Renesas R7FA8E1AFDCFB#BA0
- Part No.:
- R7FA8E1AFDCFB#BA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- -
- Datasheet:
-
R7FA8E1AFDCFB#BA0.pdf
- Description:
- MCU RA8E1 ARM CM85 1M/544K LQFP1
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Product details
Overview
R7FA8E1AFDCFB#BA0 from Renesas is a high-performance 32-bit Arm® Cortex®-M85 microcontroller operating at up to 360 MHz, featuring 1 MB dual-bank code flash with background/swap operation, 12 KB data flash, and 544 KB SRAM with parity. It integrates Ethernet MAC, USB 2.0 Full-Speed, dual CAN FD, Octal SPI, and advanced analog peripherals including dual 12-bit ADCs, DAC12, and ACMPHS - designed for secure industrial edge gateways and real-time networked control systems.
For engineers reviewing the R7FA8E1AFDCFB#BA0 datasheet, R7FA8E1AFDCFB#BA0 pinout, R7FA8E1AFDCFB#BA0 application, or R7FA8E1AFDCFB#BA0 equivalent, this page delivers verified specifications, validated package mapping (144-pin LQFP), confirmed pin functions per Renesas R01DS0455EJ0110 Rev.1.10, and two rigorously cross-checked alternative MCUs for functional migration paths in safety-aware, connectivity-intensive embedded designs.
Technical Context
The R7FA8E1AFDCFB#BA0 implements Armv8.1-M architecture with Helium™ MVE for deterministic DSP and ML inference acceleration, coupled with Arm TrustZone® enabling hardware-isolated secure/non-secure execution environments. Its memory subsystem includes dual-bank flash supporting live firmware updates without interruption and 32 KB TCM for latency-critical code.
Connectivity is architected for deterministic real-time networking: dual CAN FD channels (ISO 11898-1 compliant) with 4 Tx/16 Rx buffers per channel, IEEE 802.3-compliant ETHERC/EDMAC with RMII/MII support, and OSPI controller compliant with JEDEC JESD251 (Octal SPI profile) for high-bandwidth external memory expansion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm® Cortex®-M85 @ 360 MHz with Helium™ MVE and FPU (IEEE 754 single/double precision) |
| Memory | 1 MB dual-bank code flash (background/swap), 12 KB data flash (100k P/E cycles), 544 KB SRAM (32 KB TCM + 512 KB user + 1 KB standby) |
| Security | Arm TrustZone®, RSIP-E51A (HUK, TRNG, 128-bit UID), secure debug, lifecycle management, tamper-resistant pins |
| Connectivity | Dual CAN FD (4 Tx/16 Rx buffers each), Ethernet MAC/DMA (RMII/MII), USB 2.0 FS host/device, OSPI (JEDEC JESD251), 6× SCI, 2× I2C, 2× SPI, 2× SSIE |
| Analog | Dual 12-bit ADC12 (13 ch total), 12-bit DAC12, 2× ACMPHS, on-die temperature sensor (TSN), VREFH reference input |
| Timers & Control | 6× GPT32, 4× GPT16, 2× AGT, 2× ULPT, RTC with calendar mode (2000–2099), ELC, DTC, 8-channel DMAC |
| Package & Environment | 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), −40°C to +105°C junction temperature, 1.68–3.6 V VCC operation |
Pinout & Package
Package: 144-pin LQFP (PLQP0144KA-B), 20 mm × 20 mm, 0.5 mm pitch, Pb-free Sn terminal finish, rated for −40°C to +105°C operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VCC2 | Primary power supply inputs | 1.68–3.6 V digital core and I/O supply; decoupled via 0.1 µF capacitor near pin |
| VBATT | Battery backup supply | Enables RTC, SOSC, backup registers, and tamper detection during main power loss |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–48 MHz external crystal; enables precise clock source for high-speed operation |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar and low-power timing |
| RES | Active-low reset input | Hardware reset assertion; synchronous release ensures deterministic initialization |
| USB_DP / USB_DM | Integrated USB 2.0 FS transceiver I/O | Direct connection to USB bus; no external PHY required for device/host operation |
| CRX0 / CTX0, CRX1 / CTX1 | CAN FD channel 0 & 1 physical layer I/O | Differential receive/transmit pairs compliant with ISO 11898-1; support data rates up to 5 Mbps |
| RMII0_TXD0/1, RMII0_RXD0/1 | Ethernet RMII interface signals | 2-bit transmit/receive data path with shared 50 MHz REF50CK0 clock; minimal pin count for PHY interfacing |
| OM_SCLK / OM_SIOn / OM_CSn | Octal SPI master interface outputs/IO | Drives JEDEC JESD251-compliant Octal Flash or HyperRAM; supports 1/2/4/8-bit protocols |
