analog | 2× 12-bit ADC (5 Msps interleaved), 2× 12-bit DAC, on-die temperature sensor - enables local sensor fusion and analog control without external signal conditioning. |
| Security | Secure Crypto Engine 9 + Arm TrustZone + tamper detection + lifecycle management - delivers certified secure element functionality for FIPS-compliant key provisioning and secure boot. |
| Package & Temp | 144-pin FBGA (7 mm × 7 mm, 0.50 mm pitch), -40°C to +105°C - suitable for convection-cooled industrial control and automotive under-hood applications. |
Pinout & Package
144-pin Fine-Pitch Ball Grid Array (FBGA), 7 mm × 7 mm body, 0.50 mm ball pitch, RoHS-compliant Sn (tin) terminations. Pin mapping validated per Renesas R01DS0365EJ0160 Rev.1.60 datasheet Section 1.5 (Pin Functions) and Table 1.14 (Product List).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dual power domains: core (1.1 V) and I/O (2.7–3.6 V); decoupling required per datasheet layout guidelines. |
| XTAL / EXTAL | Main clock oscillator interface | Supports 8–24 MHz crystal; enables precise timing for Ethernet, USB, and real-time control loops. |
| ETH_RMII_TXD0–1, TX_EN, RXD0–1, CRS_DV | Ethernet RMII physical layer interface | Direct connection to external PHY; no external glue logic needed for 10/100 Mbps operation. |
| USB_DP / USB_DM | Integrated USB 2.0 Full-Speed transceiver I/O | On-chip PHY eliminates need for external USB transceiver; supports device/host mode with 10-pipe endpoint buffer. |
| CRX0/CTX0, CRX1/CTX1 | CAN 2.0B controller channels | Each pair requires external CAN transceiver; supports 32 configurable mailboxes with FIFO and standard/extended ID filtering. |
| QSPI_IO0–3 / OSPI_IO0–7 | Quad/Octa SPI memory interface | Direct boot-from-flash capability; OSPI supports OctaFlash/OctaRAM with XIP (execute-in-place) for deterministic code execution. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP operation | Enables zero-downtime firmware updates: new image written to inactive bank while active bank continues execution. |
| Secure Crypto Engine 9 (SCE9) | Hardware-accelerated AES-128/256, RSA-2048/4096, ECC secp256r1/secp384r1, SHA256 - reduces crypto latency by >10× vs. software-only implementation. |
| TrustZone-enabled memory protection | Configurable secure/non-secure regions across flash (3–6), SRAM (3), and data flash (2) - enforces hardware-rooted separation of trusted services and application code. |
| Ethernet MAC + EDMAC co-processor | Offloads frame reception/transmission, checksum calculation, and DMA transfers - frees CPU for application tasks during sustained 100 Mbps traffic. |
| Capacitive Touch Sensing Unit (CTSU) | 20-channel capacitive sensing with noise immunity - enables robust touch HMI on panels without additional ICs or shielding. |
Applications
| Industrial Gateway | Secure Edge Node |
|---|---|
Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT brokers over cellular/Wi-Fi/Ethernet. IC Role / Device Role / Timing Role: Central protocol stack processor with real-time scheduling, TLS offload via SCE9, and deterministic Ethernet packet handling via EDMAC. Use Value: Eliminates external crypto accelerator and network controller, reducing BOM cost and PCB area while meeting IEC 62443-3-3 SL2 security requirements. | Use Scenario: Tamper-resistant firmware update agent in smart metering infrastructure with remote attestation. IC Role / Device Role / Timing Role: Secure boot loader and OTA update manager leveraging TrustZone-protected flash regions and SCE9-signed image verification. Use Value: Prevents unauthorized firmware modification through hardware-enforced key storage and runtime integrity checks - certified for UL 2900-1 cybersecurity validation. |
| Networked HMI Panel | Automotive Body Control Module |
Use Scenario: Human-machine interface for factory automation with capacitive touch buttons, real-time diagnostics display, and EtherCAT slave interface. IC Role / Device Role / Timing Role: Main application MCU running FreeRTOS, driving CTSU-based touch UI, and managing Ethernet-based diagnostics via ETHERC/EDMAC. Use Value: Integrates touch sensing, display interface, and industrial Ethernet in single chip - avoids separate touch controller and PHY, simplifying EMI design. | Use Scenario: In-vehicle gateway aggregating LIN, CAN FD (via external transceiver), and Ethernet AVB signals for ADAS domain controller communication. IC Role / Device Role / Timing Role: Safety-aware communication hub with dual CAN controllers, Ethernet MAC for camera/video streaming, and SCE9 for secure firmware signing. Use Value: Meets AEC-Q100 Grade 2 (-40°C to +105°C) thermal specs and supports ISO 26262 ASIL-B decomposition via lockstep-capable peripherals and ECC memory. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M4AF3CBM | Same RA6M4 family, identical 200 MHz Cortex-M33 core, 1 MB flash, 256 KB SRAM, but uses 144-pin LQFP instead of BGA; lacks OSPI interface. | Better suited for prototyping and manual assembly; lower I/O count (109 vs. 109 usable, but different pinout) and no OctaSPI boot capability. | Select when board space allows larger LQFP footprint and OSPI is not required for external memory expansion. |
| STM32H743VI | Arm Cortex-M7 @ 480 MHz, 2 MB flash, 1 MB RAM, no built-in Ethernet MAC or SCE9; requires external PHY and crypto co-processor for equivalent functionality. | Higher raw compute throughput but increased BOM complexity and security certification effort due to external crypto and networking components. | Select only if application demands >200 MHz deterministic processing and can absorb added design validation burden for external security and Ethernet subsystems. |
Compared with R7FA6M5BG3CBM#BC0, the R7FA6M4AF3CBM offers identical core performance and security features in a more manufacturable LQFP package but sacrifices OSPI and compact BGA density; the STM32H743VI delivers higher CPU clock speed yet requires external components to match the integrated Ethernet, crypto, and memory interface capabilities of the RA6M4.
