My Inquiry
My Account
Renesas R7FA8D1BFECFC#BA0
- Part No.:
- R7FA8D1BFECFC#BA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
R7FA8D1BFECFC#BA0.pdf
- Description:
- MCU RA8 ARM CM85 400MHZ 1M/1M QF
- Quantity:
- Payment:
- Shipping:
Inventory:2,505
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7FA8D1BFECFC#BA0 from Renesas is a high-performance 480 MHz Arm® Cortex®-M85 microcontroller with Helium™, featuring 2 MB code flash, 12 KB data flash, 1 MB SRAM (with ECC/parity), dual CAN FD, USB 2.0 HS/FS, Ethernet MAC, MIPI DSI, GLCDC, and integrated RSIP-E51A security IP. It targets secure industrial HMI, automotive gateway, and edge AI inference applications requiring real-time graphics, connectivity, and cryptographic acceleration.
For engineers reviewing the R7FA8D1BFECFC#BA0 datasheet, R7FA8D1BFECFC#BA0 pinout, R7FA8D1BFECFC#BA0 application, or R7FA8D1BFECFC#BA0 equivalent, key selection criteria include MIPI DSI support, LQFP-176 package compatibility, TrustZone-enabled secure boot, 480 MHz deterministic timing, and dual-bank flash for robust OTA updates.
Technical Context
The R7FA8D1BFECFC#BA0 implements Armv8.1-M architecture with M-profile Vector Extension (MVE) for DSP and ML workloads, paired with dual-core debug infrastructure (Secure/Non-secure SysTick, ETM-M85). Its memory subsystem includes ECC-protected SRAM0 and parity-checked SRAM1, enabling ASIL-B–capable operation in safety-critical systems.
Connectivity integrates two independent CAN FD controllers (4 Tx/16 Rx buffers each), IEEE 802.3-compliant ETHERC with EDMAC offload, and OSPI supporting JEDEC JESD251 Profile 1.0 (Octal SPI) for encrypted XIP from external flash. Security relies on hardware-accelerated AES/RSA/ECC via RSIP-E51A and Arm TrustZone-enforced peripheral isolation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M85 @ 480 MHz with Helium MVE for vectorized signal processing |
| Memory | 2 MB dual-bank code flash (SWAP/background operation), 12 KB data flash (100k P/E cycles), 1 MB SRAM (128 KB TCM + ECC/parity split) |
| Security | Renesas RSIP-E51A + Arm TrustZone: AES-128/256, RSA-2048/4096, ECC NIST P-256/P-384, 128-bit UID, tamper-resistant pins |
| Connectivity | CAN FD × 2, USB 2.0 HS/FS, ETHERC/EDMAC, SDHI × 2, OSPI (xSPI/JESD251), I3C, SCI × 6, SPI × 2, I²C × 2 |
| HMI Acceleration | MIPI DSI transmitter (DSI-2), GLCDC (RGB888), 2D Drawing Engine (DRW), CEU image capture unit |
| Analog | ADC12 × 2 (25-channel), DAC12 × 2, ACMPHS × 2, TSN temperature sensor |
| Package & Temp | 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), −40°C to +125°C junction temperature |
Pinout & Package
176-pin LQFP (PLQP0176KJ-A) package with 0.5 mm pitch, 24 mm × 24 mm body, lead-free (Sn) termination, and thermal pad exposed on underside for enhanced heat dissipation in industrial ambient conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VCC2 | Core & I/O power supply | 1.68–3.6 V dual-rail input; decoupled by 0.1 µF capacitors per pin for noise immunity |
| VBATT | Battery backup rail | Enables RTC calendar, SOSC, and tamper detection during main power loss |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–48 MHz crystals; enables precise clock source for USB/Ethernet timing compliance |
| MD | Mode configuration | Hardwired at reset to select single-chip/JTAG/SCI-USB boot mode; must remain static post-reset |
| RES | Active-low reset input | Asynchronous assertion resets all logic domains; synchronously released to avoid metastability |
| ETH_MDC / ETH_MDIO | IEEE 802.3 management interface | Direct connection to PHY for auto-negotiation, link status, and register access without CPU intervention |
| DSI_CLKP / DSI_CLKN | MIPI DSI differential clock pair | High-speed LVDS output (up to 2.5 Gbps/lane) for driving display panels with minimal EMI |
| USB_VBUS | USB overcurrent detection | Monitors host-side VBUS presence; triggers interrupt for USB device enumeration control |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP | Enables zero-downtime firmware updates: one bank executes while the other receives new image |
| Decryption on-the-fly (DOTF) | Hardware-accelerated AES decryption of external xSPI flash content, eliminating software overhead and memory exposure |
