Renesas R7FA6M5BH3CBM#BC0

Overview

R7FA6M5BH3CBM#BC0 from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 1 MB dual-bank code flash with background and SWAP operation, 8 KB data flash, 256 KB SRAM with ECC/parity, integrated Ethernet MAC, USB 2.0 Full-Speed, SDHI, QSPI/OSPI, dual CAN, and Secure Crypto Engine (SCE9) with TrustZone for secure embedded applications in industrial gateways and networked HMI systems.

For engineers reviewing the R7FA6M5BH3CBM#BC0 datasheet, R7FA6M5BH3CBM#BC0 pinout, R7FA6M5BH3CBM#BC0 application, or R7FA6M5BH3CBM#BC0 equivalent, key selection considerations include its 144-pin BGA package (7 mm × 7 mm, 0.50 mm pitch), -40°C to +105°C extended temperature rating, dual CAN interfaces with ISO 11898-1 compliance, Ethernet MAC with RMII support, and SCE9-accelerated AES/RSA/ECC/SHA256 for firmware signing and secure boot.

Technical Context

The R7FA6M5BH3CBM#BC0 implements Armv8-M architecture with TrustZone security extension, enabling hardware-isolated secure and non-secure execution environments. It integrates dual 12-bit ADCs (5 Msps interleaved), two 12-bit DACs, CTSU for capacitive touch, and six AGT timers for low-power event timing - all accessible within both security states via configurable peripheral attribution.

Its system-level integration includes an 8-channel DMAC, DTC, ELC for CPU-free peripheral linking, and dual PLLs supporting precise clock domain management across Ethernet, USB, and audio (SSIE) subsystems. The device supports deterministic real-time operation via GPT32/GPT16 PWM timers with Hall sensor inputs and 3-phase BLDC motor control outputs (GTOUUP/GTOULO etc.).

Key Specifications

Pinout & Package

144-pin Fine-Pitch Ball Grid Array (FBGA), 7 mm × 7 mm body, 0.50 mm ball pitch, PLBG0144KB-A package code. RoHS-compliant, Pb-free Sn terminal finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.

Compared with R7FA6M5BH3CBM#BC0, R7FA6M4AF3CBM offers identical package and core performance but omits OSPI-limiting high-speed external memory expansion-while STM32H743VI delivers higher CPU throughput at the expense of integrated networking, security acceleration, and industrial temperature reliability.

Availability

R7FA6M5BH3CBM#BC0 is available at Aetrix Electronics and suitable for industrial gateways, secure edge controllers, networked HMIs, and BLDC motor drives requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for R7FA6M5BH3CBM#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The RA6M4 group-including R7FA6M5BH3CBM#BC0-is designed for secure, connected industrial applications requiring real-time performance, functional safety readiness, and hardware-enforced security via TrustZone and SCE9.

FAQ

What is the maximum operating frequency of the R7FA6M5BH3CBM#BC0?

The R7FA6M5BH3CBM#BC0 operates at a maximum frequency of 200 MHz using its Arm Cortex-M33 core. This speed is achievable with the main clock oscillator (MOSC) or PLL-driven system clock, and is validated across the full -40°C to +105°C temperature range. The device includes clock accuracy measurement circuitry (CAC) to verify frequency stability in production systems.

Does the R7FA6M5BH3CBM#BC0 include an integrated Ethernet PHY?

No, the R7FA6M5BH3CBM#BC0 integrates only the Ethernet MAC layer (ETHERC) compliant with IEEE 802.3, not a physical layer transceiver. It supports RMII interface, requiring an external PHY such as the LAN8742A or KSZ8081RND. The RMII pinout (ETH_RMII_RXD0/1, TXD0/1, CRS_DV, REF_CLK) is routed directly from the MCU to the PHY with minimal external components.

How many CAN interfaces does the R7FA6M5BH3CBM#BC0 support, and what standards do they comply with?

The R7FA6M5BH3CBM#BC0 integrates two independent CAN modules compliant with ISO 11898-1 (CAN 2.0A and CAN 2.0B). Each supports up to 32 mailboxes configurable for transmit/receive in normal or FIFO mode, and handles both standard (11-bit) and extended (29-bit) identifier formats. External CAN transceivers (e.g., TJA1042T/3) must be used for physical layer interfacing.

What security features are implemented in hardware on the R7FA6M5BH3CBM#BC0?

The R7FA6M5BH3CBM#BC0 implements Arm TrustZone for hardware-enforced secure/non-secure memory and peripheral partitioning, plus the Secure Crypto Engine 9 (SCE9) coprocessor. SCE9 provides hardware acceleration for AES-128/256, RSA-2048/4096, ECC, SHA224/256, and includes a 128-bit unique ID, tamper detection pins, and lifecycle management registers-all accessible only from the secure world.

What package type and pin count does the R7FA6M5BH3CBM#BC0 use?

The R7FA6M5BH3CBM#BC0 uses a 144-pin Fine-Pitch Ball Grid Array (FBGA) package measuring 7 mm × 7 mm with 0.50 mm ball pitch, designated PLBG0144KB-A. It provides 109 general-purpose I/O pins, 21 of which are 5-V tolerant, and supports industrial temperature operation from -40°C to +105°C.