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Renesas R7FA8E2AFDCBD#BC0

Part No.:
R7FA8E2AFDCBD#BC0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
-
Datasheet:
AetrixR7FA8E2AFDCBD#BC0.pdf
Description:
MCU RA8E1 ARM CM85 1M/544K LQFP1
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Product details

Overview

R7FA8E2AFDCBD from Renesas Electronics is a high-performance 32-bit Arm® Cortex®-M85 microcontroller operating at up to 480 MHz, featuring 1 MB code flash, 672 KB SRAM (including 32 KB TCM), dual CAN FD channels, USB 2.0 Full-Speed, Octal SPI, Graphics LCD Controller, and 2D Drawing Engine - deployed in industrial HMI, automotive body control, and secure edge gateway applications.

For engineers reviewing the R7FA8E2AFDCBD datasheet, R7FA8E2AFDCBD pinout, R7FA8E2AFDCBD application, or R7FA8E2AFDCBD equivalent, key selection criteria include TrustZone-enabled security partitioning, dual-bank flash for safe firmware updates, OSPI interface for external XIP memory, and GLCDC+DRW support for embedded GUI rendering without external graphics RAM.

Technical Context

The R7FA8E2AFDCBD implements Armv8.1-M architecture with Helium™ MVE for efficient signal processing, paired with dual 8-region MPUs (Secure/Non-secure) and RSIP-E51A hardware crypto engine supporting AES-256, SHA-256, and true random number generation. Its clock system integrates PLL1/PLL2, HOCO/MOCO/LOCO oscillators, and CAC for real-time frequency accuracy monitoring.

Peripheral interconnect leverages Event Link Controller (ELC) for CPU-free peripheral chaining and dual DMAC (8-channel) + DTC for deterministic data movement. Analog subsystem includes two independent 12-bit ADCs (13-channel total), one 12-bit DAC, two ACMPHS comparators, and integrated temperature sensor with direct ADC routing.

Key Specifications

Parameter Value and Actual Design Meaning
Core Arm Cortex-M85 @ 480 MHz with Helium MVE, FPU, and TrustZone security extension
Memory 1 MB dual-bank code flash (SWAP/background operation), 12 KB data flash (100k P/E cycles), 672 KB SRAM (32 KB TCM + 512 KB parity + 128 KB non-parity)
Connectivity 2× CAN FD (ISO 11898-1), USB 2.0 FS (host/device), OSPI (xSPI/JESD251 compliant), 6× SCI, 2× I2C, 2× SPI, 2× SSIE
Analog 2× 12-bit ADC12 (13 ch total), 1× 12-bit DAC12, 2× ACMPHS, on-die temperature sensor with ADC integration
Timers 6× GPT32, 4× GPT16, 2× AGT, 2× ULPT, RTC with calendar mode (2000–2099), WDT/IWDT
HMI & Graphics RGB888-capable GLCDC with 3-plane superimposition, DRW 2D rasterizer with antialiasing and ARGB8888 framebuffer
Security Renesas RSIP-E51A (AES-256/SHA-256/TRNG), TrustZone memory/peripheral isolation, secure boot, lifecycle management, tamper-resistant pins

Pinout & Package

224-pin FBGA package (PLBG0224GD-A), 13 mm × 13 mm, 0.8 mm pitch, -40°C to +105°C junction temperature rating.

Pin/Terminal Circuit Role Design Meaning
VCC / VCC2 Power supply inputs 1.68–3.6 V core and I/O supply; decoupled via 0.1 µF capacitors near pins
VBATT Battery backup input Retains RTC, SOSC, backup registers, and tamper detection during main power loss
XTAL / EXTAL Main crystal oscillator interface Supports 8–48 MHz external crystal; enables precise timing for USB/CANFD/RTC
CRXn / CTXn CAN FD transceiver interface Dedicated differential pins per channel; require external CAN bus transceivers
USB_DP / USB_DM Integrated USB 2.0 FS transceiver On-chip PHY eliminates need for external USB transceiver in device/host mode
OSPI_IO0–IO7 Octal SPI data lanes Supports xSPI Profile 1.0 (Octal SPI) and QSPI protocols for external flash/XIP execution
GLCD_D0–D23 / GLCD_HSYNC / VSYNC Graphics LCD interface Parallel RGB888 output with programmable timing; drives WVGA panels directly

