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Renesas R7FA6M5BH2CBM#BC0

Part No.:
R7FA6M5BH2CBM#BC0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LFBGA
Datasheet:
AetrixR7FA6M5BH2CBM#BC0.pdf
Description:
MCU:RA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,030

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Product details

Overview

R7FA6M5BH2CBM#BC0 from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 2 MB dual-bank code flash with background/swap operation, 8 KB data flash, and 512 KB SRAM with parity/ECC. It integrates Ethernet MAC, USB 2.0 High-Speed, dual CAN FD, SDHI, QSPI/OSPI, advanced analog (dual 12-bit ADC/DAC), and Secure Crypto Engine 9 with TrustZone for secure embedded applications such as industrial gateways and connected HMI systems.

For engineers reviewing the R7FA6M5BH2CBM#BC0 datasheet, R7FA6M5BH2CBM#BC0 pinout, R7FA6M5BH2CBM#BC0 application, or R7FA6M5BH2CBM#BC0 equivalent, key selection considerations include its -40°C to +85°C temperature grade, 144-pin FBGA package, dual CAN FD support, integrated Ethernet MAC with RMII interface, and hardware-accelerated cryptography (AES/RSA/ECC/SHA256) for secure boot and firmware updates.

Technical Context

The R7FA6M5BH2CBM#BC0 implements Armv8-M architecture with TrustZone security extension, supporting secure/non-secure MPU regions (8+8), dual SysTick timers, and CoreSight ETM-M33 for trace. Its memory subsystem includes dual-bank flash enabling live firmware updates without interruption and ECC-protected SRAM for safety-critical operation.

Connectivity is centered on deterministic real-time interfaces: two CAN FD controllers (16 TX/RX buffers each), Ethernet MAC with DMA coupling to EDMAC, USBHS host/device mode with internal transceiver, and QSPI/OSPI for external XIP-capable memory. Analog subsystem features interleaved 5 Msps dual 12-bit ADCs with shared input channels and on-die temperature sensor.

Key Specifications

Parameter Value and Actual Design Meaning
Core Arm Cortex-M33 @ 200 MHz with TrustZone, PMSAv8 MPU (8 secure + 8 non-secure regions)
Memory 2 MB dual-bank code flash (background/swap), 8 KB data flash (100k P/E cycles), 512 KB SRAM with parity/ECC
Operating Temp -40°C to +85°C - qualified for industrial ambient environments without derating
Package 144-pin FBGA (7 mm × 7 mm, 0.5 mm pitch) - compact footprint with 109 I/O pins and 21 5-V-tolerant inputs
Security Secure Crypto Engine 9 (AES-128/256, RSA-2048/4096, ECC-256/384, SHA224/256), tamper detection, lifecycle management
Connectivity Dual CAN FD (ISO 11898-1), USB 2.0 High-Speed host/device, Ethernet MAC (RMII), SDHI, QSPI, OSPI, 10× SCI, 3× I²C, 2× SPI
Analog Dual 12-bit ADC12 (5 Msps interleaved, 26 total channels), dual 12-bit DAC12, on-die temperature sensor (TSN)

Pinout & Package

144-pin Fine-Pitch Ball Grid Array (FBGA) package, PLBG0144KB-A footprint (7 mm × 7 mm, 0.5 mm pitch), rated for -40°C to +85°C operation. Features 109 general-purpose I/O pins, 21 of which are 5-V tolerant, plus dedicated power (VCC/VSS/VBATT), clock (XTAL/EXTAL/XCIN/XCOUT), debug (SWDIO/SWCLK/SWO), and peripheral-specific pins.

