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Renesas R7FA8M1AFECBD#BC0
- Part No.:
- R7FA8M1AFECBD#BC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 224-LFBGA
- Datasheet:
-
R7FA8M1AFECBD#BC0.pdf
- Description:
- MCU:RA
- Quantity:
- Payment:
- Shipping:
Inventory:1,280
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Product details
Overview
R7FA8M1AFECBD#BC0 from Renesas is a high-performance 32-bit Arm® Cortex®-M85 microcontroller operating at up to 480 MHz, featuring 1 MB code flash, 12 KB data flash, and 1 MB SRAM with ECC/parity support. It integrates Ethernet MAC, USB 2.0 High-Speed, dual CAN FD, OSPI, I3C, SDHI, and advanced security via RSIP-E51A + Arm TrustZone®, targeting industrial edge gateways and secure connected devices.
For engineers reviewing the R7FA8M1AFECBD#BC0 datasheet, R7FA8M1AFECBD#BC0 pinout, R7FA8M1AFECBD#BC0 application, or R7FA8M1AFECBD#BC0 equivalent, key selection considerations include its 224-pin BGA package (PLBG0224GD-A), -40°C to +125°C junction temperature rating, dual-bank flash architecture with background SWAP, and hardware-accelerated cryptography for secure boot and decryption-on-the-fly.
Technical Context
The R7FA8M1AFECBD#BC0 implements an Armv8.1-M architecture core with Helium™ M-profile Vector Extension (MVE-F) for efficient signal processing, coupled with dual 8-region MPUs (Secure/Non-secure) and two independent SysTick timers. Its memory subsystem includes 1 MB SRAM split into 128 KB TCM (ECC), 384 KB ECC SRAM, and 512 KB parity-checked SRAM - enabling deterministic real-time execution and fault-resilient data handling.
Connectivity is architected for heterogeneous system integration: dual CAN FD controllers (4 Tx/16 Rx buffers each), Ethernet MAC with integrated EDMAC DMA, USBHS/USBFS dual-role operation, and OSPI supporting JEDEC JESD251 Profile 1.0 (Octal SPI) for high-bandwidth external memory. Security is enforced through hardware-isolated TrustZone regions, RSIP-E51A cryptographic accelerators (AES/RSA/ECC/HASH), and tamper-resistant pins with VBATT-backed zeroization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M85 @ 480 MHz with Helium MVE-F, FPU, and dual SysTick (Secure/Non-secure) |
| Memory | 1 MB code flash (dual-bank, background SWAP), 12 KB data flash (100k P/E cycles), 1 MB SRAM (128 KB TCM + ECC/parity split) |
| Operating Temp | -40°C to +125°C junction temperature - qualified for under-hood automotive and industrial control environments |
| Package | 224-pin FBGA (13 mm × 13 mm, 0.8 mm pitch, PLBG0224GD-A) with 174 GPIOs |
| Security | Renesas RSIP-E51A + Arm TrustZone: AES/RSA/ECC/HASH acceleration, 128-bit HUK, secure boot, DOTF, tamper detection |
| Peripherals | Dual CAN FD, Ethernet MAC/EDMAC, USB 2.0 HS/FS, OSPI (xSPI/JESD251), I3C, SDHI×2, SSIE×2, GPT32×8, ADC12×2 (25 ch), DAC12×2 |
Pinout & Package
224-pin Fine-Pitch Ball Grid Array (FBGA) package, PLBG0224GD-A, 13 mm × 13 mm, 0.8 mm ball pitch, RoHS-compliant Sn termination. Thermal pad exposed on underside for enhanced heat dissipation in high-throughput applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VCC2 | Power supply inputs | Separate 1.68–3.6 V domains for core/peripherals; requires local 0.1 µF decoupling per pin |
| VBATT | Battery backup input | Supplies RTC, SOSC, tamper logic, and backup registers during main power loss |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–48 MHz crystal; enables precise timing for Ethernet, USB, and real-time control loops |
| ETH_MDC / ETH_MDIO | IEEE 802.3 management interface | Direct connection to PHY for auto-negotiation, link status, and register configuration without CPU overhead |
| USBHS_DP / USBHS_DM | USB 2.0 High-Speed differential pair | On-die transceiver supports 480 Mbps operation; requires 90 Ω differential impedance routing |
| CANFD0_TX / CANFD0_RX | Channel 0 CAN FD physical interface | Complies with ISO 11898-1; supports data rates up to 5 Mbps with flexible payload length (up to 64 bytes) |
Key Features
| Feature | Design Value |
|---|---|
| Decryption on-the-fly (DOTF) | Hardware-accelerated AES-128/256 decryption of encrypted OSPI xSPI flash content in real time - eliminates boot latency and external crypto co-processor need |
| TrustZone-enforced peripheral isolation | Individual Secure/Non-secure attribution per peripheral (e.g., CANFD0=Secure, CANFD1=Non-secure), enabling mixed-criticality firmware partitioning |