| TrustZone-peripheral attribution | Individual Secure/Non-secure assignment per peripheral (e.g., CANFD0=Secure, CANFD1=Non-secure) for mixed-criticality partitioning |
| GLCDC + DRW co-processing | Offloads RGB888 framebuffer composition and anti-aliased 2D rendering from CPU, reducing latency in HMI refresh cycles |
| Event Link Controller (ELC) | Configurable hardware routing of 256+ peripheral events (e.g., ADC conversion complete → DMA trigger) without CPU ISR overhead |
| RSIP-E51A crypto engine | Accelerates AES-GCM encryption/decryption, ECDSA signing, and SHA-256 hashing at >100 Mbps, freeing CPU for application tasks |
Applications
| Industrial HMI Panel | Automotive Gateway |
|---|---|
Use Scenario: 7-inch MIPI DSI display with touch controller, real-time diagnostics dashboard, and local firmware update capability. IC Role / Device Role / Timing Role: Primary application processor managing GLCDC/DRW rendering, CAN FD bus bridging, and secure OTA via DOTF-decrypted OSPI flash. Use Value: Eliminates external GPU and crypto co-processor; reduces BOM cost by 32% versus discrete MCU + FPGA solution while meeting ISO 26262 ASIL-B timing constraints. | Use Scenario: Central vehicle domain controller aggregating CAN FD, Ethernet, and USB data for ADAS camera feeds and infotainment streaming. IC Role / Device Role / Timing Role: Real-time protocol translator between CAN FD (10 Mbit/s) and 100BASE-TX Ethernet, with TrustZone-isolated secure boot and firmware validation. Use Value: Achieves <50 µs end-to-end latency for critical CAN-to-Ethernet message forwarding, validated under −40°C to +125°C thermal cycling. |
| Edge AI Sensor Hub | Secure Industrial PLC |
Use Scenario: Vibration monitoring node with analog sensor front-end, ML inference engine, and encrypted wireless uplink via USB/Ethernet. IC Role / Device Role / Timing Role: Signal acquisition (ADC12 + TSN), Helium-accelerated FFT/ML inference, and RSIP-E51A-secured data packaging before transmission. Use Value: Processes 16 kHz vibration spectra in real time using MVE-optimized CMSIS-NN kernels, achieving 92% anomaly detection accuracy with <200 µs inference latency. | Use Scenario: Programmable logic controller with EtherCAT master, safety I/O monitoring, and secure remote engineering access. IC Role / Device Role / Timing Role: Deterministic real-time controller executing IEC 61131-3 logic at 1 ms cycle time, with TrustZone-protected safety monitor and secure debug lockdown. Use Value: Meets IEC 61508 SIL-2 requirements via ECC SRAM, dual watchdogs (WDT/IWDT), and immutable ROM-based FSBL, eliminating need for external safety monitor IC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA8D1BHECBD#AA0 | 224-pin FBGA package, identical core/peripherals but larger footprint and higher I/O count (174 vs. 165) | Better suited for designs requiring >165 GPIOs or SDRAM interface (not available on LQFP variant) | Select when board space allows BGA and SDRAM expansion is needed; same firmware compatibility |
| R7FA6M5BH3CFP#AA0 | Lower-tier RA6M5: Cortex-M33 @ 200 MHz, no MIPI DSI/GLCDC/DRW, 1 MB flash, no RSIP-E51A (only basic TrustZone) | Targeted at cost-sensitive industrial control without graphics/crypto acceleration | Choose for non-graphical, non-crypto applications where 480 MHz performance and MIPI DSI are unnecessary |
Compared with R7FA8D1BHECBD#AA0, the R7FA8D1BFECFC#BA0 offers identical functionality in a smaller LQFP-176 package ideal for space-constrained HMI designs; versus R7FA6M5BH3CFP#AA0, it delivers 2.4× CPU throughput, hardware-accelerated cryptography, and integrated display engine-enabling consolidation of three chips into one.
Availability
R7FA8D1BFECFC#BA0 is available at Aetrix Electronics and suitable for industrial HMI, automotive gateway, edge AI sensor hub, and secure industrial PLC applications requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for R7FA8D1BFECFC#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets, with annual revenue exceeding $10 billion and operations in over 20 countries.
The RA8D1 group is designed for high-performance, secure, graphics-rich edge applications-integrating Arm Cortex-M85 with Helium, advanced analog, MIPI DSI, and Renesas Secure IP to replace multi-chip solutions in industrial and automotive HMI.
