Renesas R7FA6M5BG3CFC#AA0
- Part No.:
- R7FA6M5BG3CFC#AA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
R7FA6M5BG3CFC#AA0.pdf
- Description:
- IC MCU 32BIT 1.5MB FLSH 176LFQFP
- Quantity:
- Payment:

- Shipping:

Inventory:300
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Product details
Overview
R7FA6M5BG3CFC from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1.5 MB dual-bank code flash, 8 KB data flash, 512 KB SRAM with ECC/parity, integrated Ethernet MAC, USB 2.0 High-Speed and Full-Speed, dual CAN FD, QSPI/OSPI, and Secure Crypto Engine (SCE9) with TrustZone support. It targets industrial gateways requiring secure, real-time connectivity and deterministic control.
For engineers reviewing the R7FA6M5BG3CFC datasheet, R7FA6M5BG3CFC pinout, R7FA6M5BG3CFC application, or R7FA6M5BG3CFC equivalent, key selection considerations include its -40°C to +105°C operation, 176-pin LQFP package, dual CAN FD interface, hardware-accelerated cryptography (AES/RSA/ECC/SHA256), and integrated Ethernet MAC with RMII support - all critical for secure edge node design.
Technical Context
The R7FA6M5BG3CFC implements Armv8-M architecture with TrustZone-enabled secure/non-secure execution environments, supporting PMSAv8 memory protection with eight regions each for secure and non-secure MPU. Its dual-bank flash enables background programming and SWAP operations without halting CPU execution.
It integrates a full-featured peripheral set including ETHERC/EDMAC for zero-CPU packet handling, two independent CAN FD controllers (16 TX/16 RX buffers per channel), and SCE9 crypto engine with tamper detection, 128-bit unique ID, and resistance to power analysis - all coordinated under lifecycle-managed device security policies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M33 @ 200 MHz with TrustZone, MPU_S/MPU_NS (8 regions each) |
| Memory | 1.5 MB dual-bank code flash (background/SWAP), 8 KB data flash (100k P/E cycles), 512 KB SRAM (448 KB parity + 64 KB ECC) |
| Connectivity | Dual CAN FD (ISO 11898-1), Ethernet MAC (RMII only), USB 2.0 HS/FS, QSPI/OSPI, SDHI, 10× SCI, 3× I²C, 2× SPI |
| Analog | Two 12-bit ADC12 (13/16 ch, 5 Msps interleaved), two 12-bit DAC12, on-die temperature sensor (TSN) |
| Security | Secure Crypto Engine 9 (AES-128/256, RSA-2048/4096, ECC-256/384, SHA224/256), tamper pins (3), TrustZone region partitioning |
| Package & Temp | 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), -40°C to +105°C operating range |
| Power | 2.7–3.6 V supply, battery-backed RTC + SOSC + backup SRAM, low-power AGT timers (6×) |
Pinout & Package
Package: 176-pin LQFP (PLQP0176KB-C), 24 mm × 24 mm, 0.5 mm pitch, RoHS-compliant Sn (tin) terminal finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Primary 2.7–3.6 V core supply and reference ground; decoupling required per pin |
| XTAL / EXTAL | Main clock oscillator interface | Supports 8–24 MHz crystal or external clock input for system timing |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar and low-power wake-up |
| RES | Reset input | Active-low asynchronous reset; initiates Power-on Reset (POR) sequence |
| MD | Mode control | Configures single-chip vs. SCI/USB boot mode during reset assertion |
| VBATT | Battery backup supply | Provides continuous power to RTC, SOSC, and backup registers during main power loss |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO/MDC bus for PHY configuration and status polling |
| ETH_TXD0–1 / ETH_RXD0–1 / ETH_TX_EN / ETH_CRS_DV | Ethernet physical layer signals | RMII interface (2-bit TX/RX data, TX enable, carrier sense/data valid) for 10/100 Mbps operation |
| CANFD0_TX / CANFD0_RX / CANFD1_TX / CANFD1_RX | CAN FD transceiver interfaces | Dedicated differential signal pairs per channel; supports classical CAN and CAN FD frames up to 5 Mbps |
| USB_VBUS / USB_DP / USB_DM | USB 2.0 High-Speed interface | Integrated transceiver supports host/device roles; VBUS sensing enables OTG negotiation |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP | Enables seamless firmware updates via background programming and atomic bank swap - no application interruption |
| Hardware crypto acceleration | SCE9 executes AES-256 encryption/decryption in <100 cycles, RSA-4096 signature in ~120 ms, eliminating software overhead |
| TrustZone memory isolation | Allows secure bootloader, encrypted key storage, and isolated secure peripherals - prevents unauthorized access to sensitive assets |
| RMII Ethernet interface | Reduces PHY pin count by 50% vs MII; integrated DMA (EDMAC) offloads TCP/IP stack processing from CPU |
| Flexible timer subsystem | GPT32×4 + GPT16×6 + AGT×6 provide synchronized PWM for BLDC motor control, precise event timing, and ultra-low-power wake-up |
Applications
| Industrial Gateway | Secure Edge Node |
|---|---|
|
Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT over TLS. IC Role / Device Role / Timing Role: Central controller managing dual CAN FD buses, Ethernet backhaul, and secure TLS handshake via SCE9. Use Value: Dual-bank flash enables OTA firmware updates without downtime; TrustZone isolates secure key storage from application firmware. |
Use Scenario: Tamper-resistant remote sensor aggregator in smart grid substations. IC Role / Device Role / Timing Role: Secure data concentrator with RTC timestamping, AES-GCM encryption, and tamper pin monitoring. Use Value: SCE9's power analysis resistance and 3 tamper pins prevent physical key extraction; -40°C to +105°C rating ensures outdoor reliability. |
| Medical Data Hub | Automated Test Equipment |
|
