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Renesas R7FA8D1BFECBD#BC0
- Part No.:
- R7FA8D1BFECBD#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 224-LFBGA
- Datasheet:
-
R7FA8D1BFECBD#BC0.pdf
- Description:
- MCU RA8 ARM CM85 480MHZ 1M/1M BG
- Quantity:
- Payment:
- Shipping:
Inventory:1,688
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Product details
Overview
R7FA8D1BFECBD#BC0 from Renesas Electronics is a high-performance 480 MHz Arm® Cortex®-M85 microcontroller with Helium™, featuring 1 MB code flash, 12 KB data flash, 1 MB SRAM (with ECC/parity), dual CAN FD, Ethernet MAC, USB 2.0 HS/FS, MIPI DSI, and integrated Renesas Secure IP (RSIP-E51A) for cryptographic acceleration and tamper-resistant secure boot. It targets industrial HMI, automotive gateway, and secure edge IoT gateways requiring real-time control, graphics rendering, and hardware-enforced security.
For engineers reviewing the R7FA8D1BFECBD#BC0 datasheet, R7FA8D1BFECBD#BC0 pinout, R7FA8D1BFECBD#BC0 application, or R7FA8D1BFECBD#BC0 equivalent, key selection criteria include MIPI DSI support, 224-pin FBGA package, -40°C to +125°C operation, TrustZone-enabled secure partitioning, and on-the-fly decryption (DOTF) for external encrypted memory.
Technical Context
The R7FA8D1BFECBD#BC0 implements Armv8.1-M architecture with M-profile Vector Extension (MVE) and floating-point unit, enabling efficient signal processing and ML inference at 480 MHz. Its dual-bank flash supports background SWAP operations for zero-downtime firmware updates, while 1 MB SRAM includes 384 KB ECC-protected and 512 KB parity-checked regions for safety-critical data integrity.
Security is enforced via Arm TrustZone with configurable secure/non-secure memory regions (flash, SRAM, data flash), RSIP-E51A hardware accelerators for AES/RSA/ECC/HASH, and dedicated tamper-resistant pins. The MIPI DSI transmitter complies with DSI-2 and D-PHY specifications, enabling direct connection to high-resolution displays without external bridge ICs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M85 @ 480 MHz with Helium MVE and FPU - enables real-time DSP and ML workloads in embedded applications. |
| Memory | 1 MB code flash (single-bank), 12 KB data flash (100k P/E cycles), 1 MB SRAM (384 KB ECC + 512 KB parity) - ensures firmware reliability and data integrity in harsh environments. |
| Connectivity | Dual CAN FD (ISO 11898-1), Ethernet MAC (IEEE 802.3), USB 2.0 HS/FS, OSPI (xSPI/JESD251), MIPI DSI-2 - supports automotive networking, industrial Ethernet, and high-speed display interfaces. |
| Analog | Dual 12-bit ADC (25 ch), dual 12-bit DAC, dual ACMPHS, integrated temperature sensor - provides precision sensing and actuation for closed-loop control systems. |
| Security | Renesas RSIP-E51A (AES/RSA/ECC/HASH), Arm TrustZone, secure boot, decryption on-the-fly (DOTF), tamper detection - delivers certified secure element functionality without external co-processors. |
| Package & Temp | 224-pin FBGA (13 mm × 13 mm, 0.8 mm pitch), -40°C to +125°C junction temperature - suitable for automotive under-hood and industrial control applications. |
Pinout & Package
224-pin Fine-Pitch Ball Grid Array (FBGA) package, PLBG0224GD-A footprint, 0.8 mm ball pitch, 13 mm × 13 mm body size, RoHS-compliant Sn-only terminal finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VCC2 | Core & I/O power supply | 1.68–3.6 V dual-rail input; requires local 0.1 µF decoupling per pin for noise immunity in high-speed operation. |
| VBATT | Battery backup supply | Enables RTC calendar, backup registers, and tamper detection during main power loss - critical for always-on security logging. |
| XTAL / EXTAL | Main clock oscillator interface | Supports 8–48 MHz crystal or external clock; essential for precise timing of Ethernet, USB, and CAN FD peripherals. |
| MIPI_DSI_P/N[0:3] | MIPI DSI differential lanes | Four high-speed differential pairs compliant with DSI-2 spec; enables direct drive of WQXGA+ displays at 60 fps without frame buffer overhead. |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO bus for PHY configuration - required for auto-negotiation and link status monitoring in industrial Ethernet nodes. |
| CANFD0_TX / CANFD0_RX | Channel 0 CAN FD transceiver I/O | Direct connection to ISO 11898-1-compliant transceiver; supports data rates up to 5 Mbps with flexible payload length. |