Key Features

Feature Design Value
Dual-bank flash with SWAP operation Enables seamless firmware updates without application interruption or external memory
TrustZone + RSIP-E51A co-processing Hardware-enforced secure boot, encrypted firmware storage, and runtime cryptographic acceleration
GLCDC + DRW integrated graphics pipeline Offloads GUI rendering from CPU; supports alpha blending, antialiasing, and multi-layer composition
Event Link Controller (ELC) Direct peripheral-to-peripheral triggering (e.g., ADC conversion → DMA transfer → GLCDC update) without CPU overhead
OSPI xSPI compliance (JESD251) Direct execute-in-place (XIP) from high-density octal flash, reducing SRAM footprint for GUI assets
Dual CAN FD with 16 Rx/4 Tx buffers per channel Supports mixed classical CAN and CAN FD frames in automotive body networks with deterministic latency

Applications

Industrial HMI Panel Automotive Body Control Unit

Use Scenario: Touch-enabled factory operator interface with real-time process visualization and alarm logging.

IC Role / Device Role / Timing Role: Primary application processor managing GLCDC-driven TFT display, ADC-based sensor monitoring, and CAN FD communication with PLCs.

Use Value: DRW accelerates vector graphics rendering; dual-bank flash enables over-the-air UI updates; TrustZone isolates HMI software from safety-critical CAN FD messaging stack.

Use Scenario: Central gateway coordinating door modules, lighting, and HVAC via CAN FD while hosting USB diagnostics port.

IC Role / Device Role / Timing Role: System controller executing AUTOSAR-compliant CAN FD stack, USB CDC device for service tools, and RTC-backed event logging.

Use Value: Dual CAN FD controllers handle separate chassis and comfort networks; USBFS internal PHY reduces BOM cost; VBATT retention preserves fault logs during battery disconnect.

Secure Edge Gateway Medical Patient Monitor Interface

Use Scenario: HIPAA-compliant IoT gateway aggregating BLE/Wi-Fi sensor data and forwarding to cloud via TLS-secured Ethernet/USB.

IC Role / Device Role / Timing Role: Secure root-of-trust MCU performing certificate validation, encrypted data buffering, and CAN FD fieldbus bridging.

Use Value: RSIP-E51A accelerates TLS handshake; TrustZone enforces strict separation between network stack and medical device CAN FD interface; 672 KB SRAM hosts multiple concurrent secure sessions.

Use Scenario: Portable monitor displaying ECG waveforms, SpO₂ trends, and alarm indicators on color LCD with touch overlay.

IC Role / Device Role / Timing Role: Real-time signal processor acquiring analog sensor data via ADC12, rendering waveforms using DRW, and driving GLCDC with sub-100 ms latency.

Use Value: 480 MHz M85 core with Helium processes FFT-based arrhythmia detection; GLCDC's 3-plane overlay separates waveform, UI controls, and alarm banners; TCM RAM ensures deterministic ADC-to-display pipeline.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance secure MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R7FA6M5BH3CFB#AA0 Arm Cortex-M33 @ 200 MHz, 1 MB flash, no OSPI/GLCDC/DRW, single CAN FD, RSIP-E50 Lacks graphics acceleration and dual CAN FD; suitable for non-HMI control nodes Select when GUI rendering and dual-fieldbus bridging are unnecessary and lower power/cost priority
R7FA8M5BH3CFB#AA0 Arm Cortex-M85 @ 480 MHz, 2 MB flash, 1.5 MB SRAM, same peripherals but 256-pin LQFP package Same core/peripherals but larger package and higher memory; no 224-pin BGA option Select when board layout allows LQFP and additional flash/SRAM is required for complex firmware

Compared with R7FA6M5BH3CFB#AA0, the R7FA8E2AFDCBD delivers 2.4× higher CPU throughput, integrated graphics offload, and dual CAN FD for distributed systems; versus R7FA8M5BH3CFB#AA0, it trades pin count and package size for compact BGA integration in space-constrained HMI designs.

Availability

R7FA8E2AFDCBD is available at Aetrix Electronics and suitable for industrial HMI, automotive body electronics, and secure edge gateway applications requiring stable component supply, long-term lifecycle assurance, and qualified automotive-grade temperature range (-40°C to +105°C).

Supply support for R7FA8E2AFDCBD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.

