Renesas R7FA6M5BG3CFC#BA0
- Part No.:
- R7FA6M5BG3CFC#BA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
R7FA6M5BG3CFC#BA0.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 1.5M/512
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
R7FA6M5BG3CFC from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1.5 MB code flash, 8 KB data flash, 512 KB SRAM with ECC/parity, dual CAN FD, Ethernet MAC, USB 2.0 HS/FS, QSPI/OSPI, and integrated Secure Crypto Engine (SCE9) with TrustZone for secure embedded applications in industrial gateways and connected edge devices.
For engineers reviewing the R7FA6M5BG3CFC datasheet, R7FA6M5BG3CFC pinout, R7FA6M5BG3CFC application, or R7FA6M5BG3CFC equivalent, this page delivers verified technical context, package-specific I/O mapping, real-world use cases, and validated alternative MCUs - all grounded in Renesas R01DS0366EJ0150 Rev.1.50 documentation and official RA6M5 product specifications.
Technical Context
The R7FA6M5BG3CFC implements an Armv8-M architecture with TrustZone security extension, supporting secure/non-secure execution states via dual MPU instances (8 regions each) and hardware-isolated memory regions for flash, SRAM, and peripherals. Its clock system integrates PLL/PLL2, HOCO/MOCO/LOCO oscillators, and CAC for frequency accuracy validation.
It delivers deterministic real-time control via four 32-bit GPT32 timers, six 16-bit GPT16 timers, six AGT low-power timers, and event-driven operation through ELC and DTC/DMAC (8-channel). Analog subsystem includes two 12-bit ADC12 units (up to 26 channels total), two DAC12, and on-die temperature sensor (TSN) routed to ADC inputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ 200 MHz max; supports TrustZone, PMSAv8 MPU, dual SysTick, ETM-M33 trace |
| Memory | 1.5 MB code flash (dual-bank), 8 KB data flash (100k P/E cycles), 512 KB SRAM (448 KB parity + 64 KB ECC) |
| Connectivity | Dual CAN FD (16 TX/RX buffers per channel), Ethernet MAC (RMII), USB 2.0 HS/FS, QSPI/OSPI, SDHI, 10× SCI, 3× IIC, 2× SPI, SSIE, CEC |
| Analog & Timers | 2× 12-bit ADC12 (5 Msps interleaved), 2× DAC12, TSN, 4× GPT32, 6× GPT16, 6× AGT, RTC with VBATT support |
| Security | Secure Crypto Engine 9 (AES/RSA/ECC/SHA256/GHASH), 128-bit unique ID, tamper detection, lifecycle management |
| Package & Environment | 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), -40°C to +105°C operating range, 2.7–3.6 V supply |
Pinout & Package
Package: 176-pin LQFP (PLQP0176KB-C), 24 mm × 24 mm, 0.5 mm pitch, with 132 general-purpose I/O pins, 17 of which are 5-V tolerant, and dedicated power/ground, clock, debug, and peripheral signal terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Core logic supply (2.7–3.6 V); decoupling required per datasheet layout guidelines |
| XTAL / EXTAL | Main clock oscillator interface | Supports 8–24 MHz crystal; enables precise timing for USB/Ethernet and system clock generation |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar mode and battery-backed timekeeping |
| SWDIO / SWCLK | Serial Wire Debug interface | Two-pin ARM CoreSight debug path; enables programming, breakpointing, and real-time trace |
| MD / RES | Mode select / Reset input | Hardwired boot configuration (SCI/USB vs. single-chip); active-low asynchronous reset with internal pull-up |
| ETXD0–ETXD3 / ERXD0–ERXD3 | Ethernet PHY interface (RMII) | 4-bit transmit/receive data bus; requires external PHY (e.g., LAN8742A) for IEEE 802.3 compliance |
| TXD0 / RXD0 | SCI0 UART interface | Asynchronous serial communication channel; supports bootloader, debug console, and host protocol stacks |
| CRX0 / CTX0 | CAN FD Channel 0 interface | Differential CAN transceiver connection; supports ISO 11898-1 classical and FD frames up to 5 Mbps |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with background operation | Enables seamless firmware updates without halting real-time tasks; supports SWAP and erase-suspend during execution |
| Integrated SCE9 + TrustZone | Hardware-accelerated crypto (AES-128/256, RSA-2048, SHA256) with secure key storage and tamper-resistant execution zones |
| Event Link Controller (ELC) | Direct peripheral-to-peripheral triggering without CPU intervention - reduces latency and frees core for application logic |
| Flexible timer subsystem | GPT32/GPT16/AGT combination supports motor control (BLDC 3-phase PWM), precision capture, and ultra-low-power wake-up |
| High-speed serial memory interfaces | QSPI and OSPI controllers enable direct XIP execution from external OctaFlash or QuadSPI NOR, expanding effective code space |
Applications
| Industrial Gateway | Secure Edge Node |
|---|---|
Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT over Ethernet/USB. IC Role / Device Role: Central application processor managing dual CAN FD buses, Ethernet MAC, USB host, and secure TLS stack. Use Value: Dual-bank flash allows OTA firmware updates while maintaining fieldbus uptime; SCE9 accelerates TLS 1.2 handshake and certificate verification. |
Use Scenario: Tamper-evident sensor aggregator in smart metering or building automation with local anomaly detection. IC Role / Device Role: Trusted execution environment hosting secure sensor fusion, encrypted data logging, and remote attestation. Use Value: TrustZone isolates secure boot and key management from application firmware; tamper pins detect physical intrusion attempts. |
| Medical Data Logger | Human-Machine Interface (HMI) |
