Renesas R7FA8M1AHECFC#BA0
- Part No.:
- R7FA8M1AHECFC#BA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
R7FA8M1AHECFC#BA0.pdf
- Description:
- MCU:RA
- Quantity:
- Payment:

- Shipping:

Inventory:2,290
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Product details
Overview
R7FA8M1AHECFC#BA0 from Renesas is a high-performance 32-bit Arm® Cortex®-M85 microcontroller operating at up to 480 MHz, featuring 2 MB code flash, 1 MB SRAM (with ECC/parity), and integrated Ethernet MAC, USB 2.0 High-Speed, dual CAN FD, OSPI, SDHI, I3C, and advanced security via RSIP-E51A + Arm TrustZone®. It targets secure industrial gateways, automotive body control modules, and real-time edge AI inference nodes requiring deterministic timing and hardware-enforced isolation.
For engineers reviewing the R7FA8M1AHECFC#BA0 datasheet, R7FA8M1AHECFC#BA0 pinout, R7FA8M1AHECFC#BA0 application, or R7FA8M1AHECFC#BA0 equivalent, this page delivers verified specifications, package mapping to 176-pin LQFP, functional pin roles, security architecture details, and validated alternative MCUs for scalable platform design - all grounded in Renesas R01DS0417EJ0130 Rev.1.30.
Technical Context
The R7FA8M1AHECFC#BA0 implements Armv8.1-M with Helium™ MVE for vectorized signal processing, dual-bank flash supporting background SWAP operations, and on-chip SRAM partitioned into 128 KB TCM (ECC), 384 KB ECC SRAM, and 512 KB parity SRAM. Its memory subsystem enables secure over-the-air firmware updates without runtime interruption.
Security is enforced through hardware-isolated domains: RSIP-E51A accelerates AES/RSA/ECC/HASH with 256-bit HUK and SPA/DPA resistance, while Arm TrustZone® configures up to four flash regions, two data flash regions, and per-peripheral secure/non-secure attribution - enabling certified secure boot and decryption-on-the-fly (DOTF) for encrypted external OSPI memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M85 @ 480 MHz with Helium MVE, FPU, and dual SysTick timers (Secure/Non-secure) |
| Memory | 2 MB code flash (dual-bank, background SWAP), 12 KB data flash (100k P/E cycles), 1 MB SRAM (128 KB TCM + ECC/parity split) |
| Connectivity | Dual CAN FD (4 Tx / 16 Rx buffers per channel), USB 2.0 HS/FS, Ethernet MAC/EDMAC, OSPI (xSPI/JESD251 compliant), SDHI ×2, I3C ×1 |
| Analog | ADC12 ×2 (25-channel total), DAC12 ×2, ACMPHS ×2, TSN temperature sensor |
| Security | RSIP-E51A crypto engine (AES-128/256, RSA-2048/4096, ECC NIST P-256/P-384), TrustZone®, DOTF, tamper-resistant pins ×3 |
| Timers & Control | GPT32 ×8, GPT16 ×6, AGT ×2, ULPT ×2, RTC with calendar mode, ELC event linking, DTC/DMAC ×8 |
| Package & Environment | 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), −40°C to +125°C junction temperature, VCC 1.68–3.6 V |
Pinout & Package
Package: 176-pin LQFP (PLQP0176KJ-A), 24 mm × 24 mm, 0.5 mm pitch, RoHS-compliant Sn termination.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VCC2 | Power supply inputs | Core and I/O domain supplies (1.68–3.6 V); decoupled with 0.1 µF capacitors near each pin |
| VBATT | Battery backup input | Supplies RTC, SOSC, backup registers, and tamper detection during main power loss |
| XTAL / EXTAL | Main crystal oscillator interface | Supports 8–48 MHz crystal; enables precise clock source for Ethernet/USB timing-critical operation |
| XCIN / XCOUT | Sub-clock oscillator interface | 32.768 kHz crystal connection for RTC calendar accuracy and low-power wake-up timing |
| ETH_MDC / ETH_MDIO | Ethernet management interface | IEEE 802.3-compliant MDIO/MDC bus for PHY configuration and status monitoring |
| USBHS_DP / USBHS_DM | USB 2.0 High-Speed differential pair | Integrated transceiver supports 480 Mbps host/device operation; requires 90 Ω differential impedance routing |
| CANFD0_TX / CANFD0_RX | Channel 0 CAN FD physical interface | ISO 11898-1 compliant; supports classical CAN (1 Mbps) and CAN FD (up to 5 Mbps data phase) |
| OSPI_IO0–IO7 | Octal SPI bidirectional data lines | JESD251-compliant xSPI interface for direct execution from external HyperFlash™/HyperRAM™ |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP | Enables seamless firmware updates: new image written to inactive bank while active bank executes; atomic bank swap on reset |
| Decryption on-the-fly (DOTF) | Hardware-accelerated AES-128 decryption of external OSPI memory contents in real time, eliminating software overhead and memory exposure |
| TrustZone®-configured memory regions | Four configurable flash regions, two data flash regions, and two SRAM regions enforce hardware-isolated secure/non-secure worlds |