| SSIBCK0 / SSIRXD0 / SSITXD0 | SSIE0 audio interface signals | I2S/TDM master/slave operation up to 50 MHz audio clock; 32-stage FIFO supports DMA-driven streaming |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP operation | Enables seamless over-the-air (OTA) firmware updates without system downtime or external memory |
| Arm TrustZone® + RSIP-E51A | Hardware-enforced secure boot, encrypted key storage, and runtime isolation for certified IoT security stacks |
| ETHERC/EDMAC with RMII/MII | Zero-CPU-load packet transmission/reception; supports IEEE 1588 PTP timestamping via ELC-triggered capture |
| Helium™-accelerated MVE | Delivers >2x integer and floating-point throughput vs. Cortex-M7 for motor control algorithms and sensor fusion |
| CEU image capture engine | Direct DMA transfer of parallel camera data to SRAM; eliminates CPU overhead in vision-enabled HMI applications |
| ULPT + AGT + RTC coexistence | Multiple independent low-power timers enable hierarchical sleep scheduling: ULPT wakes AGT, AGT triggers RTC alarms |
Applications
| Industrial Ethernet Gateway | Secure Automotive Body Controller |
|---|---|
|
Use Scenario: Aggregating CAN FD, LIN, and RS-485 fieldbus data into time-synchronized Ethernet packets for cloud telemetry and OTA updates. IC Role / Device Role / Timing Role: Central protocol translator and real-time scheduler using ELC-linked GPT32 timers and dual CAN FD controllers. Use Value: Dual-bank flash enables safe firmware rollback; TrustZone isolates gateway firmware from vehicle network stacks. |
Use Scenario: Managing door locks, lighting, HVAC, and battery monitoring in EV platforms with ASIL-B functional safety requirements. IC Role / Device Role / Timing Role: Safety-monitoring MCU executing diagnostics on ADC12 temperature readings and ACMPHS window comparators. Use Value: RSIP-E51A provides cryptographic signing for secure firmware updates; VBATT-backed RTC maintains audit logs across power cycles. |
| Edge AI Sensor Hub | Programmable Logic Controller (PLC) |
|
Use Scenario: Running TinyML inference on vibration and thermal sensor streams while forwarding alerts via USB or Ethernet. IC Role / Device Role / Timing Role: Helium™-accelerated MVE processes FFTs and neural net layers; CEU captures camera snapshots on motion trigger. Use Value: 544 KB SRAM holds model weights and inference buffers; OSPI interfaces to external QSPI Flash for model storage. |
Use Scenario: Executing cyclic ladder logic scans with deterministic sub-millisecond jitter using GPT32 PWM timers and ELC-triggered ADC sampling. IC Role / Device Role / Timing Role: Real-time controller synchronizing I/O scanning, motion control, and EtherCAT slave communication. Use Value: 360 MHz Cortex-M85 ensures <100 µs logic scan times; dual CAN FD handles distributed I/O modules and safety networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance, secure microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA8M1AF2CB#AA0 | Same RA8 family, Cortex-M85 core, but 512 KB SRAM, no Ethernet MAC, no CEU, 100-pin LQFP | Suitable for cost-sensitive, non-networked edge nodes where OSPI and dual CAN FD remain critical | Select when Ethernet and image capture are unnecessary and PCB space/layout constraints favor smaller footprint |
| STM32H753VI | Arm Cortex-M7 @ 480 MHz, 2 MB flash, 1 MB RAM, no TrustZone, no CAN FD, no OSPI, different peripheral set | Targeted at high-throughput signal processing with FPU-heavy workloads, lacking integrated network security stack | Choose only if existing STM32 ecosystem tooling and HAL compatibility outweigh need for CAN FD, TrustZone, and OTA-safe dual-bank flash |
Compared with R7FA8E1AFDCFB#BA0, the R7FA8M1AF2CB#AA0 reduces BOM cost and board area by removing Ethernet and CEU while retaining core RA8 security and connectivity; the STM32H753VI offers higher raw FPU throughput but lacks hardware-enforced security partitioning and modern automotive-grade interfaces like CAN FD and OSPI.
Availability
R7FA8E1AFDCFB#BA0 is available at Aetrix Electronics and suitable for industrial Ethernet gateways, secure automotive body controllers, edge AI sensor hubs, and programmable logic controllers requiring stable component supply across extended product lifecycles.
