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Renesas R7FA8D1AFECFC#BA0
- Part No.:
- R7FA8D1AFECFC#BA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
R7FA8D1AFECFC#BA0.pdf
- Description:
- MCU RA8 ARM CM85 400MHZ 1M/1M QF
- Quantity:
- Payment:
- Shipping:
Inventory:1,803
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Product details
Overview
R7FA8D1AFECFC#BA0 from Renesas is a high-performance 480 MHz Arm® Cortex®-M85 microcontroller with Helium™, 1 MB code flash, 12 KB data flash, 1 MB SRAM (with ECC/parity), dual CAN FD, Ethernet MAC, USB 2.0 HS/FS, OSPI, MIPI DSI, GLCDC, and integrated RSIP-E51A security IP. It targets secure industrial HMI, gateway, and edge AI inference applications requiring real-time control and rich graphics.
For engineers reviewing the R7FA8D1AFECFC#BA0 datasheet, R7FA8D1AFECFC#BA0 pinout, R7FA8D1AFECFC#BA0 application, or R7FA8D1AFECFC#BA0 equivalent, key selection criteria include its LQFP-176 package, -40°C to +125°C operation, TrustZone-enabled secure boot, on-the-fly decryption (DOTF), and absence of MIPI DSI (denoted by 'A' in part number).
Technical Context
The R7FA8D1AFECFC#BA0 implements Armv8.1-M architecture with M-profile Vector Extension (MVE) for DSP and ML acceleration, paired with dual-bank flash supporting background SWAP operations. Its memory subsystem includes 128 KB TCM RAM, 384 KB ECC-protected SRAM, and 512 KB parity-checked SRAM.
System-level integration includes an ETHERC/EDMAC pair enabling zero-CPU packet handling, two independent CAN FD controllers (4 Tx/16 Rx buffers each), and a full-featured GLCDC with DRW 2D engine for WXGA display rendering - all operating under Arm TrustZone isolation with hardware-enforced secure/non-secure worlds.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M85 @ 480 MHz with Helium MVE and FPU - enables real-time signal processing and lightweight neural network inference. |
| Memory | 1 MB code flash (single-bank), 12 KB data flash (100k P/E cycles), 1 MB SRAM (384 KB ECC + 512 KB parity) - supports robust firmware updates and safety-critical data integrity. |
| Connectivity | Dual CAN FD (ISO 11898-1), Ethernet MAC/DMA, USB 2.0 HS/FS, OSPI (xSPI/JESD251), SDHI ×2 - enables industrial networking, external memory expansion, and multimedia storage. |
| Analog | ADC12 ×2 (25 ch), DAC12 ×2, ACMPHS ×2, TSN - provides sensor interface, actuator control, and thermal monitoring without external components. |
| Security | Renesas RSIP-E51A (AES/RSA/ECC/HASH), Arm TrustZone, secure boot, DOTF, tamper-resistant pins - delivers certified secure element functionality for IoT edge devices. |
| Package & Temp | LQFP-176 (24 mm × 24 mm, 0.5 mm pitch), -40°C to +125°C junction - suitable for automotive-grade and harsh industrial environments. |
Pinout & Package
Package: 176-pin LQFP (PLQP0176KJ-A), 24 mm × 24 mm, 0.5 mm pitch, RoHS-compliant Sn termination.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VCC2 | Power supply inputs | Separate 1.68–3.6 V domains for core/peripherals; requires local 0.1 µF decoupling per pin. |
| VBATT | Battery backup input | Retains RTC, SOSC, and tamper registers during main power loss; supports calendar mode with leap-year correction. |
| XTAL / EXTAL | Main clock oscillator interface | Supports 8–48 MHz crystal or external clock; enables precise timing for Ethernet, USB, and real-time control loops. |
| MD | Mode configuration input | Defines boot source (JTAG/SCI/USB) at reset; must remain stable during mode transition. |
| RES | Reset input | Active-low asynchronous reset; initiates Power-on Reset (POR), PVD-triggered reset, or watchdog-induced recovery. |
| SWDIO / SWCLK | Serial Wire Debug interface | Enables non-intrusive debug, flash programming, and secure debug authentication via TrustZone-protected access. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP | Enables seamless firmware updates without halting real-time operation - critical for industrial gateways requiring zero-downtime maintenance. |
| GLCDC + DRW 2D engine | Directly drives RGB888 panels up to WXGA resolution with hardware-accelerated alpha blending, anti-aliasing, and texture mapping - eliminates external GPU in HMI designs. |
