Renesas R7FA6M5BH3CFC#AA0
- Part No.:
- R7FA6M5BH3CFC#AA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
R7FA6M5BH3CFC#AA0.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 176LFQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
R7FA6M5BH3CFC from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 2 MB dual-bank code flash with background/swap operation, 8 KB data flash, 512 KB SRAM with ECC/parity, integrated Ethernet MAC, USB 2.0 High-Speed/Full-Speed, dual CAN FD, QSPI/OSPI, and Secure Crypto Engine (SCE9) with TrustZone support - deployed in industrial gateways requiring real-time connectivity, secure firmware updates, and deterministic motor control.
For engineers reviewing the R7FA6M5BH3CFC datasheet, R7FA6M5BH3CFC pinout, R7FA6M5BH3CFC application, or R7FA6M5BH3CFC equivalent, key selection criteria include its -40°C to +105°C extended temperature rating, 176-pin LQFP package, dual CAN FD interfaces for automotive diagnostics, hardware-accelerated AES/RSA/ECC cryptography, and integrated CTSU for touch HMI in harsh environments.
Technical Context
The R7FA6M5BH3CFC implements Armv8-M architecture with TrustZone-enforced secure/non-secure execution states, supporting concurrent secure boot, encrypted OTA updates, and isolated peripheral access control. Its dual-bank flash enables seamless firmware swapping without runtime interruption, while SCE9 accelerates AES-128/256, RSA-2048/4096, ECC-P256/P384, and SHA256 operations.
System-level integration includes an Ethernet MAC compliant with IEEE 802.3, USBHS/USBFS modules with internal transceivers and 10-pipe FIFOs, two independent CAN FD controllers each with 16 TX/RX buffers, and a 12-bit ADC12 (dual unit, up to 26 channels) with interleaved sampling at 5 Msps - all synchronized via Event Link Controller (ELC) for CPU-free peripheral coordination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M33 @ 200 MHz max; supports TrustZone security extension and PMSAv8 MPU with 8 secure + 8 non-secure regions. |
| Memory | 2 MB dual-bank code flash (background/swap), 8 KB data flash (100k P/E cycles), 512 KB SRAM with ECC/parity protection. |
| Connectivity | Dual CAN FD (ISO 11898-1), USB 2.0 HS/FS (internal PHY, 10 pipes), Ethernet MAC (RMII), QSPI/OSPI, SDHI, 10× SCI, 3× I²C, 2× SPI. |
| Analog | Dual 12-bit ADC12 (unit 0: 13 ch, unit 1: 16 ch; shared pins; 5 Msps interleaved), dual 12-bit DAC12, on-die temperature sensor (TSN). |
| Security | Secure Crypto Engine 9 (AES/RSA/ECC/SHA256), 128-bit unique ID, tamper detection, power analysis resistance, lifecycle management. |
| Package & Temp | 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), industrial grade: -40°C to +105°C operating temperature. |
Pinout & Package
Package: 176-pin LQFP (PLQP0176KB-C), 24 mm × 24 mm, 0.5 mm pitch, lead-free (Sn), RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Core logic supply (2.7–3.6 V); decoupling required per datasheet layout guidelines. |
| XTAL / EXTAL | Main clock oscillator interface | Supports 8–24 MHz crystal or external clock input for system timing reference. |
| VBATT | Battery backup input | Supplies RTC, SOSC, and backup memory during main power loss; enables calendar retention. |
| RES | Reset input | Active-low asynchronous reset; initiates full system initialization sequence. |
| MD | Mode control | Configures single-chip vs. SCI/USB boot mode at power-on; must remain stable during reset release. |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO/MDC bus for PHY register configuration and status monitoring. |
| USB_VBUS / USB_DP / USB_DM | USB 2.0 High-Speed interface | Dedicated pins for USBHS host/device operation with internal transceiver; supports high-speed (480 Mbps) signaling. |
| CANFD0_TX / CANFD0_RX | CAN FD Channel 0 | Direct connection to CAN FD transceiver; supports classical CAN and CAN FD frames up to 8 Mbps. |
| SCI0_TXD / SCI0_RXD | Asynchronous serial interface | UART channel 0 with independent baud rate generator; supports RS-232/RS-485 level-shifting via external drivers. |
| CTSU0_TS00–TS14 | Capacitive touch sensing | 15-channel CTSU electrode inputs for proximity/touch buttons/sliders; supports self- and mutual-capacitance modes. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP operation | Enables zero-downtime firmware updates: one bank executes while the other is reprogrammed, then atomic bank switch occurs. |
| Hardware crypto acceleration (SCE9) | Offloads AES-128/256 encryption/decryption, RSA-2048/4096 signing/verification, and SHA256 hashing from CPU - reducing latency by >90% vs. software-only. |
| Event Link Controller (ELC) | Routes 128+ peripheral event signals (e.g., ADC EOC, timer overflow) directly between modules without CPU intervention - enabling deterministic low-latency response. |
