Renesas R7FA6M5BH2CBG#BC0
- Part No.:
- R7FA6M5BH2CBG#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LFBGA
- Datasheet:
-
R7FA6M5BH2CBG#BC0.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 2M/512K
- Quantity:
- Payment:

- Shipping:

Inventory:4,336
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Product details
Overview
R7FA6M5BH2CBG from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 2 MB dual-bank code flash with background/swap operation, 8 KB data flash, and 512 KB SRAM with parity/ECC. It integrates Ethernet MAC, USB 2.0 High-Speed/Full-Speed, dual CAN FD, SDHI, QSPI/OSPI, advanced analog (dual 12-bit ADC/DAC), and Secure Crypto Engine 9 with TrustZone for secure IoT edge gateways and industrial controllers.
For engineers reviewing the R7FA6M5BH2CBG datasheet, R7FA6M5BH2CBG pinout, R7FA6M5BH2CBG application, or R7FA6M5BH2CBG equivalent, key selection criteria include its -40°C to +85°C temperature grade, 176-pin FBGA (PLBG0176GF-A) package, dual CAN FD support, integrated Ethernet MAC with RMII, and hardware-accelerated cryptography for secure firmware updates and device authentication.
Technical Context
The R7FA6M5BH2CBG implements Armv8-M architecture with TrustZone security extension, supporting secure/non-secure execution environments via separate MPU regions (8 per domain) and memory attribution. Its dual-bank flash enables seamless firmware updates without runtime interruption, while the SCE9 crypto engine accelerates AES, RSA, ECC, SHA256, and GHASH operations with tamper detection and 128-bit unique ID.
System-level integration includes an 8-channel DMAC, DTC, ELC for CPU-free peripheral linking, and dual GPT32/GPT16 timers for motor control. Clock management supports MOSC/SOSC/HOCO/MOCO/LOCO sources with PLL/PLL2, CAC for frequency accuracy verification, and RTC with calendar mode and VBATT backup.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M33 @ 200 MHz max; supports TrustZone and PMSAv8 MPU for secure partitioning |
| Memory | 2 MB dual-bank code flash (background/swap), 8 KB data flash (100k P/E cycles), 512 KB SRAM with parity/ECC |
| Connectivity | Dual CAN FD (16 TX/RX buffers each), Ethernet MAC (RMII only), USB 2.0 HS/FS, SDHI, QSPI/OSPI, 10× SCI, 3× I²C, 2× SPI |
| Analog | Dual 12-bit ADC (5 Msps interleaved, 26 channels), dual 12-bit DAC, on-die temperature sensor |
| Security | Secure Crypto Engine 9 (AES/RSA/ECC/SHA256/GHASH), tamper pins, lifecycle management, TrustZone memory/peripheral isolation |
| Package & Temp | 176-pin FBGA (7 mm × 7 mm, 0.5 mm pitch), -40°C to +85°C operating range |
| Power | 2.7–3.6 V supply; low-power modes including Deep Software Standby with VBATT RTC retention |
Pinout & Package
176-pin Fine-Pitch Ball Grid Array (FBGA) package, PLBG0176GF-A footprint (7 mm × 7 mm, 0.5 mm pitch), rated for -40°C to +85°C operation. Compatible with standard reflow profiles and automated assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated power/ground pairs for noise suppression; decoupling required per datasheet layout guidelines |
| VBATT | Battery backup input | Supplies RTC, SOSC, and backup registers during main power loss; supports calendar retention |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal; enables precise timing for USB/Ethernet clock recovery |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar and low-power wake-up timing |
| RES | Reset input | Active-low asynchronous reset; initiates full system initialization and security state reset |
| MD | Mode control | Configures single-chip vs. SCI/USB boot mode; must be stable during reset release |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO bus for PHY register access and configuration |
| ETH_TXD0–1 / ETH_RXD0–1 / ETH_TX_EN / ETH_CRS_DV | Ethernet RMII signals | 2-bit transmit/receive data, TX enable, and carrier sense/data valid for 10/100 Mbps operation |
| USB_VBUS / USB_DP / USB_DM | USB 2.0 High-Speed physical interface | Integrated transceiver supports HS/FS device/host; VBUS sensing enables role negotiation |
| CANFD0_TX / CANFD0_RX / CANFD1_TX / CANFD1_RX | CAN FD channel I/O | Differential signaling per ISO 11898-1; supports 5 Mbps FD data phase and legacy 1 Mbps arbitration |
| SD0_CLK / SD0_CMD / SD0_DAT0–3 | SDHI 4-bit bus interface | Supports SD/SDHC/SDXC cards up to UHS-I speeds; DMA-driven transfers reduce CPU load |
| QSPI_IO0–3 / QSPI_CLK / QSPI_CS | Quad SPI memory controller | Direct XIP-capable interface for serial flash; enables fast boot and code overlay execution |
| OSPI_IO0–7 / OSPI_CLK / OSPI_CS | Octa SPI memory controller | High-bandwidth interface for OctaFlash/OctaRAM; supports execute-in-place and memory-mapped reads |