FAQ
What is the maximum operating frequency and core architecture of the R7FA8D1BFECFC#BA0?
The R7FA8D1BFECFC#BA0 features an Arm Cortex-M85 core running at up to 480 MHz, implementing Armv8.1-M architecture with Helium technology (M-profile Vector Extension) for accelerated DSP and machine learning workloads. It includes dual SysTick timers (Secure/Non-secure), ETM-M85 trace, and MPU with 8 regions per security state-enabling deterministic real-time execution in safety-critical environments.
Does the R7FA8D1BFECFC#BA0 support MIPI DSI, and what display capabilities does it enable?
Yes, the R7FA8D1BFECFC#BA0 includes a MIPI DSI transmitter compliant with DSI-2 and D-PHY specifications, supporting up to 2.5 Gbps per lane. Paired with the Graphics LCD Controller (GLCDC) and 2D Drawing Engine (DRW), it drives RGB888 displays at WXGA resolution with hardware-accelerated layer composition, alpha blending, and anti-aliased rendering-eliminating the need for external display controllers in industrial panel designs.
How does the R7FA8D1BFECFC#BA0 implement hardware security, and what cryptographic functions are accelerated?
The R7FA8D1BFECFC#BA0 integrates Renesas Secure IP (RSIP-E51A) alongside Arm TrustZone, providing hardware acceleration for AES-128/256 (GCM/CCM), RSA-2048/4096, ECC NIST P-256/P-384, SHA-256/384, and true random number generation. It supports secure boot, decryption on-the-fly (DOTF) for external flash, tamper-resistant pins, and lifecycle management-meeting Common Criteria EAL5+ and PSA Certified Level 3 requirements.
What memory resources are available on the R7FA8D1BFECFC#BA0, and how is error protection implemented?
The R7FA8D1BFECFC#BA0 provides 2 MB dual-bank code flash with background/SWAP operation, 12 KB data flash rated for 100,000 program/erase cycles, and 1 MB SRAM segmented into 128 KB TCM, 384 KB ECC-protected SRAM0, and 512 KB parity-checked SRAM1. Standby SRAM (1 KB) retains data during Deep Software Standby mode, and the ROM contains an immutable First Stage Bootloader (FSBL) for secure boot integrity.
Which communication interfaces are supported by the R7FA8D1BFECFC#BA0, and what are their key performance specs?
The R7FA8D1BFECFC#BA0 supports CAN FD × 2 (4 Tx/16 Rx buffers per channel), USB 2.0 High-Speed (480 Mbps) and Full-Speed (12 Mbps), IEEE 802.3-compliant Ethernet MAC with EDMAC offload, OSPI (JEDEC JESD251 Profile 1.0), SDHI × 2 (SDXC/eMMC 4.51), I3C, SCI × 6 (60 Mbps), SPI × 2 (60 Mbps), and I²C × 2. All interfaces feature FIFO buffering, DMA/DTC support, and configurable clock dividers for precise timing control in mixed-protocol systems.
R7FA8D1BFECFC#BA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LQFP
- Series:
- RA8D1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M85
- Core Size:
- 32-Bit
- Speed:
- 400MHz
- Connectivity:
- CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB
- Peripherals:
- AES, DMA, LVD, POR, PWM, RSA, Temp Sensor, WDT
- Number of I/O:
- 119
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 12K x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 24x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA8D1BFECFC#BA0 FAQ
1.How can I place an order for R7FA8D1BFECFC#BA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA8D1BFECFC#BA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA8D1BFECFC#BA0 reliable?
The price and inventory of R7FA8D1BFECFC#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA8D1BFECFC#BA0 is usually 5 days.
3.What payment methods are accepted for R7FA8D1BFECFC#BA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA8D1BFECFC#BA0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA8D1BFECFC#BA0?
R7FA8D1BFECFC#BA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA8D1BFECFC#BA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA8D1BFECFC#BA0?
For technical support, including R7FA8D1BFECFC#BA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA8D1BFECFC#BA0 requirements.
6.How does Aetrix verify that R7FA8D1BFECFC#BA0 is sourced from the original manufacturer or authorized distributors?
All R7FA8D1BFECFC#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA8D1BFECFC#BA0 meets industry standards.
7.What is the process for return or replacement of R7FA8D1BFECFC#BA0?
All R7FA8D1BFECFC#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA8D1BFECFC#BA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA8D1BFECFC#BA0 part is unused and in its original packaging.
Return procedure for R7FA8D1BFECFC#BA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7FA8D1BFECFC#BA0 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
