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Renesas R7FA8D1BHECFC#BA0

Part No.:
R7FA8D1BHECFC#BA0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
176-LQFP
Datasheet:
AetrixR7FA8D1BHECFC#BA0.pdf
Description:
MCU RA8 ARM CM85 400MHZ 2M/1M QF
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,824

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Product details

Overview

R7FA8D1BHECFC#BA0 from Renesas is a high-performance 480 MHz Arm® Cortex®-M85 microcontroller with Helium™, featuring 2 MB code flash, 12 KB data flash, 1 MB SRAM (with ECC/parity), dual CAN FD, Ethernet MAC, USB 2.0 HS/FS, MIPI DSI, GLCDC, and integrated RSIP-E51A security IP. It targets secure industrial HMI, automotive gateway, and edge AI inference endpoints requiring real-time graphics, deterministic connectivity, and cryptographic acceleration.

For engineers reviewing the R7FA8D1BHECFC#BA0 datasheet, R7FA8D1BHECFC#BA0 pinout, R7FA8D1BHECFC#BA0 application, or R7FA8D1BHECFC#BA0 equivalent, key selection criteria include MIPI DSI support, LQFP-176 package compatibility, TrustZone-enforced secure boot, on-the-fly decryption for external XIP, and dual-bank flash for robust OTA updates.

Technical Context

The R7FA8D1BHECFC#BA0 implements Armv8.1-M architecture with M-profile Vector Extension (MVE) for DSP and ML workloads, paired with dual-core timer subsystems (GPT32 × 8, ULPT × 2) and event-driven execution via ELC. Its memory subsystem includes parity-protected SRAM1 and ECC-protected SRAM0, enabling ASIL-B functional safety compliance in automotive contexts.

Connectivity integrates two independent CAN FD controllers (4 Tx + 16 Rx buffers each), IEEE 802.3-compliant ETHERC with EDMAC offload, and OSPI supporting JEDEC JESD251 Profile 1.0 (Octal SPI) for encrypted XIP from external HyperFlash™ or Octal NOR. Security combines Arm TrustZone with Renesas RSIP-E51A for AES-256, RSA-4096, ECC P-384, and hardware-based DOTF key management.

Key Specifications

ParameterValue and Actual Design Meaning
CoreArm Cortex-M85 @ 480 MHz with Helium MVE for integer/floating-point vector math
Memory2 MB dual-bank code flash (SWAP/background operation), 12 KB data flash (100k P/E cycles), 1 MB SRAM (128 KB TCM + 896 KB user)
SecurityArm TrustZone + RSIP-E51A with AES/RSA/ECC/HASH, 128-bit UID, tamper-resistant pins, secure boot
ConnectivityCAN FD × 2, ETHERC/EDMAC, USB 2.0 HS/FS, OSPI (JESD251 Profile 1.0), SDHI × 2, I3C, SCI × 6
HMI EngineMIPI DSI transmitter, GLCDC with RGB888 output, DRW 2D raster engine, CEU image capture unit
AnalogADC12 × 2 (25-channel), DAC12 × 2, ACMPHS × 2, TSN temperature sensor
Package176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), -40°C to +125°C junction temperature

Pinout & Package

176-pin LQFP (PLQP0176KJ-A) with 0.5 mm pitch, 24 mm × 24 mm body, exposed thermal pad. Pin functions include dedicated MIPI DSI lanes (CLKP/N, D0P/N–D3P/N), dual CAN FD transceiver pins (CAN0TX/RX, CAN1TX/RX), Ethernet RMII signals (REF_CLK, RXD[0:1], TXD[0:1]), and 119 GPIOs with 5-V tolerance and configurable drive strength.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VCC2Power supply inputsSeparate 1.68–3.6 V domains for core/peripherals; decoupled with 0.1 µF capacitors
VBATTBattery backup inputRetains RTC, SOSC, tamper registers, and backup SRAM during main power loss
XTAL / EXTALMain crystal oscillator interfaceSupports 8–48 MHz crystals; enables precise clock generation for USB/Ethernet timing
MDMode control inputConfigures single-chip/JTAG/SCI-USB boot mode at reset; must remain stable during transition
RESReset inputActive-low asynchronous reset; initiates Power-on Reset (POR) and system initialization sequence
CLKOUTClock outputProgrammable output of CPUCLK, PLL1, or peripheral clocks for external timing validation
DSI_CLKP/N, DSI_D0P/N–D3P/NMIPI DSI differential pairsHigh-speed display interface compliant with DSI-2 spec; supports WXGA resolution at 60 fps
CAN0TX / CAN0RXCAN FD channel 0 I/ODedicated pins for CAN FD physical layer; support ISO 11898-1 classical/CANFD frame formats
ETH_REF_CLK, ETH_RXD0/1, ETH_TXD0/1Ethernet RMII interfaceDirect connection to PHY without external glue logic; enables 10/100 Mbps full-duplex operation