Pin/Terminal Circuit Role Design Meaning
VCC / VSS Power supply / Ground Core logic power (2.7–3.6 V); decoupling required per datasheet layout guidelines
VBATT Battery backup input Supplies RTC, SOSC, and backup registers during main power loss
XTAL / EXTAL Main crystal oscillator interface Supports 8–24 MHz crystal; enables precise timing for Ethernet/USB synchronization
XCIN / XCOUT Sub-clock oscillator interface 32.768 kHz crystal connection for RTC calendar and low-power wake-up
SWDIO / SWCLK / SWO Serial Wire Debug interface Enables full JTAG/SWD debugging, trace, and programming without external emulator
ETH_MDC / ETH_MDIO / ETH_RXD[0:3] / ETH_TXD[0:3] / ETH_CRS_DV / ETH_TX_EN / ETH_REF_CLK Ethernet PHY interface (RMII) Direct 2-wire MII (RMII) connection to external PHY; no external MAC required
CANFD0_TX / CANFD0_RX / CANFD1_TX / CANFD1_RX CAN FD transceiver interface Dedicated differential pairs per channel; supports ISO 11898-1 FD frames up to 5 Mbps
USB_VBUS / USB_DP / USB_DM / USB_ID USB 2.0 High-Speed physical layer Integrated transceiver supports host/device mode; VBUS sensing enables OTG role negotiation

Key Features

Feature Design Value
Dual-bank flash with SWAP operation Enables seamless firmware updates in field-deployed devices without service interruption
Hardware crypto acceleration (SCE9) Offloads AES/RSA/ECC/SHA operations from CPU, reducing boot time and improving TLS handshake latency
TrustZone-enabled peripheral attribution Allows secure peripherals (e.g., SCE9, RTC, tamper pins) to be isolated from non-secure firmware partitions
Event Link Controller (ELC) Enables zero-CPU-latency peripheral chaining (e.g., ADC trigger → DMA transfer → interrupt) for deterministic response
Capacitive Touch Sensing Unit (CTSU) Supports up to 20 touch channels with noise immunity; eliminates need for external touch controller IC

Applications

Industrial Gateway Secure Edge Node

Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT over Ethernet/USB.

IC Role / Device Role / Timing Role: Central protocol processor with dual CAN FD for legacy bus bridging, Ethernet MAC for upstream connectivity, and SCE9 for TLS 1.2/1.3 encryption.

Use Value: Eliminates external crypto co-processor and reduces BOM cost while meeting IEC 62443-3-3 SL2 requirements via TrustZone isolation.

Use Scenario: Tamper-resistant sensor aggregator in smart metering with battery-backed RTC and secure firmware updates.

IC Role / Device Role / Timing Role: Secure runtime environment with SCE9 key wrapping, VBATT-powered RTC calendar, and dual-bank flash enabling signed OTA updates.

Use Value: Achieves FIPS 140-2 Level 2 equivalent assurance through hardware-enforced key protection and power-fail-safe update rollback.

HMI Controller Medical Data Logger

Use Scenario: Touch-enabled display controller for medical equipment UI with audio feedback via SSIE.

IC Role / Device Role / Timing Role: CTSU-driven capacitive touch interface, SSIE master for I²S audio codec, and USBHS device for PC configuration.

Use Value: Integrates touch, audio, and USB into single chip-reducing PCB layers and EMI risk versus multi-chip solutions.

Use Scenario: Portable diagnostic device logging ECG waveforms via ADC12 at 5 Msps with timestamped storage to SD card.

IC Role / Device Role / Timing Role: High-speed ADC acquisition engine with DMA-to-SDHI path, RTC calendar timestamping, and ECC-SRAM for data integrity.

Use Value: Meets IEC 60601-1 clause 15.3.2 for data retention integrity during power loss using parity/ECC SRAM and battery-backed RTC.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R7FA6M5BH3CBM#BC0 Identical silicon; rated for -40°C to +105°C industrial extended temperature range Required for under-hood automotive or high-ambient industrial enclosures Select when ambient operating temperature exceeds +85°C; same pinout and firmware compatibility
R7FA6M5AH3CBM#BC0 Same package and temperature grade, but supports Classical CAN only (no CAN FD) Suitable for legacy CAN networks where FD bandwidth or data payload >8 bytes not needed Lower-cost option if CAN FD is unnecessary; retains all other peripherals including Ethernet, USBHS, and SCE9

Compared with R7FA6M5BH2CBM#BC0, the R7FA6M5BH3CBM#BC0 extends thermal reliability for harsh environments without sacrificing performance or security, while the R7FA6M5AH3CBM#BC0 reduces cost by removing CAN FD capability-making it ideal for cost-sensitive CAN 2.0B-only designs requiring identical secure runtime features.

