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Renesas R7FA8M1AFECFC#BA0
- Part No.:
- R7FA8M1AFECFC#BA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
R7FA8M1AFECFC#BA0.pdf
- Description:
- MCU:RA
- Quantity:
- Payment:
- Shipping:
Inventory:1,115
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Product details
Overview
R7FA8M1AFECFC#BA0 from Renesas is a high-performance 32-bit Arm® Cortex®-M85 microcontroller operating at up to 480 MHz, featuring 1 MB code flash, 12 KB data flash, 1 MB SRAM (with ECC/parity), dual CAN FD, Ethernet MAC, USB 2.0 High-Speed, OSPI, and integrated Renesas Secure IP (RSIP-E51A) with TrustZone® support - deployed in industrial gateways requiring real-time connectivity, secure firmware updates, and deterministic motor control.
For engineers reviewing the R7FA8M1AFECFC#BA0 datasheet, R7FA8M1AFECFC#BA0 pinout, R7FA8M1AFECFC#BA0 application, or R7FA8M1AFECFC#BA0 equivalent, key selection criteria include its 176-pin LQFP package, -40°C to +125°C junction temperature rating, dual-bank flash architecture enabling background SWAP operations, hardware-accelerated AES/RSA/ECC cryptography, and integrated Ethernet + CAN FD for converged industrial network edge nodes.
Technical Context
The R7FA8M1AFECFC#BA0 implements Armv8.1-M architecture with Helium™ M-profile Vector Extension (MVE-F), supporting scalar and vectorized half/single-precision floating-point operations for AI-at-the-edge inference acceleration. Its memory subsystem includes 1 MB SRAM split into 128 KB TCM (ECC-protected) and 896 KB user SRAM (512 KB parity, 384 KB ECC), plus 1 MB code flash with dual-bank capability for seamless firmware updates without runtime interruption.
Connectivity integrates two independent CAN FD controllers (ISO 11898-1 compliant, 4 Tx/16 Rx buffers per channel), one IEEE 802.3-compliant Ethernet MAC/DMA controller, USB 2.0 High-Speed host/device mode with internal transceiver, and Octal SPI supporting JEDEC JESD251 Profile 1.0 (xSPI/Octal) for high-bandwidth external memory interfacing - all coordinated via Event Link Controller (ELC) to minimize CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm® Cortex®-M85 @ 480 MHz with Helium™ MVE-F, FPU, TrustZone®, MPU_S/MPU_NS (8 regions each) |
| Memory | 1 MB code flash (dual-bank, background SWAP), 12 KB data flash (100k P/E cycles), 1 MB SRAM (128 KB TCM + ECC/parity split) |
| Operating Temp | -40°C to +125°C junction temperature - qualified for under-hood automotive and industrial control environments |
| Security | Renesas RSIP-E51A (AES-128/256, RSA-2048/4096, ECC-256/384, HASH-SHA256, 128-bit HUK, SPA/DPA resistance) |
| Connectivity | 2× CAN FD, 1× Ethernet MAC/DMA, USB 2.0 HS/FS, OSPI (xSPI/JESD251), SDHI×2, I3C×1, SCI×6, SPI×2, I2C×2 |
| Analog | ADC12×2 (25-channel total), DAC12×2, ACMPHS×2, TSN (die temperature sensor), VBATT backup support |
| Timers | GPT32×8, GPT16×6, AGT×2, ULPT×2, RTC with calendar mode (2000–2099), WDT/IWDT |
Pinout & Package
Package: 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), PLQP0176KJ-A footprint, RoHS-compliant Sn (tin) termination.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VCC2 | Power supply inputs | Dual 1.68–3.6 V domains: VCC powers core/peripherals; VCC2 supplies I/Os and analog - enables flexible power domain partitioning |
| VBATT | Battery backup input | Supplies RTC, SOSC, tamper detection, and backup registers during main power loss - supports >10-year battery-backed operation |
| RES | Reset input | Active-low asynchronous reset pin - initiates full system reset including security state clearing and TrustZone® domain reinitialization |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO/MDC bus for PHY configuration - supports auto-negotiation, link status, and register access without CPU overhead |
| CANFD0_TX / CANFD0_RX | CAN FD Channel 0 differential pair | Direct connection to external CAN FD transceiver (e.g., TJA1044); supports classical CAN and CAN FD frames up to 5 Mbps |
| USBHS_DP / USBHS_DM | USB 2.0 High-Speed differential pair | Internal transceiver supports HS/FS/Low-Speed modes; requires only series resistors and ESD protection - no external PHY needed |
| OSPI_IO0–IO7 | Octal SPI bidirectional data lines | JEDEC JESD251-compliant xSPI interface - enables direct execution (XIP) from HyperFlash™/Octal RAM with <100 ns latency |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP | Enables zero-downtime firmware updates: new image written to inactive bank while active bank executes - critical for unattended industrial systems |