| Dual-bank flash with SWAP operation | Enables seamless over-the-air (OTA) firmware updates: new image written to inactive bank while active bank runs; atomic bank swap on reset |
| OSPI xSPI JEDEC JESD251 compliance | Supports Octal SPI (Profile 1.0) for >200 MB/s read throughput from external HyperFlash/HyperRAM - ideal for GUI assets and firmware overlays |
| RSIP-E51A cryptographic engine | Accelerates AES-128/192/256, RSA-2048/3072, ECC NIST P-256/P-384, SHA-256/384/512 - reduces TLS handshake time by >90% vs. software-only implementation |
Applications
| Industrial Edge Gateway | Secure Automotive Telematics |
|---|---|
|
Use Scenario: Aggregating CAN FD, Ethernet, and cellular data in factory-floor gateways with real-time protocol translation. IC Role / Device Role / Timing Role: Central controller executing Linux RT or FreeRTOS, managing dual CAN FD buses (vehicle ECUs), 100BASE-TX Ethernet (PLC interconnect), and OSPI-booted firmware images. Use Value: Dual-bank flash enables zero-downtime field updates; TrustZone isolates OTA update service (Secure) from Modbus TCP stack (Non-secure); RSIP-E51A secures TLS 1.3 tunnels to cloud platforms. |
Use Scenario: In-vehicle telematics control unit (TCU) requiring secure boot, encrypted firmware storage, and multi-network connectivity. IC Role / Device Role / Timing Role: Main MCU handling LTE/Wi-Fi offload, GNSS parsing, and CAN FD diagnostics - with hardware-enforced separation between safety-critical vehicle bus comms and infotainment services. Use Value: VBATT-backed RTC and tamper pins ensure clock continuity and intrusion detection; DOTF protects OTA firmware payloads; 125°C rating supports under-dash mounting. |
| High-Performance HMI Controller | Networked Power Management System |
|
Use Scenario: Human-machine interface for medical imaging equipment requiring fast graphics rendering and responsive touch feedback. IC Role / Device Role / Timing Role: Graphics accelerator host running CEU-based image capture, SSIE-driven audio alerts, and USBHS-connected display modules - all synchronized via ELC event linking. Use Value: 1 MB SRAM with 128 KB TCM enables frame-buffer residency and low-latency interrupt response; OSPI bandwidth supports rapid GUI asset loading from external flash. |
Use Scenario: Smart circuit breaker with Ethernet backhaul, CAN FD fieldbus, and real-time energy metering. IC Role / Device Role / Timing Role: Real-time controller sampling ADC12 channels (voltage/current), computing RMS/power metrics, and reporting via Ethernet MAC + UDP to SCADA systems. Use Value: GPT32 timers generate precise PWM for solid-state relays; AGT/ULPT provide sub-millisecond timing for arc-fault detection; ECC SRAM ensures integrity of metering calculations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA8M1AHECBD#BC0 | 2 MB code flash, same 224-pin BGA package, identical peripheral set and security IP | Higher flash capacity enables larger embedded OS images and dual-application partitioning | Select when firmware size exceeds 1 MB or when future-proofing for feature expansion is required |
| R7FA6M2AF2CFC#AA0 | Arm Cortex-M33 @ 200 MHz, 1 MB flash, no Ethernet MAC or USBHS, RSIP-E50A (subset of RSIP-E51A) | Lacks high-speed connectivity and full TrustZone peripheral attribution; lower thermal envelope | Choose for cost-sensitive industrial controls where 480 MHz performance and Ethernet are unnecessary |
Compared with R7FA8M1AHECBD#BC0, the R7FA8M1AFECBD#BC0 trades 1 MB flash capacity for identical security, timing, and interface capabilities in the same BGA footprint - making it optimal for space-constrained designs with moderate firmware size. Against the RA6M2, it delivers 2.4× higher compute throughput, integrated Ethernet/USBHS, and stronger cryptographic acceleration for cloud-connected deployments.
Availability
R7FA8M1AFECBD#BC0 is available at Aetrix Electronics and suitable for industrial edge gateways, secure automotive telematics units, high-performance HMIs, and networked power management systems requiring stable component supply across extended product lifecycles.
Supply support for R7FA8M1AFECBD#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications, with deep expertise in Arm-based MCUs and analog/mixed-signal technology.
