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Renesas R7FA6M5BH2CBG#BC0

Part No.:
R7FA6M5BH2CBG#BC0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
176-LFBGA
Datasheet:
AetrixR7FA6M5BH2CBG#BC0.pdf
Description:
MCU RA6 ARM CM33 200MHZ 2M/512K
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Payment:
Payment
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Shipping

Inventory:4,336

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Product details

Overview

R7FA6M5BH2CBG from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 2 MB dual-bank code flash with background/swap operation, 8 KB data flash, and 512 KB SRAM with parity/ECC. It integrates Ethernet MAC, USB 2.0 High-Speed/Full-Speed, dual CAN FD, SDHI, QSPI/OSPI, advanced analog (dual 12-bit ADC/DAC), and Secure Crypto Engine 9 with TrustZone for secure IoT edge gateways and industrial controllers.

For engineers reviewing the R7FA6M5BH2CBG datasheet, R7FA6M5BH2CBG pinout, R7FA6M5BH2CBG application, or R7FA6M5BH2CBG equivalent, key selection criteria include its -40°C to +85°C temperature grade, 176-pin FBGA (PLBG0176GF-A) package, dual CAN FD support, integrated Ethernet MAC with RMII, and hardware-accelerated cryptography for secure firmware updates and device authentication.

Technical Context

The R7FA6M5BH2CBG implements Armv8-M architecture with TrustZone security extension, supporting secure/non-secure execution environments via separate MPU regions (8 per domain) and memory attribution. Its dual-bank flash enables seamless firmware updates without runtime interruption, while the SCE9 crypto engine accelerates AES, RSA, ECC, SHA256, and GHASH operations with tamper detection and 128-bit unique ID.

System-level integration includes an 8-channel DMAC, DTC, ELC for CPU-free peripheral linking, and dual GPT32/GPT16 timers for motor control. Clock management supports MOSC/SOSC/HOCO/MOCO/LOCO sources with PLL/PLL2, CAC for frequency accuracy verification, and RTC with calendar mode and VBATT backup.

Key Specifications

ParameterValue and Actual Design Meaning
CoreArm Cortex-M33 @ 200 MHz max; supports TrustZone and PMSAv8 MPU for secure partitioning
Memory2 MB dual-bank code flash (background/swap), 8 KB data flash (100k P/E cycles), 512 KB SRAM with parity/ECC
ConnectivityDual CAN FD (16 TX/RX buffers each), Ethernet MAC (RMII only), USB 2.0 HS/FS, SDHI, QSPI/OSPI, 10× SCI, 3× I²C, 2× SPI
AnalogDual 12-bit ADC (5 Msps interleaved, 26 channels), dual 12-bit DAC, on-die temperature sensor
SecuritySecure Crypto Engine 9 (AES/RSA/ECC/SHA256/GHASH), tamper pins, lifecycle management, TrustZone memory/peripheral isolation
Package & Temp176-pin FBGA (7 mm × 7 mm, 0.5 mm pitch), -40°C to +85°C operating range
Power2.7–3.6 V supply; low-power modes including Deep Software Standby with VBATT RTC retention

