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Renesas R7FA6M5BH3CFP#BA0
- Part No.:
- R7FA6M5BH3CFP#BA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R7FA6M5BH3CFP#BA0.pdf
- Description:
- MCU RA6 ARM CM33 200MHZ 2M/512K
- Quantity:
- Payment:
- Shipping:
Inventory:4,366
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Product details
Overview
R7FA6M5BH3CFP#BA0 from Renesas is a high-performance 32-bit Arm Cortex-M33 microcontroller operating at up to 200 MHz, featuring 2 MB dual-bank code flash with background/swap operation, 8 KB data flash, 512 KB SRAM with parity/ECC, integrated Ethernet MAC, USB 2.0 High-Speed and Full-Speed, dual CAN FD, QSPI/OSPI, SDHI, and Secure Crypto Engine (SCE9) with TrustZone for secure element functionality - deployed in industrial gateways requiring real-time connectivity, deterministic control, and firmware integrity.
For engineers reviewing the R7FA6M5BH3CFP#BA0 datasheet, R7FA6M5BH3CFP#BA0 pinout, R7FA6M5BH3CFP#BA0 application, or R7FA6M5BH3CFP#BA0 equivalent, key selection considerations include its -40°C to +105°C extended temperature rating, 100-pin LQFP package, dual CAN FD support, hardware-accelerated cryptography (AES/RSA/ECC/SHA256), and integrated Ethernet MAC with RMII interface - all critical for secure, connected edge devices.
Technical Context
The R7FA6M5BH3CFP#BA0 implements Armv8-M architecture with TrustZone security extension, enabling strict isolation between secure and non-secure execution environments. It integrates two independent MPU instances (8 regions each), dual Systick timers (secure/non-secure), and CoreSight ETM-M33 for trace-enabled debugging.
Its memory subsystem includes dual-bank flash supporting concurrent read-while-write and SWAP operations, 8 KB data flash rated for 100,000 P/E cycles, and 512 KB SRAM partitioned with 448 KB parity and 64 KB ECC protection - ensuring robust firmware updates and runtime data integrity in mission-critical applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M33 @ 200 MHz max - delivers deterministic real-time performance with hardware floating-point and DSP extensions. |
| Flash Memory | 2 MB dual-bank code flash - enables seamless firmware updates without system interruption via background operation and SWAP. |
| Data Flash | 8 KB with 100,000 program/erase cycles - provides reliable nonvolatile storage for calibration data, keys, or configuration parameters. |
| SRAM | 512 KB with parity (448 KB) and ECC (64 KB) - ensures error detection/correction for safety-critical variables and stack integrity. |
| Operating Temp | -40°C to +105°C - qualified for under-hood automotive, industrial motor drives, and outdoor infrastructure deployments. |
| Package | 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) - supports cost-effective PCB assembly with 75 I/O pins and 14 5-V-tolerant inputs. |
| Security | SCE9 + Arm TrustZone - accelerates AES/RSA/ECC/SHA256, enforces secure boot, key management, tamper detection, and lifecycle control. |
Pinout & Package
100-pin LQFP (PLQP0100KB-B), 14 mm × 14 mm, 0.5 mm pitch, -40°C to +105°C operating range. Includes 75 general-purpose I/O pins, 14 5-V-tolerant inputs, 1 dedicated VBATT pin for RTC backup, and RMII-compliant Ethernet interface pins (TXD0/TXD1/TXEN/RXD0/RXD1/CRS_DV/REF_CLK).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dual power domains: core (1.8 V) and I/O (2.7–3.6 V); decoupling required per datasheet layout guidelines. |
| XTAL / EXTAL | Main clock oscillator interface | Supports 8–24 MHz crystal; enables precise timing for USBHS, Ethernet, and real-time control loops. |
| VBATT | Battery backup supply | Retains RTC calendar, SOSC, and 1 KB standby SRAM during main power loss - critical for time-stamped event logging. |
| TXD0/TXD1/TXEN/RXD0/RXD1/CRS_DV/REF_CLK | Ethernet RMII interface | Direct connection to PHY without external glue logic; REF_CLK sourced internally or externally at 50 MHz. |
| CTX0/CTX1/CTX2 | Capacitive touch sensing channels | Connects to CTSU electrode network for up to 12 touch buttons/sliders - no external RC components required. |
Key Features
| Feature | Design Value |
|---|---|
| Dual CAN FD controllers | Each supports 16 TX/RX buffers and ISO 11898-1 compliance - enables high-bandwidth vehicle diagnostics and industrial fieldbus bridging. |
| USB 2.0 High-Speed + Full-Speed | Integrated transceivers support host/device roles at 480 Mbps (HS) and 12 Mbps (FS) - eliminates external PHY for embedded USB peripherals or firmware update interfaces. |