Availability
R7FA6M5BG3CBM#BC0 is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, and networked HMI systems requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for R7FA6M5BG3CBM#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.
The RA6M4 group - including R7FA6M5BG3CBM#BC0 - is designed specifically for secure, connected industrial and IoT edge devices requiring integrated networking, hardware-enforced security, and real-time deterministic performance.
FAQ
What is the maximum operating frequency and core architecture of the R7FA6M5BG3CBM#BC0?
The R7FA6M5BG3CBM#BC0 features an Arm Cortex-M33 core operating at up to 200 MHz, implementing the Armv8-M architecture with TrustZone security extensions. It supports both secure and non-secure execution states, with dual Systick timers and CoreSight ETM-M33 for debug visibility. This architecture enables deterministic real-time response while maintaining hardware-isolated secure firmware execution.
Does the R7FA6M5BG3CBM#BC0 support Ethernet connectivity, and what interface does it use?
Yes, the R7FA6M5BG3CBM#BC0 integrates a fully compliant IEEE 802.3 Ethernet MAC controller with RMII interface support. It connects directly to external PHYs using dedicated pins (ETH_RMII_TXD0–1, TX_EN, RXD0–1, CRS_DV) and pairs with the Ethernet DMA Controller (EDMAC) to handle frame transmission and reception without CPU intervention - enabling efficient 10/100 Mbps networking in R7FA6M5BG3CBM#BC0-based designs.
What security features are implemented in hardware on the R7FA6M5BG3CBM#BC0?
The R7FA6M5BG3CBM#BC0 includes Secure Crypto Engine 9 (SCE9) for hardware acceleration of AES, RSA, ECC, and SHA256 operations; Arm TrustZone for memory and peripheral isolation; tamper detection circuitry; and device lifecycle management. These features collectively enable secure boot, encrypted firmware updates, and key storage - all verified against Renesas' certified secure element implementation in R7FA6M5BG3CBM#BC0.
What package type and pin count does the R7FA6M5BG3CBM#BC0 use?
The R7FA6M5BG3CBM#BC0 uses a 144-pin Fine-Pitch Ball Grid Array (FBGA) package with 7 mm × 7 mm body size and 0.50 mm ball pitch. This compact, thermally efficient package supports high-density routing and is qualified for operation from -40°C to +105°C - matching the industrial-grade thermal requirements specified for R7FA6M5BG3CBM#BC0 in the official Renesas datasheet.
Can the R7FA6M5BG3CBM#BC0 execute firmware directly from external flash memory?
Yes, the R7FA6M5BG3CBM#BC0 supports execute-in-place (XIP) from external memory via its Octa Serial Peripheral Interface (OSPI), which connects to OctaFlash or OctaRAM devices. This capability allows R7FA6M5BG3CBM#BC0 to run application code directly from high-density external flash without loading into internal SRAM - reducing memory bottlenecks and enabling scalable firmware architectures in resource-constrained edge deployments.
R7FA6M5BG3CBM#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LFBGA
- Series:
- RA6M5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 109
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 25x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M5BG3CBM#BC0 FAQ
1.How can I place an order for R7FA6M5BG3CBM#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M5BG3CBM#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M5BG3CBM#BC0 reliable?
The price and inventory of R7FA6M5BG3CBM#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M5BG3CBM#BC0 is usually 5 days.
3.What payment methods are accepted for R7FA6M5BG3CBM#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M5BG3CBM#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M5BG3CBM#BC0?
R7FA6M5BG3CBM#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M5BG3CBM#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M5BG3CBM#BC0?
For technical support, including R7FA6M5BG3CBM#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M5BG3CBM#BC0 requirements.
6.How does Aetrix verify that R7FA6M5BG3CBM#BC0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M5BG3CBM#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5BG3CBM#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M5BG3CBM#BC0?
All R7FA6M5BG3CBM#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5BG3CBM#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M5BG3CBM#BC0 part is unused and in its original packaging.
Return procedure for R7FA6M5BG3CBM#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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