| Decryption on-the-fly (DOTF) | Hardware-accelerated AES decryption of encrypted external flash contents - eliminates software decryption latency and memory footprint overhead |
| Secure Boot with RSIP-E51A | Verifies signed firmware images using ECDSA-256 before execution; binds boot process to immutable ROM FSBL and hardware root-of-trust |
| Event Link Controller (ELC) | Configurable hardware routing between 128+ peripheral events - enables autonomous sensor-to-memory transfers without CPU wake-up or ISR overhead |
| CEU image capture engine | 16-bit parallel input interface with DMA-linked frame buffering - offloads camera sensor data acquisition from CPU for vision-enabled HMI applications |
Applications
| Industrial Gateway | Secure EV Charging Controller |
|---|---|
|
Use Scenario: Aggregating Modbus TCP, CAN FD, and OPC UA traffic across factory floor devices into cloud-connected MQTT brokers. IC Role / Device Role / Timing Role: Central protocol translation hub with deterministic Ethernet/CAN FD scheduling, hardware-accelerated TLS 1.3 handshake via RSIP-E51A, and real-time packet timestamping via ETHERC/EDMAC. Use Value: Eliminates need for external FPGA or companion SoC by integrating dual-network stack offload, crypto acceleration, and 480 MHz deterministic processing in single chip. |
Use Scenario: Managing ISO 15118-compliant vehicle-to-grid (V2G) communication, metering, and safety-critical interlock sequencing at DC fast chargers. IC Role / Device Role / Timing Role: Root-of-trust controller executing certified charging logic, validating digital certificates via ECC-384, enforcing tamper-resistant billing counters, and monitoring HV isolation via ADC12 + ACMPHS. Use Value: Meets UL 2231 and IEC 62196-2 requirements through hardware-enforced secure boot, lifecycle-managed key injection, and voltage-monitoring fault response <10 µs. |
| Programmable Logic Controller (PLC) | Medical Imaging Subsystem |
|
Use Scenario: Replacing legacy 8051-based I/O modules with field-reprogrammable logic running IEC 61131-3 ladder code and motion control loops. IC Role / Device Role / Timing Role: Real-time deterministic executor with GPT32×8 for servo PWM generation (100 ns resolution), ELC-synchronized ADC sampling, and EtherCAT slave timing via ETHERC timestamping. Use Value: Achieves <1 µs jitter on 1 kHz motion control loops using hardware timer chaining and DMA-driven I/O - no RTOS jitter penalty. |
Use Scenario: Capturing and preprocessing ultrasound echo data from 128-channel transducer arrays before GPU transfer. IC Role / Device Role / Timing Role: High-throughput front-end processor handling CEU-based image capture, SSIE-linked audio feedback, and real-time FFT via MVE-F vector units on ADC12 streams. Use Value: Reduces host CPU load by 70% through hardware-accelerated beamforming and envelope detection - enabled by 480 MHz MVE-F and 1 MB on-chip SRAM buffer. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA8M1AHECFC#BA0 | 2 MB code flash (vs. 1 MB), identical peripherals, same 176-pin LQFP package and thermal rating | Suitable where larger firmware image size, OTA update staging space, or future feature expansion is required | Select when firmware growth headroom or dual-image redundancy is mandatory - no PCB or software changes needed |
| STM32H753VI | Arm Cortex-M7 @ 480 MHz, 2 MB flash, 1 MB RAM, but lacks native CAN FD, Ethernet MAC, RSIP-E51A, and TrustZone®-integrated secure element | Requires external PHY, CAN FD transceiver, and discrete crypto IC for equivalent functionality - increases BOM cost and board area | Choose only if existing STM32 ecosystem tooling outweighs integration benefits - not drop-in compatible |
Compared with R7FA8M1AFECFC#BA0, the R7FA8M1AHECFC#BA0 offers immediate flash capacity uplift within identical mechanical and thermal constraints, while the STM32H753VI demands significant peripheral supplementation and lacks hardware-enforced security partitioning - making R7FA8M1AFECFC#BA0 optimal for integrated, certifiable edge nodes.
Availability
R7FA8M1AFECFC#BA0 is available at Aetrix Electronics and suitable for industrial gateways, EV charging infrastructure, programmable logic controllers, and medical imaging subsystems requiring stable component supply across extended product lifecycles.
Supply support for R7FA8M1AFECFC#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded design innovation since 1959, with deep expertise in microcontrollers, analog, power, and connectivity solutions for automotive, industrial, and enterprise markets.