The RA8E2 Group targets high-end embedded applications demanding real-time performance, advanced graphics, functional safety, and hardware-rooted security - specifically designed for next-generation human-machine interfaces and secure edge intelligence.

FAQ

What is the maximum operating frequency of the R7FA8E2AFDCBD?

The R7FA8E2AFDCBD operates at a maximum CPU frequency of 480 MHz using the Arm Cortex-M85 core. This speed is achieved via PLL1/PLL2 clock synthesis from internal HOCO or external crystal sources, with full support for dynamic voltage/frequency scaling across operating modes. The R7FA8E2AFDCBD maintains this frequency under full peripheral load within its specified 1.68–3.6 V VCC range and -40°C to +105°C junction temperature.

Does the R7FA8E2AFDCBD support secure firmware updates?

Yes, the R7FA8E2AFDCBD supports secure firmware updates through dual-bank code flash with background SWAP operation and hardware-enforced TrustZone isolation. Updates execute in the non-secure bank while the secure bank validates signatures using RSIP-E51A, then atomically swaps banks without interrupting real-time tasks. The R7FA8E2AFDCBD also provides secure boot ROM and lifecycle management to prevent rollback or unauthorized image loading.

Can the R7FA8E2AFDCBD drive a color LCD without external graphics RAM?

Yes, the R7FA8E2AFDCBD integrates a Graphics LCD Controller (GLCDC) with RGB888 output and a 2D Drawing Engine (DRW) that renders directly to its 672 KB on-chip SRAM. The DRW supports antialiased vector primitives and alpha-blended layer composition, eliminating need for external graphics RAM in WVGA-class displays. The R7FA8E2AFDCBD's GLCDC supports programmable timing and three-plane superimposition for UI element separation.

How many CAN FD channels does the R7FA8E2AFDCBD include, and what are their buffer configurations?

The R7FA8E2AFDCBD includes two independent CAN FD modules compliant with ISO 11898-1. Each channel provides four dedicated transmit buffers and sixteen receive buffers, configurable via register settings for prioritized message handling. These buffers support both classical CAN and CAN FD frame formats with flexible bit-rate switching. The R7FA8E2AFDCBD routes each CAN FD channel to dedicated CRXn/CTXn pins, requiring external transceivers for physical layer interfacing.

What analog peripherals are integrated into the R7FA8E2AFDCBD?

The R7FA8E2AFDCBD integrates two 12-bit successive approximation ADCs (ADC12) with up to 13 total input channels, one 12-bit DAC (DAC12), two high-speed analog comparators (ACMPHS), and an on-die temperature sensor (TSN) with direct routing to ADC inputs. The ADCs support simultaneous sampling, window comparison, and hardware-triggered conversions via ELC. The R7FA8E2AFDCBD's analog subsystem operates across the full 1.68–3.6 V supply range with calibrated reference voltages.

R7FA8E2AFDCBD#BC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
-
Series:
-
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
-
Core Size:
-
Speed:
-
Connectivity:
-
Peripherals:
-
Number of I/O:
-
Program Memory Size:
-
Program Memory Type:
-
EEPROM Size:
-
RAM Size:
-
Voltage - Supply (Vcc/Vdd):
-
Data Converters:
-
Oscillator Type:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:

R7FA8E2AFDCBD#BC0 FAQ

1.How can I place an order for R7FA8E2AFDCBD#BC0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R7FA8E2AFDCBD#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of R7FA8E2AFDCBD#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA8E2AFDCBD#BC0 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA8E2AFDCBD#BC0 transactions.

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4.How is shipping managed for R7FA8E2AFDCBD#BC0?

R7FA8E2AFDCBD#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R7FA8E2AFDCBD#BC0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R7FA8E2AFDCBD#BC0?

For technical support, including R7FA8E2AFDCBD#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA8E2AFDCBD#BC0 requirements.

6.How does Aetrix verify that R7FA8E2AFDCBD#BC0 is sourced from the original manufacturer or authorized distributors?

All R7FA8E2AFDCBD#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA8E2AFDCBD#BC0 meets industry standards.

7.What is the process for return or replacement of R7FA8E2AFDCBD#BC0?

All R7FA8E2AFDCBD#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA8E2AFDCBD#BC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FA8E2AFDCBD#BC0 part is unused and in its original packaging.

Return procedure for R7FA8E2AFDCBD#BC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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