Renesas R7FA6M5BH3CFC#BA0

Overview

R7FA6M5BH3CFC from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 2 MB dual-bank code flash with background/swap operation, 8 KB data flash, 512 KB SRAM with ECC/parity, integrated Ethernet MAC, USB 2.0 High-Speed and Full-Speed, dual CAN FD, QSPI/OSPI, SDHI, and Secure Crypto Engine 9 with TrustZone for secure element functionality - deployed in industrial gateways, smart meters, and networked HMI systems.

For engineers reviewing the R7FA6M5BH3CFC datasheet, R7FA6M5BH3CFC pinout, R7FA6M5BH3CFC application, or R7FA6M5BH3CFC equivalent, key selection criteria include its -40°C to +105°C extended temperature rating, 176-pin LQFP package (PLQP0176KB-C), dual CAN FD support, hardware-accelerated cryptography (AES/RSA/ECC/SHA256), and integrated CTSU for touch-enabled interfaces.

Technical Context

The R7FA6M5BH3CFC implements Armv8-M architecture with TrustZone-enforced secure/non-secure execution environments, supporting concurrent secure firmware updates via dual-bank flash and SWAP operations. Its memory subsystem includes 512 KB SRAM with configurable ECC (64 KB) and parity (448 KB), plus 1 KB standby SRAM backed by VBATT.

Connectivity is centered on deterministic real-time I/O: two independent CAN FD controllers (16 TX/RX buffers each), IEEE 802.3-compliant ETHERC with RMII interface, USBHS/USBFS with internal transceivers and 10-pipe FIFOs, and QSPI/OSPI controllers for external XIP-capable flash. The ELC enables zero-CPU-latency peripheral event chaining between timers, ADCs, and communication modules.

Key Specifications

Pinout & Package

176-pin LQFP (PLQP0176KB-C), 24 mm × 24 mm, 0.5 mm pitch, RoHS-compliant Sn finish. Thermal pad exposed on bottom for enhanced heat dissipation in high-duty-cycle applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.

Compared with R7FA6M5BH3CFC, the R7FA6M5BH2CBG sacrifices extended temperature operation for BGA packaging and slightly lower cost, while R7FA6M5BH3CBM retains full temperature spec but reduces pin count and package size - both require PCB redesign and are not pin-compatible replacements.

Availability

R7FA6M5BH3CFC is available at Aetrix Electronics and suitable for industrial automation, smart grid infrastructure, and networked human-machine interface applications requiring stable component supply across multi-year production lifecycles.

Supply support for R7FA6M5BH3CFC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RA6M5 Group targets high-performance, secure, and connected embedded applications - designed to accelerate development of industrial edge devices with integrated networking, cryptography, and functional safety readiness.

FAQ

What is the maximum operating frequency of the R7FA6M5BH3CFC?

The R7FA6M5BH3CFC operates at a maximum frequency of 200 MHz using its Arm Cortex-M33 core. This speed is achieved with the on-chip PLL driven by the main clock oscillator (8–24 MHz crystal) or high-speed on-chip oscillator (HOCO). The core sustains this frequency across its full -40°C to +105°C operating range without derating, as verified in the R01DS0366EJ0150 datasheet revision 1.50.

Does the R7FA6M5BH3CFC support dual CAN FD interfaces?

Yes, the R7FA6M5BH3CFC integrates two independent CAN FD controllers compliant with ISO 11898-1, each supporting up to 16 transmit and 16 receive buffers. Both channels operate simultaneously at bit rates up to 5 Mbps with flexible data payloads (up to 64 bytes), enabling robust fieldbus communication in automotive and industrial control networks without external CAN transceivers.

What package type and pin count does the R7FA6M5BH3CFC use?

The R7FA6M5BH3CFC uses a 176-pin LQFP package (PLQP0176KB-C) measuring 24 mm × 24 mm with 0.5 mm pitch. It provides 132 general-purpose I/O pins, 17 of which are 5-V tolerant, along with dedicated power, clock, reset, debug, and peripheral interface pins as defined in the R7FA6M5BH3CFC pin function table.

How does the Secure Crypto Engine 9 in the R7FA6M5BH3CFC enhance security?

The Secure Crypto Engine 9 in the R7FA6M5BH3CFC accelerates AES-128/256, RSA-2048/4096, ECC-256/384, and SHA224/256 operations in hardware, isolates key storage from the application core via TrustZone, and includes tamper detection circuitry. It also provides resistance against power analysis attacks and delivers a factory-programmed 128-bit unique ID - all confirmed in the R01DS0366EJ0150 datasheet section "Security and Encryption".

Is the R7FA6M5BH3CFC pin-compatible with other RA6M5 group members?

No, the R7FA6M5BH3CFC is not pin-compatible with other RA6M5 variants due to differing package types: it uses a 176-pin LQFP, whereas alternatives like R7FA6M5BH3CBM use 144-pin BGA and R7FA6M5BH3CAG use 100-pin BGA. Pin counts, layouts, and thermal pad configurations differ across packages - PCB layout changes are required when substituting between them.