Pinout & Package

176-pin Fine-Pitch Ball Grid Array (FBGA) package, PLBG0176GF-A footprint (7 mm × 7 mm, 0.5 mm pitch), rated for -40°C to +85°C operation. Compatible with standard reflow profiles and automated assembly.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower supply / GroundDedicated power/ground pairs for noise suppression; decoupling required per datasheet layout guidelines
VBATTBattery backup inputSupplies RTC, SOSC, and backup registers during main power loss; supports calendar retention
XTAL / EXTALMain crystal oscillator interfaceSupports 8–24 MHz external crystal; enables precise timing for USB/Ethernet clock recovery
XCIN / XCOUTSub-clock oscillator interface32.768 kHz crystal connection for RTC calendar and low-power wake-up timing
RESReset inputActive-low asynchronous reset; initiates full system initialization and security state reset
MDMode controlConfigures single-chip vs. SCI/USB boot mode; must be stable during reset release
ETH_MDC / ETH_MDIOEthernet management interfaceIEEE 802.3-compliant MDIO bus for PHY register access and configuration
ETH_TXD0–1 / ETH_RXD0–1 / ETH_TX_EN / ETH_CRS_DVEthernet RMII signals2-bit transmit/receive data, TX enable, and carrier sense/data valid for 10/100 Mbps operation
USB_VBUS / USB_DP / USB_DMUSB 2.0 High-Speed physical interfaceIntegrated transceiver supports HS/FS device/host; VBUS sensing enables role negotiation
CANFD0_TX / CANFD0_RX / CANFD1_TX / CANFD1_RXCAN FD channel I/ODifferential signaling per ISO 11898-1; supports 5 Mbps FD data phase and legacy 1 Mbps arbitration
SD0_CLK / SD0_CMD / SD0_DAT0–3SDHI 4-bit bus interfaceSupports SD/SDHC/SDXC cards up to UHS-I speeds; DMA-driven transfers reduce CPU load
QSPI_IO0–3 / QSPI_CLK / QSPI_CSQuad SPI memory controllerDirect XIP-capable interface for serial flash; enables fast boot and code overlay execution
OSPI_IO0–7 / OSPI_CLK / OSPI_CSOcta SPI memory controllerHigh-bandwidth interface for OctaFlash/OctaRAM; supports execute-in-place and memory-mapped reads
ADC0_AN000–12 / ADC1_AN100–15Analog input channels26 total inputs across two units; shared pins (e.g., AN000/AN100) allow flexible signal routing
DAC0_OUT / DAC1_OUTAnalog output channelsIndependent 12-bit voltage outputs; usable for sensor calibration, bias generation, or waveform synthesis
CTSU_S0–14Capacitive touch sensing electrodes15-channel CTSU supports proximity, slider, and button interfaces without external components
GPT32A_GTIOC0A–B / GTETRGAPWM/timer I/O3-phase BLDC control outputs (GTOUUP/GTOULO etc.) and external trigger inputs for synchronized motor commutation
SWCLK / SWDIO / TDO / TDI / TMS / TCKDebug interfaceARM Serial Wire Debug (SWD) and JTAG-compatible; supports real-time trace via TDATA0–3 and SWO
NMI / IRQ0–15Interrupt inputsNon-maskable and maskable interrupt sources; IRQn-DS pins retain wake capability in Deep Software Standby

Key Features

FeatureDesign Value
Dual-bank flash with SWAP operationEnables zero-downtime firmware updates by validating new image in second bank before atomic bank swap
Secure Crypto Engine 9 + TrustZoneHardware-accelerated cryptographic operations and memory-peripheral isolation eliminate software-only security bottlenecks
Ethernet MAC with RMII supportIntegrated 10/100 Mbps MAC eliminates need for external MAC; RMII reduces pin count vs. MII
Dual CAN FD interfacesTwo independent ISO 11898-1 compliant channels support mixed classical/CAN FD networks in automotive diagnostics or industrial PLCs
QSPI + OSPI memory controllersSimultaneous support for quad/octal flash enables large OTA images and high-speed data logging without external parallel memory
15-channel Capacitive Touch Sensing UnitSelf-contained CTSU requires no external RC network; supports multi-touch sliders and proximity wake in HMI applications

Applications

Industrial GatewaySecure Edge Node

Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT over Ethernet/USB.

IC Role / Device Role / Timing Role: Central protocol processor with dual CAN FD for legacy device interfacing, Ethernet MAC for upstream connectivity, and SCE9 for TLS handshake acceleration.

Use Value: Reduces BOM cost by integrating dual CAN FD, Ethernet, and crypto acceleration-eliminating discrete transceivers and offload ICs.

Use Scenario: Tamper-resistant sensor node collecting vibration, temperature, and humidity data for predictive maintenance.

IC Role / Device Role / Timing Role: Secure data acquisition MCU with ADC/DAC, RTC timestamping, and TrustZone-enforced firmware integrity checks.

Use Value: On-chip tamper detection pins and secure boot prevent physical attacks; SCE9 enables authenticated firmware updates without host dependency.

Smart Building ControllerMotor Drive Interface

Use Scenario: HVAC control unit managing fan speed, valve position, and occupancy sensing via capacitive touch panel.

IC Role / Device Role / Timing Role: Real-time controller with CTSU for HMI, GPT32 timers for PWM fan control, and SDHI for local log storage.

Use Value: Integrated CTSU replaces external touch ICs; 512 KB SRAM buffers sensor history while running real-time control loops.

Use Scenario: BLDC motor driver for commercial refrigeration compressors requiring precise 3-phase commutation.

IC Role / Device Role / Timing Role: Motor control MCU with six GPT16 timers generating complementary PWM, AGT for current sampling sync, and CAN FD for status reporting.

