Renesas R7FA6M5BH3CFB#BA0
- Part No.:
- R7FA6M5BH3CFB#BA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R7FA6M5BH3CFB#BA0.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 2M/512K
- Quantity:
- Payment:

- Shipping:

Inventory:4,951
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Product details
Overview
R7FA6M5BH3CFB#BA0 from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 2 MB dual-bank code flash with background/swap operation, 8 KB data flash, and 512 KB SRAM with parity/ECC. It integrates Ethernet MAC, USB 2.0 High-Speed, dual CAN FD, SDHI, QSPI/OSPI, and Secure Crypto Engine (SCE9) with TrustZone for secure IoT gateway and industrial edge controller applications.
For engineers reviewing the R7FA6M5BH3CFB#BA0 datasheet, R7FA6M5BH3CFB#BA0 pinout, R7FA6M5BH3CFB#BA0 application, or R7FA6M5BH3CFB#BA0 equivalent, key selection considerations include its -40°C to +105°C temperature rating, 144-pin LQFP package, dual CAN FD support, integrated Ethernet MAC with RMII interface, and hardware-accelerated AES/RSA/ECC cryptography.
Technical Context
The R7FA6M5BH3CFB#BA0 implements Armv8-M with TrustZone security extension, supporting secure/non-secure execution states via separate MPU regions (8 per state) and dedicated SysTick timers. Its memory subsystem includes dual-bank flash enabling live firmware updates without interruption and ECC-protected SRAM for functional safety compliance.
Connectivity is centered on deterministic real-time interfaces: two CAN FD controllers (16 TX/RX buffers each), Ethernet MAC with DMA coupling to EDMAC, USBHS host/device operation, and QSPI/OSPI for external XIP-capable memory. The SCE9 crypto engine offloads AES-128/256, RSA-2048/3072, ECC-P256/P384, and SHA256 operations while enforcing tamper detection and lifecycle management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M33 @ 200 MHz with TrustZone, PMSAv8 MPU, dual SysTick |
| Memory | 2 MB dual-bank code flash (background/swap), 8 KB data flash (100k P/E cycles), 512 KB SRAM with parity/ECC |
| Operating Temp | -40°C to +105°C - qualified for industrial edge and automotive under-hood control |
| Package | 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch) - compatible with standard reflow and manual inspection |
| Security | SCE9 crypto engine with AES/RSA/ECC/SHA acceleration, tamper pins, TrustZone memory/peripheral isolation |
| Connectivity | Dual CAN FD (ISO 11898-1), Ethernet MAC (RMII), USB 2.0 HS/FS, SDHI, QSPI/OSPI, SCI×10, I²C×3, SPI×2 |
| Analog | ADC12×2 (13/16 ch, 5 Msps interleaved), DAC12×2, TSN, CTSU (15 electrodes) |
Pinout & Package
144-pin LQFP (PLQP0144KA-B), 20 mm × 20 mm, 0.5 mm pitch, -40°C to +105°C operating range. Pin count includes 109 I/O pins, 1 input-only pin, 110 pull-up resistors, 109 N-ch open-drain outputs, and 21 5-V tolerant inputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Primary core power domain (2.7–3.6 V); decoupling required per datasheet layout guidelines |
| VBATT | Battery backup input | Supplies RTC, SOSC, and backup registers during main power loss - enables calendar retention |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–24 MHz crystals; enables precise timing for Ethernet, USB, and real-time control loops |
| MD / RES | Mode select / Reset input | Hardwired configuration for single-chip vs. boot mode; active-low asynchronous reset with glitch filtering |
| ETXD0–3 / ERXD0–3 | Ethernet RMII data lines | 4-bit transmit/receive bus for 10/100 Mbps Ethernet - requires impedance-controlled PCB routing |
| EREF_CLK | Ethernet reference clock | 50 MHz input for RMII interface - sourced externally or from internal PLL for synchronous operation |
| CANFD0_TX / CANFD0_RX | CAN FD Channel 0 differential pair | High-speed (up to 5 Mbps) and classical CAN (1 Mbps) signaling - supports ISO 11898-1 compliant transceivers |
| USB_VBUS / USB_DP / USB_DM | USB 2.0 High-Speed interface | Dedicated VBUS sensing and differential data lines - enables host/device role switching without external PHY |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP operation | Enables seamless firmware updates in field-deployed devices without service interruption or external memory |