Key Features

FeatureDesign Value
Dual-bank flash with SWAPEnables zero-downtime firmware updates by switching active bank while background programming the other
Decryption on-the-fly (DOTF)Decrypts encrypted code/data from external OSPI flash in real time using RSIP-E51A keys, eliminating RAM exposure
TrustZone-enforced peripheral isolationAssigns individual security attribution (Secure/Non-secure) to each peripheral, preventing unauthorized access across domains
GLCDC + DRW co-processingOffloads pixel composition, alpha blending, and antialiased rendering from CPU, reducing HMI latency by >40%
ELC event linkingDirect hardware routing of peripheral events (e.g., ADC conversion complete → DMA trigger) without CPU intervention or ISR overhead
ULPT + AGT ultra-low-power timersIndependent 32-bit ULPT and 16-bit AGT operate in Deep Software Standby mode, enabling sub-µA wake-up from external sensors

Applications

Industrial HMI PanelAutomotive Gateway

Use Scenario: Touch-enabled factory control panel with real-time diagnostics, animated UI, and remote firmware updates.

IC Role / Device Role / Timing Role: Primary application processor managing MIPI DSI display, GLCDC/DRW graphics rendering, and secure OTA via USBHS/ETHERC.

Use Value: MIPI DSI + DRW enables 60 fps WXGA rendering; dual-bank flash ensures fail-safe updates; RSIP-E51A validates firmware signatures pre-execution.

Use Scenario: In-vehicle network bridge aggregating CAN FD, Ethernet, and USB data between ADAS, infotainment, and telematics ECUs.

IC Role / Device Role / Timing Role: Central protocol translator with dual CAN FD channels, ETHERC, and USBHS acting as high-bandwidth data concentrator.

Use Value: Dual CAN FD (4 Tx/16 Rx per channel) handles multiple vehicle bus domains; ETHERC+EDMAC offloads TCP/IP stack processing; TrustZone isolates critical gateway functions.

Edge AI Vision NodeSecure Industrial PLC

Use Scenario: Low-power vision sensor node performing local object detection using TinyML models, with encrypted cloud upload.

IC Role / Device Role / Timing Role: Vision preprocessing engine capturing images via CEU, accelerating inference with MVE, and securing data with RSIP-E51A.

Use Value: CEU captures raw image data directly to SRAM; MVE executes CNN layers at 480 MHz; DOTF decrypts model weights from external flash without exposing keys.

Use Scenario: Programmable logic controller with secure remote configuration, encrypted ladder logic storage, and tamper-evident I/O monitoring.

IC Role / Device Role / Timing Role: Safety-critical controller executing certified logic with ECC SRAM, PVD voltage monitoring, and tamper-resistant GPIOs.

Use Value: ECC-protected SRAM prevents bit-flip-induced faults; PVD0/PVD1/PVD2 detect brown-out conditions; three tamper pins trigger zeroization of backup registers on intrusion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance secure MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R7FA8D1AHECFC#BA0Lacks MIPI DSI interface; identical package, flash, SRAM, and peripheral set otherwiseNot suitable for direct-drive displays; requires external bridge IC for LCD panelsSelect when MIPI DSI is unnecessary and cost optimization is prioritized
R7FA8D1BHECBD#AA0224-pin BGA package; adds SDRAM interface and higher I/O count (174 pins); same feature setBetter suited for space-constrained PCBs needing maximum peripheral density and external memory expansionSelect when board layout allows BGA and SDRAM buffering is required for video frame storage

Compared with R7FA8D1AHECFC#BA0, the R7FA8D1BHECFC#BA0 adds MIPI DSI for direct display integration without bridge components, while R7FA8D1BHECBD#AA0 trades LQFP ease-of-use for BGA density and SDRAM support-enabling larger frame buffers for vision applications.

Availability

R7FA8D1BHECFC#BA0 is available at Aetrix Electronics and suitable for industrial HMI, automotive gateway, edge AI vision, secure PLC, and medical device applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R7FA8D1BHECFC#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets, with over 40 years of MCU innovation.

