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Renesas R7FA8D1AHECFC#BA0
- Part No.:
- R7FA8D1AHECFC#BA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
R7FA8D1AHECFC#BA0.pdf
- Description:
- MCU RA8 ARM CM85 400MHZ 2M/1M QF
- Quantity:
- Payment:
- Shipping:
Inventory:3,916
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Product details
Overview
R7FA8D1AHECFC#BA0 from Renesas Electronics is a high-performance 32-bit Arm® Cortex®-M85 microcontroller operating at up to 480 MHz, featuring 2 MB code flash, 12 KB data flash, 1 MB SRAM (with ECC/parity), dual CAN FD, Ethernet MAC, USB 2.0 High-Speed, MIPI DSI, and integrated Renesas Secure IP (RSIP-E51A) for cryptographic acceleration and tamper resistance - deployed in industrial HMI gateways requiring real-time graphics, secure connectivity, and functional safety support.
For engineers reviewing the R7FA8D1AHECFC#BA0 datasheet, R7FA8D1AHECFC#BA0 pinout, R7FA8D1AHECFC#BA0 application, or R7FA8D1AHECFC#BA0 equivalent, key selection considerations include its LQFP-176 package, -40°C to +125°C junction temperature rating, dual-bank flash with SWAP operation, TrustZone-enabled secure boot, and hardware-accelerated AES/RSA/ECC for edge device identity and firmware integrity verification.
Technical Context
The R7FA8D1AHECFC#BA0 implements an Armv8.1-M architecture core with Helium™ M-profile Vector Extension (MVE-F), supporting scalar and vectorized half/single/double-precision floating-point operations. It integrates dual-bank flash enabling background programming and atomic SWAP for zero-downtime firmware updates.
Its system-level integration includes a dedicated Event Link Controller (ELC) for CPU-free peripheral chaining, Decryption on-the-fly (DOTF) for real-time external memory decryption, and a 2D Drawing Engine (DRW) with antialiased rasterization for embedded GUI rendering - all coordinated under Arm TrustZone with configurable secure/non-secure memory regions and peripheral attribution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M85 @ 480 MHz with Helium MVE-F and FPU - enables real-time signal processing and ML inference at edge. |
| Memory | 2 MB dual-bank code flash (SWAP/background P/E), 12 KB data flash (100k cycles), 1 MB SRAM (ECC/parity split) - supports robust firmware update and data logging. |
| Connectivity | Dual CAN FD (ISO 11898-1), Ethernet MAC + EDMAC, USB 2.0 HS/FS, OSPI, SDHI ×2, I3C, SCI ×6 - meets industrial gateway I/O consolidation needs. |
| Analog | ADC12 ×2 (25 ch), DAC12 ×2, ACMPHS ×2, TSN - enables sensor fusion, actuator control, and thermal monitoring without external ICs. |
| Security | Renesas RSIP-E51A (AES/RSA/ECC/HASH), TrustZone, secure boot, DOTF, tamper-resistant pins - delivers certified secure element functionality. |
| HMI | GLCDC (RGB888), DRW (antialiased 2D raster), CEU, MIPI DSI transmitter - drives high-resolution displays with minimal CPU load. |
| Package & Temp | LQFP-176 (24 mm × 24 mm, 0.5 mm pitch), -40°C to +125°C junction - suitable for extended-temperature industrial control enclosures. |
Pinout & Package
Package: 176-pin LQFP (PLQP0176KJ-A), 24 mm × 24 mm, 0.5 mm pitch, lead-free (Sn only), RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VCC2 | Power supply inputs | Separate 1.68–3.6 V domains for core/peripherals; requires local 0.1 µF decoupling per pin. |
| VBATT | Battery backup input | Supplies RTC, SOSC, backup registers, and tamper detection during main power loss. |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–48 MHz external crystals; enables precise timing for Ethernet, USB, and CAN FD. |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar mode and low-power wake-up timing. |
| RES | Reset input | Active-low asynchronous reset; initiates Power-on Reset (POR), PVD-triggered reset, or WDT/IWDT timeout recovery. |
| SWDIO / SWCLK | Serial Wire Debug interface | Enables secure debug access via Arm CoreSight ETM-M85; supports TrustZone-aware debugging. |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO/MDC bus for PHY configuration and status polling. |
| USB_VBUS / USB_DP / USB_DM | USB 2.0 High-Speed physical layer | Integrated transceiver supports host/device mode; VBUS sensing enables OTG role negotiation. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP operation | Enables atomic firmware updates without halting real-time tasks - critical for unattended industrial gateways. |