| Hardware crypto acceleration (SCE9) | Reduces AES-256 encryption latency to <10 µs per 128-bit block and supports key wrapping with tamper-resistant storage |
| TrustZone-enforced peripheral attribution | Allows secure bootloader, OTA update manager, and cryptographic key store to run in isolated secure world |
| RMII Ethernet MAC with EDMAC | Offloads TCP/IP stack processing via zero-copy DMA transfers - achieves >85% line-rate throughput at 100 Mbps |
| AGT timers with deep standby wake capability | 6 low-power 16-bit timers retain counting during Deep Software Standby mode - ideal for battery-powered sensor nodes |
| CTSU with 15-electrode support | Capacitive touch sensing with built-in noise rejection - eliminates need for external touch controller in HMI designs |
Applications
| Industrial PLC Controller | Secure IoT Gateway |
|---|---|
|
Use Scenario: Programmable logic controller managing motor drives, I/O modules, and fieldbus communication in factory automation. IC Role / Device Role / Timing Role: Central real-time controller executing deterministic ladder logic with sub-100 µs I/O scan cycles and synchronized motion control via GPT32 PWM outputs. Use Value: Dual CAN FD and Ethernet MAC enable concurrent integration of legacy fieldbuses and cloud connectivity, while SCE9 secures firmware updates against unauthorized modification. |
Use Scenario: Edge gateway aggregating sensor data from Modbus RTU, CAN, and BLE peripherals before forwarding to cloud platforms via TLS-secured MQTT. IC Role / Device Role / Timing Role: Secure protocol translator with hardware-accelerated TLS handshake using SCE9 and TrustZone-isolated key storage. Use Value: Integrated USBHS and SDHI allow local firmware recovery and log storage; 512 KB ECC SRAM ensures data integrity during power-loss events. |
| Medical Diagnostic Device | Automotive Body Control Module |
|
Use Scenario: Portable ultrasound or patient monitor requiring analog signal acquisition, display rendering, and HIPAA-compliant data export. IC Role / Device Role / Timing Role: Mixed-signal processor handling ADC12 sampling at 5 Msps, SSIE audio output, and encrypted USB mass storage transfer. Use Value: On-chip DAC12 and CTSU enable front-panel touch UI and analog calibration; 109 GPIOs support modular sensor expansion. |
Use Scenario: In-vehicle body controller managing door locks, lighting, HVAC, and diagnostics across multiple CAN FD networks. IC Role / Device Role / Timing Role: Fault-tolerant controller with dual CAN FD channels, watchdog supervision (WDT/IWDT), and battery-backed RTC for event logging. Use Value: -40°C to +105°C rating and VBATT support ensure reliable operation in under-hood environments; SCE9 enables secure ECU reprogramming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M5BH3CFC#AA0 | 176-pin LQFP package; adds external 16-bit bus interface (ECBIU) and 23 additional GPIOs | Better suited for systems requiring external parallel memory or FPGA co-processing | Select when board layout allows larger footprint and external memory bandwidth is critical |
| R7FA6M5BH2CBM#AA0 | 144-pin BGA package; same feature set but rated for -40°C to +85°C and uses FBGA instead of LQFP | Preferred for space-constrained consumer or commercial applications without extended temperature needs | Choose for compact designs where thermal margin permits reduced temperature grade |
Compared with R7FA6M5BH3CFB#BA0, the LQFP-176 variant offers higher I/O count and external bus access at the cost of PCB area, while the BGA-144 alternative trades package manufacturability and thermal performance for identical functionality at lower ambient temperature tolerance.
Availability
R7FA6M5BH3CFB#BA0 is available at Aetrix Electronics and suitable for industrial edge controllers, secure IoT gateways, and automotive body electronics requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R7FA6M5BH3CFB#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RA6M5 Group, including R7FA6M5BH3CFB#BA0, was designed for secure, real-time edge computing - integrating Arm TrustZone, hardware crypto, and rich connectivity to accelerate development of certified industrial and IoT endpoints.