The RA8M1 Group - including R7FA8M1AFECFC#BA0 - is engineered for high-assurance industrial edge applications demanding real-time determinism, hardware-rooted security, and multi-protocol convergence in harsh environments.
FAQ
What is the maximum operating frequency and core architecture of the R7FA8M1AFECFC#BA0?
The R7FA8M1AFECFC#BA0 features an Arm® Cortex®-M85 core with Helium™ technology, operating at a maximum frequency of 480 MHz. It implements the Armv8.1-M architecture profile with Armv8-M Security Extension, includes a Memory Protection Unit (MPU) with separate secure and non-secure regions, and supports M-profile Vector Extension (MVE-F) for efficient signal processing and AI inference workloads - all confirmed in the R01DS0417EJ0130 datasheet Rev. 1.30.
Does the R7FA8M1AFECFC#BA0 support hardware-accelerated cryptography, and what algorithms are implemented?
Yes, the R7FA8M1AFECFC#BA0 integrates Renesas Secure IP (RSIP-E51A), providing hardware acceleration for AES-128/256 encryption/decryption, RSA-2048/4096 and ECC-256/384 signing/verification, SHA-256 hashing, and true random number generation. It also supports Decryption on-the-fly (DOTF) for real-time external memory decryption - all documented in Section 1.12 of the R01DS0417EJ0130 datasheet.
What package type and pin count does the R7FA8M1AFECFC#BA0 use?
The R7FA8M1AFECFC#BA0 uses a 176-pin LQFP package (24 mm × 24 mm, 0.5 mm pitch), designated PLQP0176KJ-A in Renesas packaging nomenclature. This matches the "FC" suffix in the part number and is rated for operation from -40°C to +125°C junction temperature - verified in Table 1.13 and Figure 1.2 of the R01DS0417EJ0130 datasheet.
How does the R7FA8M1AFECFC#BA0 handle secure boot and device lifecycle management?
The R7FA8M1AFECFC#BA0 implements secure boot using its immutable ROM First Stage Bootloader (FSBL) to verify signed firmware images via ECDSA-256 before execution. It supports device lifecycle management through configurable authentication levels (AL), secure factory programming, key injection, and tamper-resistant pins - all coordinated by RSIP-E51A and Arm TrustZone® - as specified in Section 1.12 and Table 1.12 of the R01DS0417EJ0130 datasheet.
Which communication interfaces with hardware offload capabilities are integrated into the R7FA8M1AFECFC#BA0?
The R7FA8M1AFECFC#BA0 integrates multiple hardware-offloaded interfaces: Ethernet MAC/DMA (ETHERC/EDMAC) for zero-CPU packet handling, CAN FD with 4 Tx/16 Rx buffers per channel, USB 2.0 High-Speed with internal transceiver and 10-pipe FIFO, OSPI supporting JEDEC JESD251 xSPI protocols, and Event Link Controller (ELC) for autonomous peripheral-to-peripheral event routing - all detailed in Tables 1.8 and 1.4 of the R01DS0417EJ0130 datasheet.
R7FA8M1AFECFC#BA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LQFP
- Series:
- RA8M1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M85
- Core Size:
- 32-Bit
- Speed:
- 400MHz
- Connectivity:
- CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB
- Peripherals:
- AES, DMA, LVD, POR, PWM, RSA, Temp Sensor, WDT
- Number of I/O:
- 128
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 12K x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 24x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA8M1AFECFC#BA0 FAQ
1.How can I place an order for R7FA8M1AFECFC#BA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA8M1AFECFC#BA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA8M1AFECFC#BA0 reliable?
The price and inventory of R7FA8M1AFECFC#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA8M1AFECFC#BA0 is usually 5 days.
3.What payment methods are accepted for R7FA8M1AFECFC#BA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA8M1AFECFC#BA0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FA8M1AFECFC#BA0?
R7FA8M1AFECFC#BA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA8M1AFECFC#BA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA8M1AFECFC#BA0?
For technical support, including R7FA8M1AFECFC#BA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA8M1AFECFC#BA0 requirements.
6.How does Aetrix verify that R7FA8M1AFECFC#BA0 is sourced from the original manufacturer or authorized distributors?
All R7FA8M1AFECFC#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA8M1AFECFC#BA0 meets industry standards.
7.What is the process for return or replacement of R7FA8M1AFECFC#BA0?
All R7FA8M1AFECFC#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA8M1AFECFC#BA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA8M1AFECFC#BA0 part is unused and in its original packaging.
Return procedure for R7FA8M1AFECFC#BA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7FA8M1AFECFC#BA0 Tags
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