| Quad/Octa SPI interfaces | QSPI and OSPI controllers support XIP and execute-in-place from external flash - reduces BOM cost and simplifies boot from high-density serial memory. |
| Secure Crypto Engine (SCE9) | Hardware acceleration for AES-128/256, RSA-2048/4096, ECC-P256/P384, SHA224/256 - offloads TLS handshake and secure OTA updates from CPU. |
| Event Link Controller (ELC) | Hardware-triggered peripheral chaining (e.g., ADC conversion → DMA transfer → GPT capture) - eliminates CPU polling and interrupt latency in sensor fusion pipelines. |
Applications
| Industrial Gateway | Secure Edge Node |
|---|---|
Use Scenario: Aggregating Modbus RTU, CAN FD, and Ethernet/IP traffic in factory automation systems with protocol translation and local decision-making. IC Role / Device Role: Central application processor executing real-time Linux or FreeRTOS, managing dual CAN FD buses, Ethernet MAC, and secure firmware updates. Use Value: Dual CAN FD + Ethernet MAC + SCE9 enables deterministic multi-protocol routing and cryptographically signed firmware delivery without external co-processors. | Use Scenario: Deploying battery-backed environmental sensors in remote infrastructure with encrypted telemetry upload over cellular or Wi-Fi. IC Role / Device Role: Low-power host MCU handling sensor acquisition (ADC12), secure data packaging (SCE9), and wireless interface control (via UART/USB). Use Value: VBATT-powered RTC + 1 KB standby SRAM + tamper-detect pins ensure time-stamped, authenticated logs survive main power loss and physical intrusion attempts. |
| Motor Drive Controller | HMI-Enabled PLC |
Use Scenario: Closed-loop BLDC motor control in HVAC compressors with field-oriented control (FOC), current sensing, and thermal monitoring. IC Role / Device Role: Real-time motion controller using GPT32 PWM outputs, ADC12 sampling, and AGT timers for precise commutation timing. Use Value: Six-channel 3-phase PWM (GTOUUP/GTOULO etc.) + interleaved 5 Msps ADC + CTSU for touch-based operator interface reduces component count and improves torque ripple suppression. | Use Scenario: Compact programmable logic controller with touchscreen HMI, I/O expansion, and secure remote programming via USB or Ethernet. IC Role / Device Role: Integrated HMI engine running CTSU for capacitive buttons/sliders, SSIE for audio alerts, and USBHS for drag-and-drop firmware loading. Use Value: On-chip CTSU (12 channels), SSIE (I2S/TDM), and USBHS eliminate external touch controller, audio codec, and USB PHY - shrinking board area by >30%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Arm Cortex-M33 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M5BH3CFB#AA0 | 144-pin LQFP, 109 I/O pins, same flash/SRAM/security/peripherals - differs only in package and pin count. | Requires PCB redesign for larger footprint and higher I/O count; suitable when additional GPIOs or SCI/IIC channels are needed. | Select when board layout allows 144-pin LQFP and more analog/digital I/O is required beyond R7FA6M5BH3CFP#BA0's 75 pins. |
| R7FA6M5BH3CBM#AA0 | 144-pin BGA, 109 I/O pins, identical memory, peripherals, and temperature grade - differs in package type and mounting method. | Demands BGA reflow capability and higher-density PCB design; preferred for space-constrained, high-reliability industrial modules. | Choose for compact, high-integration designs where BGA assembly is available and thermal/mechanical stability outweighs rework complexity. |
Compared with R7FA6M5BH3CFP#BA0, the LQFP-144 (R7FA6M5BH3CFB#AA0) offers 34 more I/Os but increases board area by ~45%, while the BGA-144 (R7FA6M5BH3CBM#AA0) maintains identical functionality in a 7 mm × 7 mm footprint - enabling denser layouts at the cost of assembly accessibility.
Availability
R7FA6M5BH3CFP#BA0 is available at Aetrix Electronics and suitable for industrial gateways, secure edge nodes, motor drive controllers, and HMI-enabled PLCs requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R7FA6M5BH3CFP#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets - with over 40 years of MCU innovation and broadest Arm-based portfolio in the industry.
The RA6M5 Group targets high-performance, secure, and connected edge applications - designed specifically to accelerate development of certified industrial equipment, smart meters, and gateway-class devices with integrated security and rich connectivity.