| Integrated Ethernet MAC + DMA | IEEE 802.3-compliant MAC with embedded EDMAC controller; supports scatter-gather DMA for zero-copy packet processing and TCP/IP stack offload. |
| Secure boot with TrustZone | Verifies signed firmware image integrity and authenticity before execution; isolates secure bootloader, crypto keys, and critical peripherals from non-secure application code. |
Applications
| Industrial Gateway | Secure Edge Node |
|---|---|
Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT brokers over cellular/Wi-Fi, with local edge analytics. IC Role / Device Role / Timing Role: Central application processor managing dual CAN FD for legacy PLC communication, Ethernet for upstream backhaul, and SCE9 for TLS 1.3 handshake acceleration. Use Value: Dual-bank flash enables silent OTA updates during operational hours; TrustZone isolates secure key storage from untrusted application firmware. | Use Scenario: Tamper-resistant smart meter with anti-cloning, remote firmware validation, and real-time energy consumption logging. IC Role / Device Role / Timing Role: Secure element + MCU hybrid: SCE9 performs ECDSA signature verification on firmware images; RTC with VBATT maintains time across power cycles. Use Value: Hardware-accelerated ECC-P256 reduces signature verification time to <15 ms; tamper pins detect physical enclosure breach and trigger key erasure. |
| Automotive Diagnostic Tool | HMI-Controlled Motor Drive |
Use Scenario: Handheld OBD-II scanner supporting UDS over CAN FD for ECU reprogramming and live parameter streaming. IC Role / Device Role / Timing Role: Dual CAN FD controller handles simultaneous diagnostic session (CANFD0) and firmware update (CANFD1); USBHS provides high-speed PC connectivity. Use Value: CAN FD's 64-byte payload and 5 Mbps data rate cut firmware download time by 4× vs. classical CAN; USBHS 480 Mbps enables real-time trace capture. | Use Scenario: Brushless DC motor controller with capacitive touch panel for speed/torque adjustment and fault visualization. IC Role / Device Role / Timing Role: GPT32 timers generate precise 3-phase PWM (GTOUUP/GTOULO etc.); CTSU scans 15 electrodes for multi-touch gesture recognition. Use Value: ELC synchronizes ADC sampling with PWM dead-time insertion; CTSU achieves <5 µs response latency for tactile feedback. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M5BH3CBM | Same core, memory, and peripherals but in 144-pin BGA (7 mm × 7 mm); lacks 23 GPIOs and 2 SCI channels vs. R7FA6M5BH3CFC. | Suitable for space-constrained PCBs where LQFP footprint is prohibitive; requires redesign for thermal and signal integrity in high-speed CAN FD routing. | Select when board area is critical and BGA assembly capability exists; verify CAN FD signal integrity with shorter trace lengths. |
| R7FA6M5AH3CFC | Identical package and temperature grade but supports only classical CAN (not CAN FD); same flash/SRAM/crypto features. | Applicable in cost-sensitive industrial controls where CAN FD bandwidth is unnecessary; eliminates need for CAN FD transceivers. | Choose when CAN FD is not required - saves on transceiver BOM cost and simplifies compliance testing against ISO 11898-1 FD. |
Compared with R7FA6M5BH3CBM, the R7FA6M5BH3CFC offers 23 additional GPIOs and full peripheral complement in LQFP for easier prototyping and thermal management; versus R7FA6M5AH3CFC, it delivers CAN FD's 5 Mbps data rate and 64-byte payloads essential for high-bandwidth ECU diagnostics and firmware updates.
Availability
R7FA6M5BH3CFC is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, automotive diagnostic tools, and HMI-integrated motor drives requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for R7FA6M5BH3CFC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets, with over 40 years of microcontroller innovation.
The RA6M5 Group targets high-performance, secure, and connected applications - designed specifically for industrial automation, building control, medical devices, and automotive test equipment requiring real-time responsiveness, functional safety readiness, and end-to-end security.
FAQ
What is the maximum operating frequency and core architecture of the R7FA6M5BH3CFC?
The R7FA6M5BH3CFC features an Arm Cortex-M33 core operating at a maximum frequency of 200 MHz. It implements the Armv8-M architecture with security extensions, including TrustZone for hardware-enforced secure/non-secure world isolation. The core integrates a Memory Protection Unit (MPU) with eight secure and eight non-secure regions, SysTick timers for both worlds, and CoreSight ETM-M33 for trace debugging. This architecture enables deterministic real-time performance while maintaining robust security boundaries - critical for applications like secure edge nodes where firmware integrity and peripheral access control are mandatory. The R7FA6M5BH3CFC leverages this foundation to deliver both computational throughput and hardware-rooted trust.