| Decryption on-the-fly (DOTF) | Hardware-accelerated AES decryption of external OSPI/XSPI memory contents - secures firmware and assets without CPU overhead. |
| 2D Drawing Engine (DRW) | Full-pixel antialiasing, edge-blending, and ARGB compositing - renders complex GUIs at 60 fps with <5% CPU utilization. |
| Event Link Controller (ELC) | Direct hardware linking of 128+ peripheral events (e.g., ADC EOC → DMA trigger → GLCDC refresh) - eliminates interrupt latency and CPU polling. |
| Renesas Secure IP (RSIP-E51A) | Side-channel resistant AES-128/256, RSA-2048/4096, ECC NIST P-256/P-384, and true RNG - meets PSA Level 3 and SESIP certification requirements. |
Applications
| Industrial HMI Gateway | Secure Edge Controller |
|---|---|
|
Use Scenario: A DIN-rail mounted gateway aggregating Modbus RTU, CAN FD, and EtherNet/IP fieldbus data while rendering real-time SCADA dashboards on a 7-inch MIPI DSI display. IC Role / Device Role / Timing Role: Central application processor executing FreeRTOS, managing dual CAN FD buses at 5 Mbps, driving GLCDC+DRW for 800×480 RGB888 output, and performing TLS 1.3 handshakes via RSIP-E51A. Use Value: Eliminates need for external graphics controller and crypto co-processor; reduces BOM cost by $4.20 and PCB area by 320 mm². |
Use Scenario: A battery-backed smart sensor node in oil & gas remote monitoring, collecting vibration, pressure, and temperature data, then transmitting encrypted telemetry over LTE via USB-hosted modem. IC Role / Device Role / Timing Role: Low-power host MCU with AGT/ULPT timers for duty-cycled sampling, VBATT-powered RTC for time-stamped logs, and DOTF-decrypted firmware updates from external OSPI flash. Use Value: Achieves 10-year battery life using Deep Software Standby mode (1.8 µA), with secure OTA updates validated by TrustZone-protected secure boot. |
| Automotive Diagnostic Tool | Medical Imaging Interface |
|
Use Scenario: Handheld OBD-II scanner supporting UDS over CAN FD and DoIP over Ethernet, with touch-responsive GUI and firmware update capability via USB mass storage. IC Role / Device Role / Timing Role: Dual-interface controller running AUTOSAR-compliant CAN FD stack (4 Tx/16 Rx buffers per channel), USBHS device mode for PC communication, and GLCDC-driven capacitive touchscreen overlay. Use Value: Meets ISO 14229-1 diagnostic timing constraints (<25 ms response) and supports seamless firmware patching without vehicle reprogramming. |
Use Scenario: Portable ultrasound front-end module interfacing with FPGA-based beamformer, acquiring raw RF data via CEU, applying real-time DSP on Cortex-M85, and displaying processed B-mode images via MIPI DSI. IC Role / Device Role / Timing Role: High-throughput imaging coprocessor with CEU capturing 12-bit parallel video at 60 MHz, SSIE streaming audio feedback, and DRW compositing UI overlays onto medical-grade display. Use Value: Reduces end-to-end image latency to <8 ms, satisfies IEC 62304 Class C software safety requirements via ECC SRAM and lockstep-capable peripherals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA8D1BHECFC#BA0 | Same package and memory, but adds MIPI DSI transmitter - no change to core, flash, SRAM, or security IP. | Required when driving DSI-native panels (e.g., AMOLED); unnecessary if using RGB or LVDS interface. | Select R7FA8D1BHECFC#BA0 only if MIPI DSI is needed; otherwise R7FA8D1AHECFC#BA0 reduces cost and simplifies layout. |
| R7FA6M5BH3CFP#AA0 | Arm Cortex-M33 @ 200 MHz, 1 MB flash, no TrustZone-enforced peripheral isolation, no DOTF or DRW. | Suitable for cost-sensitive industrial controllers without graphics or advanced crypto - lacks HMI and security features of RA8D1. | Choose R7FA6M5BH3CFP#AA0 for non-graphical, non-encrypted applications where BOM cost is primary constraint. |
Compared with R7FA8D1BHECFC#BA0, the R7FA8D1AHECFC#BA0 omits MIPI DSI to reduce pin count complexity and cost while retaining identical security, connectivity, and compute capabilities; versus R7FA6M5BH3CFP#AA0, it delivers 2.4× higher core performance, hardware-accelerated cryptography, and integrated graphics - justifying premium for HMI-rich, secure edge deployments.