FAQ
What is the maximum operating frequency of the R7FA6M5BH3CFP#BA0?
The R7FA6M5BH3CFP#BA0 operates at a maximum frequency of 200 MHz using its Arm Cortex-M33 core. This speed is achieved with the internal PLL driven by the main clock oscillator (8–24 MHz crystal) or high-speed on-chip oscillator (HOCO). The R7FA6M5BH3CFP#BA0 maintains full peripheral functionality-including Ethernet MAC, USBHS, and dual CAN FD-at this frequency, validated across the full -40°C to +105°C temperature range.
Does the R7FA6M5BH3CFP#BA0 support hardware encryption acceleration?
Yes, the R7FA6M5BH3CFP#BA0 integrates the Secure Crypto Engine 9 (SCE9), which provides hardware acceleration for AES-128/256, RSA-2048/4096, ECC-P256/P384, SHA224/256, and GHASH. It also supports secure key storage, tamper detection, and power analysis resistance - all coordinated with Arm TrustZone to enforce secure boot and runtime isolation. This makes the R7FA6M5BH3CFP#BA0 suitable for TLS 1.2/1.3, secure OTA updates, and FIPS-aligned applications.
What package and pin count does the R7FA6M5BH3CFP#BA0 use?
The R7FA6M5BH3CFP#BA0 uses a 100-pin LQFP package (PLQP0100KB-B), measuring 14 mm × 14 mm with 0.5 mm pitch. It provides 75 general-purpose I/O pins, 14 of which are 5-V tolerant, plus dedicated pins for Ethernet RMII, USB HS/FS, dual CAN FD, QSPI/OSPI, and CTSU. Its pinout is fully documented in Section 1.5 (Pin Functions) of the R01DS0366EJ0150 datasheet for the R7FA6M5BH3CFP#BA0.
Can the R7FA6M5BH3CFP#BA0 run Ethernet and USB simultaneously?
Yes, the R7FA6M5BH3CFP#BA0 supports concurrent operation of its Ethernet MAC (ETHERC) and both USB 2.0 High-Speed and Full-Speed modules. The Ethernet controller uses an RMII interface with dedicated 50 MHz reference clock support, while USBHS and USBFS operate independently with separate FIFOs (10 pipes each) and internal transceivers. No resource contention occurs because DMA channels (8 DMAC + DTC) and the Event Link Controller (ELC) enable parallel, CPU-offloaded data movement for both interfaces in the R7FA6M5BH3CFP#BA0.
What is the flash memory configuration of the R7FA6M5BH3CFP#BA0?
The R7FA6M5BH3CFP#BA0 includes 2 MB of dual-bank code flash memory supporting background programming, SWAP operations, and read-while-write - allowing safe firmware updates without halting application execution. It also features 8 KB of data flash rated for 100,000 program/erase cycles, intended for storing calibration data, cryptographic keys, or device-specific parameters. Both flash types are protected by write-protection registers and supported by Renesas' Flexible Software Package (FSP) drivers for the R7FA6M5BH3CFP#BA0.
R7FA6M5BH3CFP#BA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RA6M5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M33
- Core Size:
- 32-Bit
- Speed:
- 200MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
- Peripherals:
- Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
- Number of I/O:
- 75
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 20x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA6M5BH3CFP#BA0 FAQ
1.How can I place an order for R7FA6M5BH3CFP#BA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA6M5BH3CFP#BA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA6M5BH3CFP#BA0 reliable?
The price and inventory of R7FA6M5BH3CFP#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA6M5BH3CFP#BA0 is usually 5 days.
3.What payment methods are accepted for R7FA6M5BH3CFP#BA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA6M5BH3CFP#BA0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA6M5BH3CFP#BA0?
R7FA6M5BH3CFP#BA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA6M5BH3CFP#BA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA6M5BH3CFP#BA0?
For technical support, including R7FA6M5BH3CFP#BA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA6M5BH3CFP#BA0 requirements.
6.How does Aetrix verify that R7FA6M5BH3CFP#BA0 is sourced from the original manufacturer or authorized distributors?
All R7FA6M5BH3CFP#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA6M5BH3CFP#BA0 meets industry standards.
7.What is the process for return or replacement of R7FA6M5BH3CFP#BA0?
All R7FA6M5BH3CFP#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA6M5BH3CFP#BA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA6M5BH3CFP#BA0 part is unused and in its original packaging.
Return procedure for R7FA6M5BH3CFP#BA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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