Renesas R7FA6M5BH2CBG#AC0
- Part No.:
- R7FA6M5BH2CBG#AC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LFBGA
- Datasheet:
-
R7FA6M5BH2CBG#AC0.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 176LFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:140
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Product details
Overview
R7FA6M5BH2CBG from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 2 MB dual-bank code flash with background/swap operation, 8 KB data flash, and 512 KB SRAM with parity/ECC. It integrates Ethernet MAC, USB 2.0 High-Speed/Full-Speed, dual CAN FD, SDHI, QSPI/OSPI, and Secure Crypto Engine (SCE9) with TrustZone for secure edge IoT gateways and industrial controllers.
For engineers reviewing the R7FA6M5BH2CBG datasheet, R7FA6M5BH2CBG pinout, R7FA6M5BH2CBG application, or R7FA6M5BH2CBG equivalent, key selection considerations include its -40°C to +85°C operating range, 176-pin FBGA (PLBG0176GF-A) package, dual CAN FD support, integrated Ethernet MAC with RMII interface, and hardware-accelerated AES/RSA/ECC/SHA256 cryptography.
Technical Context
The R7FA6M5BH2CBG implements Armv8-M architecture with TrustZone security extension, supporting secure/non-secure execution states via dual MPU instances (8 regions each) and configurable memory region attribution. Its system-level integration includes Event Link Controller (ELC) for CPU-free peripheral triggering and Data Transfer Controller (DTC) for interrupt-driven zero-CPU-overhead data movement.
It delivers deterministic real-time performance through eight-channel DMAC, six AGT timers for low-power event counting, and GPT32/GPT16 modules supporting BLDC motor control with complementary PWM outputs (GTOUUP/GTOULO etc.). Clock management combines PLL/PLL2, multiple on-chip oscillators (HOCO/MOCO/LOCO), and CAC for frequency accuracy validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M33 @ 200 MHz max; supports TrustZone, dual MPU, and CoreSight ETM-M33 trace |
| Memory | 2 MB dual-bank code flash (background/swap), 8 KB data flash (100k P/E cycles), 512 KB SRAM with parity/ECC |
| Connectivity | Dual CAN FD (16 TX/RX buffers per channel), USB 2.0 HS/FS, Ethernet MAC (RMII), SDHI, QSPI/OSPI, SCI×10, IIC×3, SPI×2 |
| Analog | ADC12×2 (13/16 ch, 5 Msps interleaved), DAC12×2, temperature sensor (TSN), CTSU (capacitive touch) |
| Security | Secure Crypto Engine 9 (AES/RSA/ECC/DSA/SHA224/SHA256/GHASH), 128-bit unique ID, tamper detection, power analysis resistance |
| Power & Temp | 2.7–3.6 V supply; -40°C to +85°C operating range; 176-pin FBGA (7 mm × 7 mm, 0.5 mm pitch) |
| Timers | GPT32×4, GPT16×6, AGT×6, RTC with calendar/VBATT backup, WDT/IWDT, SysTick (secure/non-secure) |
Pinout & Package
Package: 176-pin Fine-Pitch Ball Grid Array (FBGA), PLBG0176GF-A footprint (7 mm × 7 mm, 0.5 mm pitch), rated for -40°C to +85°C operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Primary core power domain; requires local 0.1 µF decoupling per VCC pin |
| VBATT | Battery backup input | Supplies RTC, SOSC, and backup RAM during main power loss; enables calendar retention |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal; enables precise clock source for USB/Ethernet timing |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar and low-power wake-up timing |
| RES | Reset input | Active-low asynchronous reset; initiates full system initialization and register clearing |
| MD | Mode control | Configures single-chip vs. SCI/USB boot mode; must be stable during reset release |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO bus for PHY configuration and status polling |
| ETH_TXD0–3 / ETH_RXD0–3 | Ethernet data lanes | RMII-compliant 4-bit transmit/receive paths; requires matched trace lengths for signal integrity |
| USB_VBUS / USB_ID | USB OTG detection | Enables host/device role negotiation and VBUS presence sensing in dual-role configurations |