Use Scenario: HIPAA-compliant patient monitor interfacing with analog sensors and USB medical peripherals. IC Role / Device Role / Timing Role: Real-time sensor fusion hub with 12-bit ADC12 (5 Msps), USB HS for data export, and secure audit log storage. Use Value: ECC-protected SRAM ensures data integrity; USB HS transfers 10 MB waveform logs in <2 sec; CTSU enables touch UI without added components. |
Use Scenario: Self-calibrating benchtop instrument with precision analog capture and Ethernet remote control. IC Role / Device Role / Timing Role: Timing-critical measurement controller using CAC for clock accuracy validation and AGT for sub-millisecond trigger latency. Use Value: CAC validates oscillator drift against reference clock; dual ADC12 units enable simultaneous voltage/current sampling with <10 ns skew. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M5BH3CFC | 2 MB code flash (vs. 1.5 MB), same peripherals, package, and temp grade | Required when firmware image exceeds 1.5 MB or dual-bank redundancy demands larger bank size | Select R7FA6M5BH3CFC if future firmware growth or A/B update partitioning requires >1.5 MB flash capacity. |
| R7FA6M5BG2CBG | 176-pin BGA (vs. LQFP), -40°C to +85°C (vs. +105°C), identical memory/peripherals | Suitable for space-constrained consumer or commercial designs where extended temperature is unnecessary | Choose R7FA6M5BG2CBG only for compact PCB layouts where BGA assembly is available and industrial temp range is not required. |
Compared with R7FA6M5BG3CFC, R7FA6M5BH3CFC offers higher flash density for complex protocol stacks, while R7FA6M5BG2CBG trades thermal robustness and through-hole manufacturability for footprint reduction - neither is pin-compatible due to LQFP vs. BGA packaging.
Availability
R7FA6M5BG3CFC is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, medical data hubs, and automated test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R7FA6M5BG3CFC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.
The RA6M5 Group - including R7FA6M5BG3CFC - is designed for secure, high-performance edge computing applications demanding real-time responsiveness, hardware-enforced security, and rich connectivity in harsh environments.
FAQ
What is the maximum operating frequency and core architecture of the R7FA6M5BG3CFC?
The R7FA6M5BG3CFC features an Arm Cortex-M33 core operating at up to 200 MHz, implementing the Armv8-M architecture with security extensions. It includes dual instances of the SysTick timer (secure and non-secure), CoreSight ETM-M33 trace, and PMSAv8 memory protection - enabling deterministic real-time performance with hardware-enforced security boundaries in the R7FA6M5BG3CFC.
Does the R7FA6M5BG3CFC support Ethernet connectivity, and what interface does it use?
Yes, the R7FA6M5BG3CFC integrates an IEEE 802.3-compliant Ethernet MAC (ETHERC) with dedicated Ethernet DMA Controller (EDMAC). It supports RMII interface only - requiring external PHY with 2-bit TX/RX data, TX_EN, and CRS_DV signals - and does not support MII or RGMII. This configuration reduces pin count and simplifies layout while maintaining 10/100 Mbps throughput in the R7FA6M5BG3CFC.
How does the Secure Crypto Engine (SCE9) in the R7FA6M5BG3CFC enhance system security?
The SCE9 in the R7FA6M5BG3CFC provides hardware-accelerated cryptographic operations including AES-128/256, RSA-2048/4096, ECC-256/384, and SHA224/256, plus tamper detection on three dedicated pins and resistance to power analysis attacks. It works in concert with Arm TrustZone to isolate secure key storage and cryptographic operations from non-secure firmware - a foundational capability for secure boot and TLS in the R7FA6M5BG3CFC.
What are the flash memory configurations supported by the R7FA6M5BG3CFC?
The R7FA6M5BG3CFC contains 1.5 MB of dual-bank code flash memory supporting background programming and atomic SWAP operations, plus 8 KB of data flash rated for 100,000 program/erase cycles. The dual-bank architecture allows one bank to execute code while the other is being reprogrammed - essential for fail-safe firmware updates in mission-critical deployments of the R7FA6M5BG3CFC.
Which package and temperature grade does the R7FA6M5BG3CFC use?
The R7FA6M5BG3CFC uses a 176-pin LQFP package (PLQP0176KB-C, 24 mm × 24 mm, 0.5 mm pitch) and is rated for industrial temperature operation from -40°C to +105°C. Its lead finish is Pb-free Sn (tin), and it complies with RoHS directives - making the R7FA6M5BG3CFC suitable for high-reliability applications in demanding thermal environments.
R7FA6M5BG3CFC#AA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LQFP
- Series:
- RA6M5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 132
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b SAR; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M5BG3CFC#AA0 FAQ
1.How can I place an order for R7FA6M5BG3CFC#AA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M5BG3CFC#AA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of R7FA6M5BG3CFC#AA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M5BG3CFC#AA0 is usually 5 days.
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5.How can I obtain technical support or documentation for R7FA6M5BG3CFC#AA0?
For technical support, including R7FA6M5BG3CFC#AA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M5BG3CFC#AA0 requirements.
6.How does Aetrix verify that R7FA6M5BG3CFC#AA0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M5BG3CFC#AA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5BG3CFC#AA0 meets industry standards.
7.What is the process for return or replacement of R7FA6M5BG3CFC#AA0?
All R7FA6M5BG3CFC#AA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5BG3CFC#AA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M5BG3CFC#AA0 part is unused and in its original packaging.
Return procedure for R7FA6M5BG3CFC#AA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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