Supply support for R7FA8E1AFDCFB#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RA8E1 group is engineered for high-performance, secure, and connected embedded systems - delivering Arm Cortex-M85 scalability with integrated Ethernet, CAN FD, OSPI, and hardware security for next-generation industrial edge and automotive domain controllers.
FAQ
What is the maximum operating frequency of the R7FA8E1AFDCFB#BA0?
The R7FA8E1AFDCFB#BA0 operates at a maximum frequency of 360 MHz using its Arm Cortex-M85 core. This speed is achieved via PLL1/PLL2 clock synthesis from internal oscillators (HOCO, MOCO) or external crystals (8–48 MHz). The core sustains this frequency across the full −40°C to +105°C junction temperature range under 1.68–3.6 V VCC supply conditions, as specified in the R01DS0455EJ0110 datasheet.
Does the R7FA8E1AFDCFB#BA0 support secure boot and cryptographic operations?
Yes, the R7FA8E1AFDCFB#BA0 supports hardware-based secure boot through Arm TrustZone® and Renesas Secure IP (RSIP-E51A). RSIP-E51A provides true random number generation, 256-bit Hardware Unique Key (HUK), and 128-bit unique ID. It accelerates AES, SHA, ECC, and RSA operations, enabling signed firmware validation, encrypted OTA updates, and secure key provisioning - all verified in the R7FA8E1AFDCFB#BA0's security documentation.
What package type and pin count does the R7FA8E1AFDCFB#BA0 use?
The R7FA8E1AFDCFB#BA0 uses a 144-pin LQFP package (PLQP0144KA-B), measuring 20 mm × 20 mm with 0.5 mm pitch and Sn (tin) Pb-free terminations. This package supports 106 GPIOs and exposes all high-speed interfaces including dual CAN FD, Ethernet RMII, USB DP/DM, OSPI, and SSIE. Pin compatibility is confirmed in Table 1.15 of the R01DS0455EJ0110 datasheet.
Can the R7FA8E1AFDCFB#BA0 execute firmware updates without interrupting real-time operation?
Yes, the R7FA8E1AFDCFB#BA0 supports background and SWAP operations on its 1 MB dual-bank code flash. During an update, one bank executes active firmware while the other receives new code - enabling zero-downtime field upgrades. SWAP functionality allows atomic bank switching upon successful verification, ensuring system integrity. This capability is explicitly documented in Section 1.1 and Table 1.2 of the R7FA8E1AFDCFB#BA0 datasheet.
Which communication interfaces with hardware acceleration are integrated into the R7FA8E1AFDCFB#BA0?
The R7FA8E1AFDCFB#BA0 integrates multiple hardware-accelerated interfaces: dual CAN FD controllers (4 Tx/16 Rx buffers each), Ethernet MAC/DMA (ETHERC/EDMAC) with RMII/MII support, OSPI controller compliant with JEDEC JESD251, and USB 2.0 Full-Speed with integrated transceiver. All are directly memory-mapped and support DMA-driven transfers via DMAC or DTC - eliminating CPU polling and reducing latency, as confirmed in Tables 1.7–1.8 of R01DS0455EJ0110.
R7FA8E1AFDCFB#BA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- -
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
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- Core Size:
- -
- Speed:
- -
- Connectivity:
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- Peripherals:
- -
- Number of I/O:
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- Program Memory Size:
- -
- Program Memory Type:
- -
- EEPROM Size:
- -
- RAM Size:
- -
- Voltage - Supply (Vcc/Vdd):
- -
- Data Converters:
- -
- Oscillator Type:
- -
- Operating Temperature:
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- Grade:
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- Qualification:
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- Mounting Type:
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R7FA8E1AFDCFB#BA0 FAQ
1.How can I place an order for R7FA8E1AFDCFB#BA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA8E1AFDCFB#BA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of R7FA8E1AFDCFB#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA8E1AFDCFB#BA0 is usually 5 days.
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5.How can I obtain technical support or documentation for R7FA8E1AFDCFB#BA0?
For technical support, including R7FA8E1AFDCFB#BA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA8E1AFDCFB#BA0 requirements.
6.How does Aetrix verify that R7FA8E1AFDCFB#BA0 is sourced from the original manufacturer or authorized distributors?
All R7FA8E1AFDCFB#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA8E1AFDCFB#BA0 meets industry standards.
7.What is the process for return or replacement of R7FA8E1AFDCFB#BA0?
All R7FA8E1AFDCFB#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA8E1AFDCFB#BA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA8E1AFDCFB#BA0 part is unused and in its original packaging.
Return procedure for R7FA8E1AFDCFB#BA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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