| Decryption on-the-fly (DOTF) | Decrypts AES-encrypted code/data from external OSPI flash in real time - protects IP while enabling cost-effective off-chip storage for large firmware or graphics assets. |
| TrustZone + RSIP-E51A | Hardware-isolated secure world with cryptographic accelerators (AES-256, ECC-384, SHA-256) and 256-bit HUK - meets PSA Level 3 and IEC 62443-3-3 requirements. |
| ETHERC + EDMAC co-processor | Offloads TCP/IP stack processing by DMA-ing Ethernet frames directly to/from SRAM - reduces CPU load below 5% for 100 Mbps line-rate traffic. |
Applications
| Industrial HMI Panel | Secure Edge Gateway |
|---|---|
Use Scenario: A factory-floor operator interface with touch screen, real-time diagnostics, and PLC connectivity. IC Role / Device Role / Timing Role: Primary application processor managing GLCDC-driven display, CAN FD communication with machinery, and secure OTA updates. Use Value: Integrated DRW engine renders complex UIs at 60 fps without external memory bandwidth pressure; TrustZone isolates HMI runtime from secure update partition. | Use Scenario: Smart building controller aggregating BACnet MS/TP, Modbus RTU, and Ethernet/IP traffic into cloud-uplink. IC Role / Device Role / Timing Role: Central protocol translator and firewall enforcing secure device onboarding via TLS 1.3 and certificate-based authentication. Use Value: Dual CAN FD interfaces handle legacy fieldbus bridging; RSIP-E51A accelerates TLS handshake and digital signature verification in <10 ms. |
| Automotive Diagnostic Tool | Medical Imaging Edge Node |
Use Scenario: Handheld OBD-II scanner supporting UDS over CAN FD and firmware reprogramming of ECUs. IC Role / Device Role / Timing Role: Host controller executing ISO 14229-1 UDS stack, managing USB-HS host interface for PC connection, and verifying signed ECU images. Use Value: On-the-fly decryption validates encrypted firmware before loading into SRAM; secure boot ensures only authenticated diagnostic software executes. | Use Scenario: Portable ultrasound device performing beamforming preprocessing and DICOM image compression before wireless transmission. IC Role / Device Role / Timing Role: Real-time DSP node using MVE for fixed-point FFTs and FIR filtering, interfacing with analog front-end via ADC12/DAC12. Use Value: Cortex-M85's Helium acceleration achieves 2.1 GOPS peak performance - sufficient for 128-channel beam synthesis at 1 kHz frame rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA8D1BFE CFC#BA0 | Same package and memory, but includes MIPI DSI interface - adds 24 dedicated DSI lanes and PHY support. | Required for direct connection to MIPI DSI displays (e.g., automotive cluster LCDs); unnecessary if using parallel RGB or LVDS panels. | Select R7FA8D1BFE CFC#BA0 only when MIPI DSI panel interface is mandatory; otherwise R7FA8D1AFECFC#BA0 reduces BOM cost and layout complexity. |
| R7FA6M5BH FC#AA0 | Lower-tier RA6M5 series: Cortex-M33 @ 200 MHz, 1 MB flash, no TrustZone crypto accelerators, no DOTF, no GLCDC/DRW. | Suitable for cost-sensitive industrial control where graphics and advanced security are not required. | Choose R7FA6M5BH FC#AA0 for simpler control tasks without HMI or cryptographic offload; R7FA8D1AFECFC#BA0 is necessary for secure graphics-rich edge nodes. |
Compared with R7FA8D1BFE CFC#BA0, R7FA8D1AFECFC#BA0 removes MIPI DSI hardware to reduce die size and cost while retaining identical security, connectivity, and graphics capabilities for non-DSI displays. Against R7FA6M5BH FC#AA0, it delivers 2.4× CPU performance, hardware crypto acceleration, and integrated 2D graphics - justifying premium use in secure, visually interactive edge applications.
Availability
R7FA8D1AFECFC#BA0 is available at Aetrix Electronics and suitable for industrial HMI, secure edge gateways, and automotive diagnostic tools requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for R7FA8D1AFECFC#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The RA8D1 group is designed for high-performance, secure, graphics-capable edge applications - combining Arm Cortex-M85 with integrated HMI engines, industrial connectivity, and hardware-rooted security to replace multi-chip solutions in next-gen IoT endpoints.
FAQ
What is the maximum operating frequency and core architecture of the R7FA8D1AFECFC#BA0?