Key Features
| Feature | Design Value |
|---|---|
| MIPI DSI-2 Transmitter | Integrated D-PHY physical layer eliminates need for external display bridge ICs, reducing BOM cost and PCB area in HMI designs. |
| Decryption on-the-fly (DOTF) | Hardware-accelerated AES decryption of external xSPI flash contents in real time - enables secure storage of firmware and assets without software overhead. |
| Graphics LCD Controller (GLCDC) | Supports RGB888 output and triple-plane superimposition - allows overlay of UI elements, video, and status indicators on single display pipeline. |
| 2D Drawing Engine (DRW) | Pixel-level antialiasing and texture blending at one pixel/clock - accelerates vector graphics rendering for responsive touch interfaces without GPU. |
| Secure Boot with RSIP-E51A | Immutable ROM bootloader validates signed firmware images using hardware-accelerated ECDSA before execution - prevents unauthorized code injection. |
Applications
| Industrial HMI Panel | Automotive Gateway ECU |
|---|---|
Use Scenario: Touch-enabled factory floor display with real-time machine status, alarm logging, and remote diagnostics over Ethernet. IC Role / Device Role / Timing Role: Primary application processor managing GLCDC, DRW, MIPI DSI, Ethernet MAC, and secure OTA update via DOTF-decrypted firmware. Use Value: Eliminates external graphics controller and crypto co-processor, reducing system latency and bill-of-materials by 30% versus multi-chip solutions. | Use Scenario: In-vehicle network bridge aggregating CAN FD, Ethernet AVB, and USB diagnostics across ADAS, infotainment, and body control domains. IC Role / Device Role / Timing Role: Central routing node executing protocol translation, firewall rules, and secure firmware updates using TrustZone-isolated partitions. Use Value: Dual CAN FD channels and IEEE 802.3-compliant Ethernet MAC enable deterministic <100 µs inter-domain message forwarding with hardware timestamping. |
| Secure Edge IoT Gateway | Medical Imaging Front-End |
Use Scenario: HIPAA-compliant patient data aggregator collecting sensor streams from Bluetooth LE wearables and transmitting encrypted payloads to cloud via TLS over Ethernet. IC Role / Device Role / Timing Role: Root-of-trust anchor performing RSA key generation, AES-GCM encryption, and secure boot verification using RSIP-E51A accelerators. Use Value: Hardware crypto offload achieves 256-bit AES throughput >150 Mbps while consuming <5 mW extra power - meets FDA cybersecurity validation requirements. | Use Scenario: Portable ultrasound device requiring real-time beamforming, analog front-end control, and high-fidelity display of grayscale B-mode images. IC Role / Device Role / Timing Role: Real-time signal processor interfacing ADC12/DAC12/ACMPHS for echo conditioning, and driving MIPI DSI-connected display at 60 fps. Use Value: Integrated 12-bit dual ADC with 25-channel mux and on-die temperature sensor enable calibrated RF front-end compensation without external calibration circuitry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA8D1BHECBD#BC0 | 2 MB code flash (vs. 1 MB), same 224-pin FBGA, identical peripheral set including MIPI DSI. | Required when firmware image exceeds 1 MB or dual-bank SWAP update capability is mandatory. | Select R7FA8D1BHECBD#BC0 if future firmware growth or A/B update schemes demand larger flash capacity. |
| R7FA8D1BFECFC#AC0 | 176-pin LQFP package (vs. 224-pin FBGA), same 1 MB flash and MIPI DSI, reduced I/O count (119 vs. 174). | Suitable for space-constrained but thermally relaxed designs where BGA assembly is not feasible. | Choose R7FA8D1BFECFC#AC0 for cost-sensitive industrial controls where LQFP reworkability outweighs thermal performance needs. |
Compared with R7FA8D1BFECBD#BC0, R7FA8D1BHECBD#BC0 offers higher flash density for complex firmware, while R7FA8D1BFECFC#AC0 trades package complexity for assembly flexibility - both retain identical security, graphics, and connectivity features.
Availability
R7FA8D1BFECBD#BC0 is available at Aetrix Electronics and suitable for industrial HMI, automotive gateway, and secure edge IoT gateway applications requiring stable component supply, long-term lifecycle assurance, and automotive-grade temperature operation.