| ADC0_AN000–12 / ADC1_AN100–15 | Analog input channels | 26 total inputs across two units; shared pins (e.g., AN000/AN100) allow flexible signal routing |
| DAC0_OUT / DAC1_OUT | Analog output channels | Independent 12-bit voltage outputs; usable for sensor calibration, bias generation, or waveform synthesis |
| CTSU_S0–14 | Capacitive touch sensing electrodes | 15-channel CTSU supports proximity, slider, and button interfaces without external components |
| GPT32A_GTIOC0A–B / GTETRGA | PWM/timer I/O | 3-phase BLDC control outputs (GTOUUP/GTOULO etc.) and external trigger inputs for synchronized motor commutation |
| SWCLK / SWDIO / TDO / TDI / TMS / TCK | Debug interface | ARM Serial Wire Debug (SWD) and JTAG-compatible; supports real-time trace via TDATA0–3 and SWO |
| NMI / IRQ0–15 | Interrupt inputs | Non-maskable and maskable interrupt sources; IRQn-DS pins retain wake capability in Deep Software Standby |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP operation | Enables zero-downtime firmware updates by validating new image in second bank before atomic bank swap |
| Secure Crypto Engine 9 + TrustZone | Hardware-accelerated cryptographic operations and memory-peripheral isolation eliminate software-only security bottlenecks |
| Ethernet MAC with RMII support | Integrated 10/100 Mbps MAC eliminates need for external MAC; RMII reduces pin count vs. MII |
| Dual CAN FD interfaces | Two independent ISO 11898-1 compliant channels support mixed classical/CAN FD networks in automotive diagnostics or industrial PLCs |
| QSPI + OSPI memory controllers | Simultaneous support for quad/octal flash enables large OTA images and high-speed data logging without external parallel memory |
| 15-channel Capacitive Touch Sensing Unit | Self-contained CTSU requires no external RC network; supports multi-touch sliders and proximity wake in HMI applications |
Applications
| Industrial Gateway | Secure Edge Node |
|---|---|
Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT over Ethernet/USB. IC Role / Device Role / Timing Role: Central protocol processor with dual CAN FD for legacy device interfacing, Ethernet MAC for upstream connectivity, and SCE9 for TLS handshake acceleration. Use Value: Reduces BOM cost by integrating dual CAN FD, Ethernet, and crypto acceleration-eliminating discrete transceivers and offload ICs. | Use Scenario: Tamper-resistant sensor node collecting vibration, temperature, and humidity data for predictive maintenance. IC Role / Device Role / Timing Role: Secure data acquisition MCU with ADC/DAC, RTC timestamping, and TrustZone-enforced firmware integrity checks. Use Value: On-chip tamper detection pins and secure boot prevent physical attacks; SCE9 enables authenticated firmware updates without host dependency. |
| Smart Building Controller | Motor Drive Interface |
Use Scenario: HVAC control unit managing fan speed, valve position, and occupancy sensing via capacitive touch panel. IC Role / Device Role / Timing Role: Real-time controller with CTSU for HMI, GPT32 timers for PWM fan control, and SDHI for local log storage. Use Value: Integrated CTSU replaces external touch ICs; 512 KB SRAM buffers sensor history while running real-time control loops. | Use Scenario: BLDC motor driver for commercial refrigeration compressors requiring precise 3-phase commutation. IC Role / Device Role / Timing Role: Motor control MCU with six GPT16 timers generating complementary PWM, AGT for current sampling sync, and CAN FD for status reporting. Use Value: Hardware GPT dead-time insertion and hall sensor inputs (GTIU/GTIV/GTIW) simplify inverter design and improve reliability over software-based timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M5BH3CFC | Same core/peripherals but 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch) and -40°C to +105°C rating | Suitable for extended-temperature industrial environments where FBGA rework is impractical | Select R7FA6M5BH3CFC when board-level thermal management exceeds 85°C ambient or when LQFP assembly infrastructure is preferred |
| R7FA6M5BH2CBM | Same flash/SRAM/crypto features but 144-pin FBGA (7 mm × 7 mm, 0.5 mm pitch) and reduced I/O count (109 vs. 132) | Targeted at space-constrained designs where Ethernet and one CAN FD channel suffice | Choose R7FA6M5BH2CBM to reduce PCB area and BOM cost when full 176-pin I/O and dual CAN FD are not required |
Compared with R7FA6M5BH2CBG, R7FA6M5BH3CFC offers higher temperature tolerance in a larger LQFP package, while R7FA6M5BH2CBM delivers identical security and connectivity in a smaller FBGA with fewer I/Os-enabling scalable platform design across thermal and density requirements.