Availability

R7FA6M5BH2CBM#BC0 is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, HMI controllers, and medical data loggers requiring stable component supply across long product lifecycles.

Supply support for R7FA6M5BH2CBM#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.

The RA6M5 Group, including R7FA6M5BH2CBM#BC0, is designed for secure, high-performance embedded applications demanding real-time connectivity (Ethernet/CAN FD/USB), hardware cryptography, and functional safety support.

FAQ

What is the maximum operating frequency of the R7FA6M5BH2CBM#BC0?

The R7FA6M5BH2CBM#BC0 operates at a maximum frequency of 200 MHz using its Arm Cortex-M33 core. This speed is achievable with the on-chip PLL driven by the main crystal oscillator (8–24 MHz) or high-speed on-chip oscillator (HOCO). The core maintains full performance across its specified -40°C to +85°C temperature range without throttling.

Does the R7FA6M5BH2CBM#BC0 support CAN FD, and how many channels are available?

Yes, the R7FA6M5BH2CBM#BC0 supports CAN with Flexible Data-rate (CAN FD) on two independent channels (CANFD0 and CANFD1), each with 16 transmit and 16 receive buffers. It complies fully with ISO 11898-1 and supports FD frame payloads up to 64 bytes and bit rates up to 5 Mbps, making it suitable for high-bandwidth automotive and industrial networking.

What package type and pin count does the R7FA6M5BH2CBM#BC0 use?

The R7FA6M5BH2CBM#BC0 uses a 144-pin Fine-Pitch Ball Grid Array (FBGA) package with 7 mm × 7 mm dimensions and 0.5 mm pitch (PLBG0144KB-A). It provides 109 general-purpose I/O pins, 21 of which are 5-V tolerant, along with dedicated power, clock, debug, and peripheral interface balls.

How does the Secure Crypto Engine 9 (SCE9) in the R7FA6M5BH2CBM#BC0 enhance security?

The SCE9 in the R7FA6M5BH2CBM#BC0 provides hardware-accelerated cryptographic operations including AES-128/256, RSA-2048/4096, ECC-256/384, and SHA224/256. It supports secure key generation, storage, and wrapping, tamper detection, and power analysis resistance-enabling secure boot, encrypted firmware updates, and TLS offload without exposing keys to software.

Is the R7FA6M5BH2CBM#BC0 compatible with Renesas' Flexible Software Package (FSP)?

Yes, the R7FA6M5BH2CBM#BC0 is fully supported by Renesas' Flexible Software Package (FSP) v4.x and later. FSP provides HAL drivers, middleware (including USB Host/Device stacks, Ethernet TCP/IP, CAN FD, and SCE9 crypto APIs), and example projects validated for this part, accelerating development of secure, connected embedded applications.

R7FA6M5BH2CBM#BC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LFBGA
Series:
RA6M5
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
109
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 25x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R7FA6M5BH2CBM#BC0 FAQ

1.How can I place an order for R7FA6M5BH2CBM#BC0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R7FA6M5BH2CBM#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R7FA6M5BH2CBM#BC0 reliable?

The price and inventory of R7FA6M5BH2CBM#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M5BH2CBM#BC0 is usually 5 days.

3.What payment methods are accepted for R7FA6M5BH2CBM#BC0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M5BH2CBM#BC0 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R7FA6M5BH2CBM#BC0?

R7FA6M5BH2CBM#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R7FA6M5BH2CBM#BC0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R7FA6M5BH2CBM#BC0?

For technical support, including R7FA6M5BH2CBM#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M5BH2CBM#BC0 requirements.

6.How does Aetrix verify that R7FA6M5BH2CBM#BC0 is sourced from the original manufacturer or authorized distributors?

All R7FA6M5BH2CBM#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5BH2CBM#BC0 meets industry standards.

7.What is the process for return or replacement of R7FA6M5BH2CBM#BC0?

All R7FA6M5BH2CBM#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5BH2CBM#BC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA6M5BH2CBM#BC0 part is unused and in its original packaging.

Return procedure for R7FA6M5BH2CBM#BC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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