Supply support for R7FA8D1BFECBD#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The RA8D1 group delivers high-performance, secure Arm Cortex-M85 MCUs targeting next-generation human-machine interfaces, automotive domain controllers, and edge AI endpoints - emphasizing hardware-enforced security, graphics acceleration, and real-time deterministic connectivity.
FAQ
What is the maximum operating frequency of the R7FA8D1BFECBD#BC0?
The R7FA8D1BFECBD#BC0 operates at a maximum CPU frequency of 480 MHz using the Arm Cortex-M85 core with Helium technology. This speed is achievable with the main clock oscillator (MOSC) or PLL1/PLL2 sources, and is validated across the full -40°C to +125°C junction temperature range specified for this part. The R7FA8D1BFECBD#BC0 maintains timing compliance at this frequency under worst-case voltage (1.68 V) and temperature conditions.
Does the R7FA8D1BFECBD#BC0 support MIPI DSI interface?
Yes, the R7FA8D1BFECBD#BC0 includes a fully integrated MIPI DSI-2 transmitter compliant with the MIPI Alliance DSI-2 and D-PHY specifications. It supports four high-speed differential lanes and enables direct connection to displays up to WQXGA resolution at 60 fps. This feature is confirmed in the part numbering scheme ('B' suffix denotes MIPI DSI availability) and detailed in the R01DS0416EJ0130 datasheet section 1.4 and Figure 1.1 block diagram.
What security features are implemented in the R7FA8D1BFECBD#BC0?
The R7FA8D1BFECBD#BC0 integrates Arm TrustZone for hardware-isolated secure/non-secure execution environments, Renesas RSIP-E51A for AES/RSA/ECC/HASH acceleration, secure boot with immutable ROM bootloader, decryption on-the-fly (DOTF) for external flash, and tamper-resistant pins. These features collectively provide certified secure element functionality - all documented in the R01DS0416EJ0130 datasheet sections 1.12 and Table 1.14. The R7FA8D1BFECBD#BC0 meets requirements for secure firmware updates and trusted execution in regulated industries.
What is the package type and pin count of the R7FA8D1BFECBD#BC0?
The R7FA8D1BFECBD#BC0 uses a 224-pin Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm ball pitch and 13 mm × 13 mm body size, designated PLBG0224GD-A. This package supports the full peripheral set including MIPI DSI, Ethernet, and dual CAN FD, and is rated for -40°C to +125°C operation. The package information is explicitly defined in the part numbering scheme ('BD' suffix) and Table 1.13 of the R01DS0416EJ0130 datasheet.
How much SRAM and flash memory does the R7FA8D1BFECBD#BC0 have?
The R7FA8D1BFECBD#BC0 includes 1 MB of on-chip SRAM (comprising 384 KB ECC-protected and 512 KB parity-checked regions) and 1 MB of code flash memory. It also provides 12 KB of data flash memory rated for 100,000 program/erase cycles. These memory configurations are fixed for this specific part number and differ from other RA8D1 variants such as R7FA8D1BHECBD#BC0 (2 MB flash). All values are specified in Table 1.13 and section 1.1 of the R01DS0416EJ0130 datasheet.
R7FA8D1BFECBD#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 224-LFBGA
- Series:
- RA8D1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M85
- Core Size:
- 32-Bit
- Speed:
- 480MHz
- Connectivity:
- CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB
- Peripherals:
- AES, DMA, LVD, POR, PWM, RSA, Temp Sensor, WDT
- Number of I/O:
- 165
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 12K x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 25x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA8D1BFECBD#BC0 FAQ
1.How can I place an order for R7FA8D1BFECBD#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA8D1BFECBD#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA8D1BFECBD#BC0 reliable?
The price and inventory of R7FA8D1BFECBD#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA8D1BFECBD#BC0 is usually 5 days.
3.What payment methods are accepted for R7FA8D1BFECBD#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA8D1BFECBD#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA8D1BFECBD#BC0?
R7FA8D1BFECBD#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA8D1BFECBD#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA8D1BFECBD#BC0?
For technical support, including R7FA8D1BFECBD#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA8D1BFECBD#BC0 requirements.
6.How does Aetrix verify that R7FA8D1BFECBD#BC0 is sourced from the original manufacturer or authorized distributors?
All R7FA8D1BFECBD#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA8D1BFECBD#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA8D1BFECBD#BC0?
All R7FA8D1BFECBD#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA8D1BFECBD#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA8D1BFECBD#BC0 part is unused and in its original packaging.
Return procedure for R7FA8D1BFECBD#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7FA8D1BFECBD#BC0 Tags
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