Availability
R7FA8D1AHECFC#BA0 is available at Aetrix Electronics and suitable for industrial HMI gateways, secure edge controllers, automotive diagnostic tools, and medical imaging interfaces requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for R7FA8D1AHECFC#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The RA8D1 group is designed for high-performance, secure, graphics-capable edge applications - combining Arm Cortex-M85 with integrated HMI engines, cryptographic accelerators, and industrial-grade connectivity to replace multi-chip solutions in next-generation IoT endpoints.
FAQ
What is the maximum operating frequency and core architecture of the R7FA8D1AHECFC#BA0?
The R7FA8D1AHECFC#BA0 features an Arm Cortex-M85 core operating at up to 480 MHz, implementing the Armv8.1-M architecture profile with Helium™ M-profile Vector Extension (MVE-F) for enhanced signal processing and machine learning inference. It includes a floating-point unit compliant with IEEE 754-2008 and supports scalar and vectorized half/single/double-precision operations - all confirmed in the R01DS0416EJ0130 datasheet Rev. 1.30.
Does the R7FA8D1AHECFC#BA0 support secure boot and hardware cryptographic acceleration?
Yes, the R7FA8D1AHECFC#BA0 integrates Renesas Secure IP (RSIP-E51A) with hardware-accelerated AES, RSA, ECC, and HASH functions, plus Arm TrustZone for memory and peripheral isolation. It supports secure boot with immutable ROM-based First Stage Bootloader (FSBL), device lifecycle management, and tamper detection - enabling PSA Certified Level 3 and SESIP-certifiable implementations per official Renesas documentation.
What display interfaces does the R7FA8D1AHECFC#BA0 support, and is MIPI DSI included?
The R7FA8D1AHECFC#BA0 includes a Graphics LCD Controller (GLCDC) supporting RGB888 output, a 2D Drawing Engine (DRW), Capture Engine Unit (CEU), and a MIPI DSI transmitter. However, the "A" in the part number R7FA8D1AHECFC#BA0 explicitly denotes absence of MIPI DSI functionality per Renesas' part numbering scheme (Figure 1.2), making it suitable for RGB/LVDS-based displays but not native DSI panels.
What is the flash and SRAM configuration of the R7FA8D1AHECFC#BA0, and how is memory protection implemented?
The R7FA8D1AHECFC#BA0 contains 2 MB dual-bank code flash with background programming and SWAP operation, 12 KB data flash rated for 100,000 program/erase cycles, and 1 MB on-chip SRAM - split into 384 KB ECC-protected and 512 KB parity-checked sections. Memory Protection is enforced via Arm MPU with 8 secure and 8 non-secure regions, plus TrustZone-configurable flash/SRAM/data flash partitioning as defined in the R01DS0416EJ0130 datasheet.
Which industrial communication protocols are natively supported by the R7FA8D1AHECFC#BA0?
The R7FA8D1AHECFC#BA0 natively supports CAN FD (ISO 11898-1) with 4 transmit and 16 receive buffers per channel, Ethernet MAC/EDMAC compliant with IEEE 802.3, USB 2.0 High-Speed and Full-Speed (host/device), SDHI v4.x for SD/SDHC/SDXC cards, I3C, OSPI (JEDEC JESD251/252), and SCI-based LIN/UART/Smart Card - all verified in the RA8D1 datasheet's communication interface tables and functional descriptions.
R7FA8D1AHECFC#BA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LQFP
- Series:
- RA8D1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M85
- Core Size:
- 32-Bit
- Speed:
- 400MHz
- Connectivity:
- CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB
- Peripherals:
- AES, DMA, LVD, POR, PWM, RSA, Temp Sensor, WDT
- Number of I/O:
- 128
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 12K x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 24x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA8D1AHECFC#BA0 FAQ
1.How can I place an order for R7FA8D1AHECFC#BA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA8D1AHECFC#BA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA8D1AHECFC#BA0 reliable?
The price and inventory of R7FA8D1AHECFC#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA8D1AHECFC#BA0 is usually 5 days.
3.What payment methods are accepted for R7FA8D1AHECFC#BA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA8D1AHECFC#BA0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA8D1AHECFC#BA0?
R7FA8D1AHECFC#BA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA8D1AHECFC#BA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA8D1AHECFC#BA0?
For technical support, including R7FA8D1AHECFC#BA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA8D1AHECFC#BA0 requirements.
6.How does Aetrix verify that R7FA8D1AHECFC#BA0 is sourced from the original manufacturer or authorized distributors?
All R7FA8D1AHECFC#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA8D1AHECFC#BA0 meets industry standards.
7.What is the process for return or replacement of R7FA8D1AHECFC#BA0?
All R7FA8D1AHECFC#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA8D1AHECFC#BA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA8D1AHECFC#BA0 part is unused and in its original packaging.
Return procedure for R7FA8D1AHECFC#BA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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