Does the R7FA6M5BH3CFC support CAN FD, and how many channels are available?
Yes, the R7FA6M5BH3CFC supports CAN with Flexible Data-rate (CAN FD) and includes two independent CAN FD controllers (CANFD0 and CANFD1). Each channel supports ISO 11898-1 compliant classical CAN and CAN FD frames, with up to 16 transmit buffers and 16 receive buffers per channel. CAN FD enables data rates up to 5 Mbps and payloads up to 64 bytes - significantly increasing bandwidth over classical CAN. This capability makes the R7FA6M5BH3CFC ideal for automotive diagnostic tools and industrial gateways requiring high-speed ECU reprogramming or real-time sensor fusion. The dual-channel design allows concurrent communication with multiple networks - for example, one channel handling vehicle diagnostics while the other manages in-vehicle subsystem telemetry. All CAN FD functionality is implemented in hardware, minimizing CPU overhead.
What security features does the R7FA6M5BH3CFC integrate beyond Arm TrustZone?
Beyond Arm TrustZone, the R7FA6M5BH3CFC integrates the Secure Crypto Engine 9 (SCE9), a dedicated hardware accelerator supporting AES-128/256, RSA-2048/4096, ECC-P256/P384, DSA, and SHA224/SHA256. It includes a 128-bit unique device ID, tamper detection circuitry (with up to three dedicated tamper pins), and resistance to side-channel attacks like power analysis. Device lifecycle management enables secure provisioning, key rotation, and controlled deactivation. These features work in concert with TrustZone to create a certified secure element: SCE9 handles cryptographic operations in isolated secure memory, while TrustZone enforces strict access control to peripherals and memory regions. For example, in a secure edge node, SCE9 verifies firmware signatures before TrustZone loads them into protected execution space - ensuring end-to-end chain-of-trust from boot to runtime. The R7FA6M5BH3CFC thus meets requirements for PSA Certified Level 3 and IEC 62443-3-3 compliance.
What is the memory configuration of the R7FA6M5BH3CFC, and how does dual-bank flash benefit firmware updates?
The R7FA6M5BH3CFC includes 2 MB of dual-bank code flash memory, 8 KB of data flash memory (rated for 100,000 program/erase cycles), and 512 KB of on-chip SRAM with configurable parity or ECC protection. The dual-bank flash architecture divides the 2 MB into two independent banks, enabling background programming and atomic SWAP operations. During firmware updates, the application runs from Bank A while Bank B is erased and reprogrammed; upon completion, a single register write triggers an instantaneous bank swap - eliminating reboot delays and ensuring continuous operation. This is essential for industrial gateways and medical devices where downtime is unacceptable. The 8 KB data flash provides reliable non-volatile storage for calibration data, device IDs, or usage logs, while the ECC-protected SRAM safeguards runtime variables against bit flips in electrically noisy environments. This memory hierarchy directly supports the reliability and security demands of the R7FA6M5BH3CFC's target applications.
Which package type and temperature range does the R7FA6M5BH3CFC use, and what are its key I/O characteristics?
The R7FA6M5BH3CFC uses a 176-pin LQFP package (PLQP0176KB-C), measuring 24 mm × 24 mm with 0.5 mm pitch, and is rated for industrial operation from -40°C to +105°C. It provides 132 general-purpose I/O pins, 133 pull-up resistors, 132 N-channel open-drain outputs, and 17 pins with 5-V tolerance - enabling direct interfacing with legacy 5-V peripherals without level shifters. I/Os support programmable drive strength, slew rate control, and glitch filtering. The package's exposed thermal pad improves heat dissipation under sustained 200 MHz operation, while the wide temperature range ensures reliability in factory-floor gateways or outdoor edge nodes. These physical and electrical characteristics make the R7FA6M5BH3CFC suitable for demanding deployments where mechanical robustness, thermal stability, and mixed-voltage interoperability are required - distinguishing it from consumer-grade alternatives. The R7FA6M5BH3CFC's pinout is fully documented in Renesas' R01DS0366EJ0150 datasheet, Section 1.5.
R7FA6M5BH3CFC#AA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LQFP
- Series:
- RA6M5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 132
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M5BH3CFC#AA0 FAQ
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1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M5BH3CFC#AA0 part is unused and in its original packaging.
Return procedure for R7FA6M5BH3CFC#AA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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