Use Scenario: Battery-backed patient vital sign recorder with SD card storage, USB export, and real-time display. IC Role / Device Role: Real-time controller interfacing ADC12 (ECG/SpO₂), SDHI, USBFS, RTC, and CTSU touch buttons. Use Value: 512 KB SRAM buffers multi-channel sensor data; VBATT-powered RTC maintains timestamp integrity during main power loss. |
Use Scenario: Touch-enabled industrial panel with graphical UI, audio feedback, and CAN-based machine control. IC Role / Device Role: HMI processor driving CTSU capacitive buttons, SSIE audio codec, CAN FD actuator interface, and USBHS display bridge. Use Value: CTSU supports up to 15 touch electrodes with noise immunity; SSIE's 50 MHz audio clock enables high-fidelity voice prompts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M5BH3CFC | 2 MB code flash (vs. 1.5 MB), same package, temperature grade, and peripheral set | Better suited for complex protocol stacks (e.g., full TCP/IP + TLS + OTA) requiring larger code footprint | Select when firmware size exceeds 1.5 MB or future-proofing against feature expansion is required |
| R7FA6M5BG2CBG | 1.5 MB flash, 176-pin BGA (7 mm × 7 mm), -40°C to +85°C rating (vs. LQFP, +105°C) | Preferred for space-constrained consumer or automotive infotainment where thermal margin is lower | Choose for compact PCB layouts needing higher I/O density and reduced board area, accepting narrower temp range |
Compared with R7FA6M5BG3CFC, R7FA6M5BH3CFC offers greater flash headroom for evolving firmware, while R7FA6M5BG2CBG trades thermal robustness and package accessibility for miniaturization - both retain identical peripheral functionality and TrustZone/SCE9 security architecture.
Availability
R7FA6M5BG3CFC is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, medical data loggers, and human-machine interfaces requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R7FA6M5BG3CFC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RA6M5 group, including R7FA6M5BG3CFC, was designed for secure, high-performance edge computing - integrating Arm TrustZone, hardware crypto acceleration, and rich connectivity to accelerate development of certified IoT endpoints and industrial controllers.
FAQ
What is the maximum operating frequency and core architecture of the R7FA6M5BG3CFC?
The R7FA6M5BG3CFC features an Arm Cortex-M33 core operating at a maximum frequency of 200 MHz. It implements the Armv8-M architecture with security extensions, including TrustZone, dual SysTick timers (secure and non-secure), and CoreSight ETM-M33 for instruction trace. This architecture enables hardware-enforced isolation between trusted and untrusted software domains, critical for secure firmware deployment in the R7FA6M5BG3CFC.
Does the R7FA6M5BG3CFC support CAN FD, and how many channels are available?
Yes, the R7FA6M5BG3CFC supports CAN with Flexible Data-rate (CAN FD) with two independent channels. Each channel provides 16 transmit buffers and 16 receive buffers, compliant with ISO 11898-1. This capability enables high-bandwidth diagnostics, firmware updates, and real-time control messaging in automotive and industrial networks - a confirmed feature of the R7FA6M5BG3CFC per Renesas R01DS0366EJ0150 Rev.1.50.
What memory resources does the R7FA6M5BG3CFC include, and what are their endurance characteristics?
The R7FA6M5BG3CFC includes 1.5 MB of code flash memory with dual-bank operation and background programming, 8 KB of data flash memory rated for 100,000 program/erase cycles, and 512 KB of on-chip SRAM - split into 448 KB with parity and 64 KB with ECC. These memory resources are explicitly specified for the R7FA6M5BG3CFC in Table 1.2 and Section 1.4 of the official datasheet R01DS0366EJ0150 Rev.1.50.
Which package type and pin count does the R7FA6M5BG3CFC use?
The R7FA6M5BG3CFC uses a 176-pin LQFP package (PLQP0176KB-C), measuring 24 mm × 24 mm with 0.5 mm pitch. It provides 132 general-purpose I/O pins, 17 of which are 5-V tolerant, along with dedicated power, clock, debug, and peripheral interface signals. This package variant is confirmed in Table 1.13 and Figure 1.2 of the R7FA6M5 datasheet R01DS0366EJ0150 Rev.1.50.
What security features are integrated into the R7FA6M5BG3CFC beyond Arm TrustZone?
Beyond Arm TrustZone, the R7FA6M5BG3CFC integrates the Secure Crypto Engine 9 (SCE9) with hardware accelerators for AES, RSA, ECC, DSA, SHA224/SHA256, and GHASH; a 128-bit unique ID; tamper detection circuitry; and device lifecycle management. These features are documented in Section 1.1 and Table 1.14 of R01DS0366EJ0150 Rev.1.50 and are fully enabled in the R7FA6M5BG3CFC silicon configuration.
R7FA6M5BG3CFC#BA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LQFP
- Series:
- RA6M5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 132
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M5BG3CFC#BA0 FAQ
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The price and inventory of R7FA6M5BG3CFC#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M5BG3CFC#BA0 is usually 5 days.
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All R7FA6M5BG3CFC#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5BG3CFC#BA0 meets industry standards.
7.What is the process for return or replacement of R7FA6M5BG3CFC#BA0?
All R7FA6M5BG3CFC#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5BG3CFC#BA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M5BG3CFC#BA0 part is unused and in its original packaging.
Return procedure for R7FA6M5BG3CFC#BA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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