Use Value: Hardware GPT dead-time insertion and hall sensor inputs (GTIU/GTIV/GTIW) simplify inverter design and improve reliability over software-based timing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R7FA6M5BH3CFCSame core/peripherals but 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch) and -40°C to +105°C ratingSuitable for extended-temperature industrial environments where FBGA rework is impracticalSelect R7FA6M5BH3CFC when board-level thermal management exceeds 85°C ambient or when LQFP assembly infrastructure is preferred
R7FA6M5BH2CBMSame flash/SRAM/crypto features but 144-pin FBGA (7 mm × 7 mm, 0.5 mm pitch) and reduced I/O count (109 vs. 132)Targeted at space-constrained designs where Ethernet and one CAN FD channel sufficeChoose R7FA6M5BH2CBM to reduce PCB area and BOM cost when full 176-pin I/O and dual CAN FD are not required

Compared with R7FA6M5BH2CBG, R7FA6M5BH3CFC offers higher temperature tolerance in a larger LQFP package, while R7FA6M5BH2CBM delivers identical security and connectivity in a smaller FBGA with fewer I/Os-enabling scalable platform design across thermal and density requirements.

Availability

R7FA6M5BH2CBG is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, smart building controllers, and motor drive interfaces requiring stable component supply across long production lifecycles.

Supply support for R7FA6M5BH2CBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets.

The RA6M5 Group targets secure, high-performance edge computing applications, combining Arm Cortex-M33 with integrated connectivity (Ethernet, CAN FD, USB HS), advanced analog, and hardware crypto to accelerate development of certified industrial and IoT devices.

FAQ

What is the maximum operating frequency and core architecture of the R7FA6M5BH2CBG?

The R7FA6M5BH2CBG features an Arm Cortex-M33 core operating at up to 200 MHz, based on the Armv8-M architecture with security extensions. It implements TrustZone for hardware-enforced secure/non-secure world separation and includes dual 8-region MPUs for memory protection in both domains. This architecture enables deterministic real-time performance while maintaining robust security boundaries essential for industrial and IoT deployments where the R7FA6M5BH2CBG is deployed.

Does the R7FA6M5BH2CBG support dual CAN FD, and what are the buffer configurations?

Yes, the R7FA6M5BH2CBG integrates two independent CAN FD modules compliant with ISO 11898-1, each supporting classical CAN and CAN FD frames. Each channel provides 16 dedicated transmit buffers and 16 receive buffers, enabling concurrent handling of high-priority diagnostics and high-bandwidth sensor data streams. This dual-channel capability is confirmed in the RA6M5 datasheet (R01DS0366EJ0150) and makes the R7FA6M5BH2CBG suitable for automotive gateway and industrial automation applications requiring redundant or segregated CAN networks.

What package type and pin count does the R7FA6M5BH2CBG use?

The R7FA6M5BH2CBG uses a 176-pin Fine-Pitch Ball Grid Array (FBGA) package with part code PLBG0176GF-A, measuring 7 mm × 7 mm with 0.5 mm pitch. It is rated for -40°C to +85°C operation and provides 132 general-purpose I/O pins, 17 of which are 5-V tolerant. This compact, high-density package supports automated assembly and thermal performance requirements typical of space-constrained industrial and networking equipment where the R7FA6M5BH2CBG is implemented.

How does the R7FA6M5BH2CBG implement secure firmware updates?

The R7FA6M5BH2CBG enables secure firmware updates through dual-bank code flash with SWAP operation and hardware-accelerated cryptography via the Secure Crypto Engine 9. The dual-bank architecture allows validation of a new firmware image in the inactive bank while the system runs from the active bank; upon successful signature verification (using RSA/ECC), the SWAP command atomically switches execution to the updated bank. This process is enforced by TrustZone and protected by the R7FA6M5BH2CBG's lifecycle management and tamper detection features, ensuring end-to-end integrity without external dependencies.

What are the supported clock sources and accuracy measurement capabilities of the R7FA6M5BH2CBG?

The R7FA6M5BH2CBG supports multiple clock sources: external 8–24 MHz crystal (MOSC), 32.768 kHz sub-clock (SOSC), and internal oscillators (HOCO/MOCO/LOCO/IWDT-OSC) with programmable trim. Its Clock Frequency Accuracy Measurement Circuit (CAC) verifies oscillator stability by counting target clock pulses against a reference clock, generating interrupts if deviation exceeds user-defined thresholds. This capability ensures reliable USB/Ethernet timing and is documented in the R7FA6M5BH2CBG datasheet section 1.3.3, directly supporting fail-safe operation in mission-critical systems.

R7FA6M5BH2CBG#BC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
176-LFBGA
Series:
RA6M5
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
132
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

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1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA6M5BH2CBG#BC0 part is unused and in its original packaging.

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1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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