The RA8D1 group delivers high-performance, secure Arm Cortex-M85 MCUs optimized for real-time graphics, deterministic networking, and hardware-accelerated cryptography in demanding industrial and automotive edge applications.

FAQ

What is the maximum operating frequency and core architecture of the R7FA8D1BHECFC#BA0?

The R7FA8D1BHECFC#BA0 operates at a maximum frequency of 480 MHz using the Arm Cortex-M85 core with Helium technology (M-profile Vector Extension). This architecture supports both integer and floating-point vector operations, enabling efficient execution of DSP and machine learning inference workloads directly on the R7FA8D1BHECFC#BA0 without external accelerators.

Does the R7FA8D1BHECFC#BA0 support secure boot and cryptographic acceleration?

Yes, the R7FA8D1BHECFC#BA0 integrates Arm TrustZone and Renesas RSIP-E51A security IP to deliver hardware-accelerated AES-256, RSA-4096, ECC P-384, and HASH operations. Secure boot is enforced through immutable ROM-based First Stage Bootloader (FSBL), verified signature checking, and TrustZone-isolated key storage-ensuring only authenticated firmware executes on the R7FA8D1BHECFC#BA0.

What display interfaces does the R7FA8D1BHECFC#BA0 support, and how are they implemented?

The R7FA8D1BHECFC#BA0 supports MIPI DSI (via dedicated DSI_CLKP/N and DSI_D0P/N–D3P/N pins), Graphics LCD Controller (GLCDC) with RGB888 output, and 2D Drawing Engine (DRW) for hardware-accelerated rendering. These interfaces enable direct drive of WXGA-resolution displays at 60 fps without external graphics processors, with DRW handling antialiasing, alpha blending, and texture mapping independently of the R7FA8D1BHECFC#BA0 CPU core.

How does the R7FA8D1BHECFC#BA0 handle firmware updates in the field?

The R7FA8D1BHECFC#BA0 supports zero-downtime firmware updates using its dual-bank 2 MB code flash with SWAP and background programming. While one bank executes active firmware, the other can be reprogrammed via USBHS or ETHERC; the R7FA8D1BHECFC#BA0 then atomically switches banks on reset, ensuring continuous operation and rollback capability if update verification fails.

What are the key analog and timing peripherals integrated into the R7FA8D1BHECFC#BA0?

The R7FA8D1BHECFC#BA0 integrates two 12-bit ADC units (25 total channels), two 12-bit DACs, two high-speed analog comparators (ACMPHS), and an on-die temperature sensor (TSN). For timing, it provides GPT32 × 8, GPT16 × 6, ULPT × 2, AGT × 2, RTC with calendar mode, and dual watchdogs (WDT/IWDT)-all synchronized via the Event Link Controller (ELC) to eliminate CPU polling overhead in the R7FA8D1BHECFC#BA0 design.

R7FA8D1BHECFC#BA0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
176-LQFP
Series:
RA8D1
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-M85
Core Size:
32-Bit
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB
Peripherals:
AES, DMA, LVD, POR, PWM, RSA, Temp Sensor, WDT
Number of I/O:
119
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
12K x 8
RAM Size:
1M x 8
Voltage - Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 24x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R7FA8D1BHECFC#BA0 FAQ

1.How can I place an order for R7FA8D1BHECFC#BA0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R7FA8D1BHECFC#BA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R7FA8D1BHECFC#BA0 reliable?

The price and inventory of R7FA8D1BHECFC#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA8D1BHECFC#BA0 is usually 5 days.

3.What payment methods are accepted for R7FA8D1BHECFC#BA0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA8D1BHECFC#BA0 transactions.

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4.How is shipping managed for R7FA8D1BHECFC#BA0?

R7FA8D1BHECFC#BA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R7FA8D1BHECFC#BA0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R7FA8D1BHECFC#BA0?

For technical support, including R7FA8D1BHECFC#BA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA8D1BHECFC#BA0 requirements.

6.How does Aetrix verify that R7FA8D1BHECFC#BA0 is sourced from the original manufacturer or authorized distributors?

All R7FA8D1BHECFC#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA8D1BHECFC#BA0 meets industry standards.

7.What is the process for return or replacement of R7FA8D1BHECFC#BA0?

All R7FA8D1BHECFC#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA8D1BHECFC#BA0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA8D1BHECFC#BA0 part is unused and in its original packaging.

Return procedure for R7FA8D1BHECFC#BA0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R7FA8D1BHECFC#BA0 Tags

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