FAQ
What is the maximum operating frequency and core architecture of the R7FA6M5BH3CFB#BA0?
The R7FA6M5BH3CFB#BA0 features an Arm Cortex-M33 core operating at up to 200 MHz, implementing the Armv8-M architecture with security extensions. It includes TrustZone for hardware-enforced secure/non-secure worlds, dual SysTick timers, and PMSAv8-based Memory Protection Unit with eight regions per security state - all confirmed in the R01DS0366EJ0150 datasheet Rev.1.50.
Does the R7FA6M5BH3CFB#BA0 support dual CAN FD, and what are the buffer configurations?
Yes, the R7FA6M5BH3CFB#BA0 integrates two independent CAN FD controllers compliant with ISO 11898-1, each providing 16 dedicated transmit buffers and 16 receive buffers. This enables concurrent high-bandwidth communication on separate CAN FD networks - essential for automotive body control and industrial multi-bus systems - as specified in Section 1.8 of the R01DS0366EJ0150 datasheet.
What package type and pin count does the R7FA6M5BH3CFB#BA0 use?
The R7FA6M5BH3CFB#BA0 uses a 144-pin LQFP package (PLQP0144KA-B) measuring 20 mm × 20 mm with 0.5 mm pitch. It provides 109 general-purpose I/O pins, 21 of which are 5-V tolerant, and supports -40°C to +105°C operation - matching the "FB" package code in Renesas' part numbering scheme (Figure 1.2, R01DS0366EJ0150).
How does the Secure Crypto Engine (SCE9) in the R7FA6M5BH3CFB#BA0 accelerate cryptographic operations?
The SCE9 in R7FA6M5BH3CFB#BA0 accelerates AES-128/256 encryption/decryption, RSA-2048/3072 signing/verification, ECC-P256/P384 operations, and SHA256 hashing - reducing AES-256 latency to under 10 µs per block. It includes tamper detection circuitry, secure key storage, and integrates with Arm TrustZone to isolate crypto operations from non-secure software, as documented in Section 1.11 of R01DS0366EJ0150.
Is the R7FA6M5BH3CFB#BA0 pin-compatible with other RA6M5 group members?
No, the R7FA6M5BH3CFB#BA0 is not pin-compatible with other RA6M5 variants due to differing package types: it uses a 144-pin LQFP (FB), whereas alternatives like R7FA6M5BH3CFC#AA0 use 176-pin LQFP (FC) and R7FA6M5BH2CBM#AA0 use 144-pin BGA (BM). Pin counts, I/O allocations, and power/ground pin distributions differ across packages - verified in Table 1.13 and Section 1.12 of R01DS0366EJ0150.
R7FA6M5BH3CFB#BA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RA6M5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, Ethernet, I2C, MMC/SD, SCI, SPI, QSPI, UART/USART, USB
- Peripherals:
- Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 109
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 25x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M5BH3CFB#BA0 FAQ
1.How can I place an order for R7FA6M5BH3CFB#BA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M5BH3CFB#BA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M5BH3CFB#BA0 reliable?
The price and inventory of R7FA6M5BH3CFB#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M5BH3CFB#BA0 is usually 5 days.
3.What payment methods are accepted for R7FA6M5BH3CFB#BA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M5BH3CFB#BA0 transactions.
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Once your R7FA6M5BH3CFB#BA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M5BH3CFB#BA0?
For technical support, including R7FA6M5BH3CFB#BA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M5BH3CFB#BA0 requirements.
6.How does Aetrix verify that R7FA6M5BH3CFB#BA0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M5BH3CFB#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5BH3CFB#BA0 meets industry standards.
7.What is the process for return or replacement of R7FA6M5BH3CFB#BA0?
All R7FA6M5BH3CFB#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5BH3CFB#BA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M5BH3CFB#BA0 part is unused and in its original packaging.
Return procedure for R7FA6M5BH3CFB#BA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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