| CANFD0_TX / CANFD0_RX | CAN FD Channel 0 interface | Differential signaling pins compliant with ISO 11898-1; supports classical CAN and CAN FD frames up to 5 Mbps |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP operation | Enables seamless firmware updates without application interruption; critical for OTA deployments in fielded equipment |
| Hardware crypto acceleration (SCE9) | Offloads AES-128/256, RSA-2048/4096, ECC NIST P-256/P-384, SHA256; reduces secure boot time by >90% vs. software-only |
| TrustZone-enforced memory isolation | Allows concurrent secure firmware (e.g., key vault) and non-secure application (e.g., UI stack) with hardware-gated access control |
| ELC-triggered peripheral chaining | Links ADC conversion completion directly to DMA transfer start-eliminates CPU polling and interrupt latency in sensor data pipelines |
| Integrated CTSU for capacitive touch | Supports up to 15 touch channels with noise immunity; enables robust HMI on industrial panels without external ICs |
| VBATT-backed RTC with calendar | Maintains accurate date/time across power cycles (2000–2099); essential for logging, scheduling, and time-stamped diagnostics |
Applications
| Industrial PLC Controller | Secure Edge Gateway |
|---|---|
|
Use Scenario: Programmable logic controller managing I/O expansion, motion control, and HMI communication in factory automation. IC Role / Device Role / Timing Role: Central processing unit executing real-time ladder logic, coordinating GPT-based PWM for servo drives, and handling EtherCAT-over-Ethernet via EMAC. Use Value: Dual CAN FD interfaces enable legacy machine connectivity while Ethernet MAC supports OPC UA over TSN for Industry 4.0 integration. |
Use Scenario: Field-deployed gateway aggregating Modbus RTU, CAN FD, and BLE sensor data for cloud upload via TLS-secured MQTT. IC Role / Device Role / Timing Role: Secure application processor running Zephyr OS, using SCE9 for TLS handshake acceleration and TrustZone for isolated credential storage. Use Value: Hardware-accelerated SHA256 and RSA signing ensures sub-100ms certificate verification-critical for battery-powered remote nodes. |
| Medical Diagnostic Device | Smart Energy Meter |
|
Use Scenario: Portable ultrasound or patient monitor requiring high-resolution analog acquisition, real-time image processing, and HIPAA-compliant data export. IC Role / Device Role / Timing Role: Signal acquisition controller interfacing ADC12 (5 Msps interleaved) and SSIE for audio feedback, with USBHS for DICOM file transfer. Use Value: 512 KB SRAM with ECC prevents bit-flip corruption in stored waveform buffers; tamper-detect pins trigger secure erase on physical intrusion. |
Use Scenario: Revenue-grade electricity meter with metrology SoC interface, anti-tampering features, and DLMS/COSEM protocol stack. IC Role / Device Role / Timing Role: Communications and security co-processor managing HAN (PLC/Zigbee), WAN (LTE/NB-IoT), and secure firmware updates via SCE9-verified signatures. Use Value: Dual CAN FD supports legacy utility SCADA links; VBATT-backed RTC maintains billing timestamps during grid outages. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M5BH3CFC | Same core/peripherals but rated for -40°C to +105°C; uses 176-pin LQFP (24 mm × 24 mm) instead of FBGA | Better suited for under-hood automotive or high-temp industrial enclosures where extended temperature range is mandatory | Select R7FA6M5BH3CFC when ambient exceeds +85°C or LQFP reflow compatibility is required over FBGA assembly. |
| R7FA6M5AH2CBG | Identical package and temperature grade, but supports only Classical CAN (no CAN FD); 2 MB flash, same SRAM/peripherals | Appropriate for cost-sensitive CAN-based systems where FD bandwidth or ISO 11898-1 FD frame support is unnecessary | Choose R7FA6M5AH2CBG when CAN FD is not required-reduces BOM cost while retaining all other R7FA6M5BH2CBG capabilities. |
Compared with R7FA6M5BH2CBG, R7FA6M5BH3CFC offers extended temperature operation in LQFP packaging-ideal for harsh environments-but lacks FBGA density advantages; R7FA6M5AH2CBG removes CAN FD capability to lower cost while preserving identical flash/SRAM and security features for legacy CAN networks.