Availability
R7FA6M5BH2CBG is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, smart building controllers, and motor drive interfaces requiring stable component supply across long production lifecycles.
Supply support for R7FA6M5BH2CBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets.
The RA6M5 Group targets secure, high-performance edge computing applications, combining Arm Cortex-M33 with integrated connectivity (Ethernet, CAN FD, USB HS), advanced analog, and hardware crypto to accelerate development of certified industrial and IoT devices.
FAQ
What is the maximum operating frequency and core architecture of the R7FA6M5BH2CBG?
The R7FA6M5BH2CBG features an Arm Cortex-M33 core operating at up to 200 MHz, based on the Armv8-M architecture with security extensions. It implements TrustZone for hardware-enforced secure/non-secure world separation and includes dual 8-region MPUs for memory protection in both domains. This architecture enables deterministic real-time performance while maintaining robust security boundaries essential for industrial and IoT deployments where the R7FA6M5BH2CBG is deployed.
Does the R7FA6M5BH2CBG support dual CAN FD, and what are the buffer configurations?
Yes, the R7FA6M5BH2CBG integrates two independent CAN FD modules compliant with ISO 11898-1, each supporting classical CAN and CAN FD frames. Each channel provides 16 dedicated transmit buffers and 16 receive buffers, enabling concurrent handling of high-priority diagnostics and high-bandwidth sensor data streams. This dual-channel capability is confirmed in the RA6M5 datasheet (R01DS0366EJ0150) and makes the R7FA6M5BH2CBG suitable for automotive gateway and industrial automation applications requiring redundant or segregated CAN networks.
What package type and pin count does the R7FA6M5BH2CBG use?
The R7FA6M5BH2CBG uses a 176-pin Fine-Pitch Ball Grid Array (FBGA) package with part code PLBG0176GF-A, measuring 7 mm × 7 mm with 0.5 mm pitch. It is rated for -40°C to +85°C operation and provides 132 general-purpose I/O pins, 17 of which are 5-V tolerant. This compact, high-density package supports automated assembly and thermal performance requirements typical of space-constrained industrial and networking equipment where the R7FA6M5BH2CBG is implemented.
How does the R7FA6M5BH2CBG implement secure firmware updates?
The R7FA6M5BH2CBG enables secure firmware updates through dual-bank code flash with SWAP operation and hardware-accelerated cryptography via the Secure Crypto Engine 9. The dual-bank architecture allows validation of a new firmware image in the inactive bank while the system runs from the active bank; upon successful signature verification (using RSA/ECC), the SWAP command atomically switches execution to the updated bank. This process is enforced by TrustZone and protected by the R7FA6M5BH2CBG's lifecycle management and tamper detection features, ensuring end-to-end integrity without external dependencies.
What are the supported clock sources and accuracy measurement capabilities of the R7FA6M5BH2CBG?
The R7FA6M5BH2CBG supports multiple clock sources: external 8–24 MHz crystal (MOSC), 32.768 kHz sub-clock (SOSC), and internal oscillators (HOCO/MOCO/LOCO/IWDT-OSC) with programmable trim. Its Clock Frequency Accuracy Measurement Circuit (CAC) verifies oscillator stability by counting target clock pulses against a reference clock, generating interrupts if deviation exceeds user-defined thresholds. This capability ensures reliable USB/Ethernet timing and is documented in the R7FA6M5BH2CBG datasheet section 1.3.3, directly supporting fail-safe operation in mission-critical systems.
R7FA6M5BH2CBG#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LFBGA
- Series:
- RA6M5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 132
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M5BH2CBG#BC0 FAQ
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All R7FA6M5BH2CBG#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5BH2CBG#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA6M5BH2CBG#BC0?
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1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M5BH2CBG#BC0 part is unused and in its original packaging.
Return procedure for R7FA6M5BH2CBG#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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