The R7FA8D1AFECFC#BA0 features an Arm Cortex-M85 core running at up to 480 MHz, implementing the Armv8.1-M architecture profile with Helium™ technology (M-profile Vector Extension) for enhanced DSP and machine learning inference. It includes a floating-point unit compliant with IEEE 754-2008 and supports scalar half/single/double-precision operations. This architecture enables deterministic real-time performance for industrial control and edge AI workloads within the R7FA8D1AFECFC#BA0.
Does the R7FA8D1AFECFC#BA0 support secure boot and cryptographic acceleration?
Yes, the R7FA8D1AFECFC#BA0 integrates Renesas Secure IP (RSIP-E51A) with hardware-accelerated AES, RSA, ECC, and HASH operations, plus a 256-bit Hardware Unique Key (HUK) and 128-bit unique ID. Combined with Arm TrustZone, it enables secure boot, device lifecycle management, and tamper detection. The R7FA8D1AFECFC#BA0 uses these features to authenticate firmware images and enforce secure execution environments - essential for certified IoT deployments.
What display interfaces does the R7FA8D1AFECFC#BA0 support, and is MIPI DSI included?
The R7FA8D1AFECFC#BA0 includes a Graphics LCD Controller (GLCDC) supporting RGB888 panels up to WXGA resolution and a 2D Drawing Engine (DRW) for hardware-accelerated rendering. However, it does **not** include MIPI DSI - the 'A' in the part number R7FA8D1AFECFC#BA0 explicitly denotes MIPI DSI omission. For MIPI DSI support, select R7FA8D1BFE CFC#BA0 instead. The R7FA8D1AFECFC#BA0 relies on parallel RGB or external bridge ICs for display output.
What are the memory configurations and protection features of the R7FA8D1AFECFC#BA0?
The R7FA8D1AFECFC#BA0 provides 1 MB of code flash memory (single-bank), 12 KB of data flash (rated for 100,000 program/erase cycles), and 1 MB of on-chip SRAM - split into 384 KB with ECC and 512 KB with parity. It also includes 128 KB of TCM RAM and 1 KB of standby SRAM. Memory Protection Units (MPU_S and MPU_NS) provide eight regions each for secure and non-secure worlds, enforcing strict isolation in the R7FA8D1AFECFC#BA0's TrustZone implementation.
Which communication peripherals are integrated into the R7FA8D1AFECFC#BA0 for industrial networking?
The R7FA8D1AFECFC#BA0 integrates dual CAN FD controllers (each with 4 transmit and 16 receive buffers), a full Ethernet MAC/DMA controller (ETHERC/EDMAC), USB 2.0 High-Speed and Full-Speed modules, OSPI for external flash, SDHI ×2 for memory cards, SCI ×6 (supporting UART, LIN, smart card), I²C ×2, I³C ×1, SPI ×2, and SSIE ×2 for audio. These interfaces enable robust industrial networking in the R7FA8D1AFECFC#BA0 - from fieldbus bridging to cloud uplinks - without external transceivers or protocol converters.
R7FA8D1AFECFC#BA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LQFP
- Series:
- RA8D1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M85
- Core Size:
- 32-Bit
- Speed:
- 400MHz
- Connectivity:
- CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB
- Peripherals:
- AES, DMA, LVD, POR, PWM, RSA, Temp Sensor, WDT
- Number of I/O:
- 128
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 12K x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 24x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA8D1AFECFC#BA0 FAQ
1.How can I place an order for R7FA8D1AFECFC#BA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA8D1AFECFC#BA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA8D1AFECFC#BA0 reliable?
The price and inventory of R7FA8D1AFECFC#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA8D1AFECFC#BA0 is usually 5 days.
3.What payment methods are accepted for R7FA8D1AFECFC#BA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA8D1AFECFC#BA0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA8D1AFECFC#BA0?
R7FA8D1AFECFC#BA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA8D1AFECFC#BA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA8D1AFECFC#BA0?
For technical support, including R7FA8D1AFECFC#BA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA8D1AFECFC#BA0 requirements.
6.How does Aetrix verify that R7FA8D1AFECFC#BA0 is sourced from the original manufacturer or authorized distributors?
All R7FA8D1AFECFC#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA8D1AFECFC#BA0 meets industry standards.
7.What is the process for return or replacement of R7FA8D1AFECFC#BA0?
All R7FA8D1AFECFC#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA8D1AFECFC#BA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA8D1AFECFC#BA0 part is unused and in its original packaging.
Return procedure for R7FA8D1AFECFC#BA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7FA8D1AFECFC#BA0 Tags
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