Availability
R7FA6M5BH2CBG is available at Aetrix Electronics and suitable for industrial automation, secure edge gateways, and medical diagnostic devices requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for R7FA6M5BH2CBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The RA6M5 Group targets high-performance, secure embedded applications-designed to accelerate development of IoT edge nodes, industrial HMIs, and networked medical devices with integrated TrustZone and hardware crypto.
FAQ
What is the maximum operating frequency and core architecture of the R7FA6M5BH2CBG?
The R7FA6M5BH2CBG features an Arm Cortex-M33 core operating at up to 200 MHz, implementing the Armv8-M architecture with security extensions including TrustZone, dual MPU instances (8 regions each), and CoreSight ETM-M33 trace. This architecture enables secure, real-time deterministic execution for industrial and IoT applications where both performance and isolation are critical. The R7FA6M5BH2CBG achieves this frequency using its integrated PLL and supports multiple clock sources including HOCO, MOSC, and PLL2.
Does the R7FA6M5BH2CBG support CAN FD, and how many channels are available?
Yes, the R7FA6M5BH2CBG supports two independent CAN FD channels compliant with ISO 11898-1, each with 16 dedicated transmit and receive buffers. This enables simultaneous high-bandwidth communication with modern automotive ECUs or industrial fieldbuses while maintaining backward compatibility with classical CAN 2.0B networks. The R7FA6M5BH2CBG's CAN FD implementation supports data rates up to 5 Mbps and payloads up to 64 bytes-essential for firmware updates and sensor fusion in distributed systems.
What security features does the R7FA6M5BH2CBG include beyond Arm TrustZone?
Beyond Arm TrustZone, the R7FA6M5BH2CBG integrates the Secure Crypto Engine 9 (SCE9) with hardware accelerators for AES-128/256, RSA-2048/4096, ECC NIST P-256/P-384, DSA, and SHA224/SHA256/GHASH. It also provides tamper detection pins, power analysis resistance, a 128-bit unique ID, and lifecycle management for secure boot and key provisioning. These features allow the R7FA6M5BH2CBG to serve as a certified secure element in applications requiring FIPS 140-2 or Common Criteria EAL4+ compliance without external security ICs.
What is the package type and pin count of the R7FA6M5BH2CBG?
The R7FA6M5BH2CBG uses a 176-pin Fine-Pitch Ball Grid Array (FBGA) package with part code PLBG0176GF-A, measuring 7 mm × 7 mm with 0.5 mm pitch. It is rated for operation from -40°C to +85°C and provides 132 general-purpose I/O pins, 17 of which are 5-V tolerant. This compact, high-density package supports advanced routing for high-speed interfaces like USB HS, Ethernet RMII, and QSPI/OSPI while enabling miniaturized industrial and medical designs. The R7FA6M5BH2CBG's FBGA footprint is distinct from LQFP variants in the RA6M5 family.
How does the R7FA6M5BH2CBG handle firmware updates in the field?
The R7FA6M5BH2CBG supports robust over-the-air (OTA) firmware updates via its dual-bank code flash architecture, enabling background programming and atomic SWAP operations. While one bank executes the active application, the second bank receives and validates the new image-ensuring zero downtime and guaranteed rollback on failure. Combined with SCE9-verified digital signatures and TrustZone-isolated update handlers, the R7FA6M5BH2CBG guarantees authenticated, integrity-checked, and tamper-resistant field updates. This capability is foundational for deploying the R7FA6M5BH2CBG in unattended remote infrastructure.
R7FA6M5BH2CBG#AC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LFBGA
- Series:
- RA6M5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 132
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b SAR; D/A 2x12b
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M5BH2CBG#AC0 FAQ
1.How can I place an order for R7FA6M5BH2CBG#AC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M5BH2CBG#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of R7FA6M5BH2CBG#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M5BH2CBG#AC0 is usually 5 days.
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5.How can I obtain technical support or documentation for R7FA6M5BH2CBG#AC0?
For technical support, including R7FA6M5BH2CBG#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M5BH2CBG#AC0 requirements.
6.How does Aetrix verify that R7FA6M5BH2CBG#AC0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M5BH2CBG#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5BH2CBG#AC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M5BH2CBG#AC0?
All R7FA6M5BH2CBG#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5BH2CBG#AC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M5BH2CBG#AC0 part is unused and in its original packaging.
Return procedure for R7FA6M5BH2CBG#AC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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