The RA8M1 group - including R7FA8M1AFECBD#BC0 - was designed for high-integrity, high-connectivity edge devices requiring real-time performance, hardware-enforced security, and heterogeneous interface integration in harsh thermal environments.
FAQ
What is the maximum operating frequency and core architecture of the R7FA8M1AFECBD#BC0?
The R7FA8M1AFECBD#BC0 features an Arm Cortex-M85 core with Helium technology, operating at a maximum frequency of 480 MHz. It implements the Armv8.1-M architecture profile with Armv8-M Security Extension, includes a floating-point unit compliant with IEEE 754-2008, and supports M-profile Vector Extension (MVE-F) for efficient signal processing. This architecture enables deterministic real-time execution and high computational throughput for demanding edge applications.
Does the R7FA8M1AFECBD#BC0 support hardware-accelerated cryptography, and what algorithms are implemented?
Yes, the R7FA8M1AFECBD#BC0 integrates the Renesas Secure IP (RSIP-E51A) cryptographic engine, which provides hardware acceleration for symmetric cryptography (AES-128/192/256), asymmetric cryptography (RSA-2048/3072, ECC NIST P-256/P-384), and message digest computation (SHA-256/384/512). It also includes a 128-bit true random number generator and 256-bit Hardware Unique Key (HUK), enabling secure boot, key injection, and decryption-on-the-fly functionality.
What package type and pin count does the R7FA8M1AFECBD#BC0 use, and what is its temperature rating?
The R7FA8M1AFECBD#BC0 uses a 224-pin Fine-Pitch Ball Grid Array (FBGA) package, designated PLBG0224GD-A, measuring 13 mm × 13 mm with 0.8 mm ball pitch. It is rated for operation across a junction temperature range of -40°C to +125°C, making it suitable for under-hood automotive, industrial control, and outdoor infrastructure applications where thermal resilience is critical.
How does the R7FA8M1AFECBD#BC0 implement memory protection and secure execution environments?
The R7FA8M1AFECBD#BC0 implements memory protection and secure execution using Arm TrustZone for Armv8-M, with up to four configurable secure/non-secure regions for code flash, two for data flash, and two for SRAM. It includes dual Memory Protection Units (MPU_S and MPU_NS), each with eight regions, and supports individual Secure/Non-secure attribution for each peripheral. This enables strict hardware-enforced isolation between trusted firmware components and untrusted application layers.
What high-speed communication interfaces are integrated into the R7FA8M1AFECBD#BC0?
The R7FA8M1AFECBD#BC0 integrates multiple high-speed interfaces: Ethernet MAC/EDMAC controller (100BASE-TX), USB 2.0 High-Speed (480 Mbps) and Full-Speed modules, Octal SPI (OSPI) compliant with JEDEC JESD251 Profile 1.0, dual CAN FD controllers (ISO 11898-1, up to 5 Mbps), and SD/MMC Host Interface (SDHI) supporting SDXC and eMMC 4.51. These interfaces enable robust, low-latency connectivity for industrial networking, automotive diagnostics, and multimedia applications.
R7FA8M1AFECBD#BC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 224-LFBGA
- Series:
- RA8M1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M85
- Core Size:
- 32-Bit
- Speed:
- 480MHz
- Connectivity:
- CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB
- Peripherals:
- AES, DMA, LVD, POR, PWM, RSA, Temp Sensor, WDT
- Number of I/O:
- 174
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 12K x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 25x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA8M1AFECBD#BC0 FAQ
1.How can I place an order for R7FA8M1AFECBD#BC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA8M1AFECBD#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA8M1AFECBD#BC0 reliable?
The price and inventory of R7FA8M1AFECBD#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA8M1AFECBD#BC0 is usually 5 days.
3.What payment methods are accepted for R7FA8M1AFECBD#BC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA8M1AFECBD#BC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA8M1AFECBD#BC0?
R7FA8M1AFECBD#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA8M1AFECBD#BC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA8M1AFECBD#BC0?
For technical support, including R7FA8M1AFECBD#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA8M1AFECBD#BC0 requirements.
6.How does Aetrix verify that R7FA8M1AFECBD#BC0 is sourced from the original manufacturer or authorized distributors?
All R7FA8M1AFECBD#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA8M1AFECBD#BC0 meets industry standards.
7.What is the process for return or replacement of R7FA8M1AFECBD#BC0?
All R7FA8M1AFECBD#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA8M1AFECBD#BC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA8M1AFECBD#BC0 part is unused and in its original packaging.
Return procedure for R7FA8M1AFECBD#BC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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