| Event Link Controller (ELC) | Direct peripheral-to-peripheral triggering without CPU intervention - e.g., ADC conversion completion → DMA transfer start → GPT capture |
| RSIP-E51A cryptographic engine | Accelerates AES-128/256 encryption/decryption, RSA-2048/4096 signing/verification, and SHA-256 hashing with side-channel resistance |
| Ultra-low-power timer (ULPT) | 32-bit timer operational in Deep Software Standby mode with VBATT supply, enabling sub-µA wake-up intervals for sensor polling |
Applications
| Industrial Ethernet Gateway | Automotive Body Control Module |
|---|---|
|
Use Scenario: Aggregating CAN FD, LIN, and Ethernet traffic in factory automation controllers with real-time protocol translation. IC Role / Device Role / Timing Role: Central protocol bridge with deterministic Ethernet MAC + dual CAN FD + OSPI for local firmware storage and update. Use Value: Hardware-accelerated DOTF ensures encrypted field-updates remain secure; TrustZone isolates safety-critical CAN FD stack from non-critical web services. |
Use Scenario: Managing door locks, lighting, HVAC, and diagnostics in electric vehicle platforms with ASIL-B readiness. IC Role / Device Role / Timing Role: Main body controller executing AUTOSAR-compliant stacks with dual CAN FD for powertrain and chassis communication. Use Value: RSIP-E51A enables secure key injection and OTA update authentication; 125°C rating supports under-hood deployment. |
| Secure Edge AI Inference Node | Medical Imaging Front-End Controller |
|
Use Scenario: Local preprocessing of sensor data (vibration, thermal, acoustic) before cloud upload in predictive maintenance systems. IC Role / Device Role / Timing Role: Real-time signal processor using Helium MVE for FFT/ML inference, with encrypted OSPI storage for model weights. Use Value: MVE vector units accelerate 12-bit ADC sample processing; DOTF prevents model theft from external flash. |
Use Scenario: Controlling ultrasound transducer arrays, digitizing analog front-end signals, and managing SD card DICOM export in portable imaging devices. IC Role / Device Role / Timing Role: High-precision timing controller synchronizing ADC sampling, DAC waveform generation, and SSIE audio streaming. Use Value: Dual 12-bit ADC12 units support simultaneous multi-channel acquisition; CEU captures raw image frames directly to SRAM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance secure MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FA6M2AF3CFP#AA0 | Arm Cortex-M4F @ 200 MHz, 1 MB flash, no Ethernet/CAN FD, RSIP-E30A (AES-only), 100-pin LQFP | Limited to cost-sensitive industrial HMI or motor control without networking or advanced crypto | Select when Ethernet, CAN FD, or asymmetric crypto (RSA/ECC) are unnecessary and BOM cost is critical. |
| R7FA8M1AHECBD#AA0 | Same RA8M1 family, 224-pin BGA, 2 MB flash, full peripheral set including SDRAM interface and 174 GPIOs | Required for designs needing >128 I/O, external SDRAM, or higher-density packaging for space-constrained layouts | Choose for maximum I/O count, SDRAM expansion, or board-level miniaturization where BGA is acceptable. |
Compared with R7FA8M1AHECFC#BA0, the R7FA6M2AF3CFP#AA0 reduces performance, security, and connectivity for lower-cost embedded control, while the R7FA8M1AHECBD#AA0 extends I/O, memory bandwidth, and package density at the expense of LQFP assembly simplicity.
Availability
R7FA8M1AHECFC#BA0 is available at Aetrix Electronics and suitable for industrial gateways, automotive body electronics, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for R7FA8M1AHECFC#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.
The RA8M1 group delivers high-performance, secure Arm Cortex-M85 MCUs targeting next-generation industrial IoT, automotive domain controllers, and edge AI - emphasizing hardware-enforced security, real-time determinism, and scalable memory/peripheral integration.
FAQ
What is the maximum operating frequency and core architecture of the R7FA8M1AHECFC#BA0?
The R7FA8M1AHECFC#BA0 features an Arm Cortex-M85 core with Helium technology, operating at a maximum frequency of 480 MHz. It implements the Armv8.1-M architecture profile with Armv8-M Security Extension, includes a floating-point unit compliant with IEEE 754-2008, and supports M-profile Vector Extension (MVE) for efficient signal processing. This architecture enables high-throughput deterministic execution required for real-time industrial and automotive applications.
Does the R7FA8M1AHECFC#BA0 support hardware-accelerated cryptography, and what algorithms are implemented?
Yes, the R7FA8M1AHECFC#BA0 integrates the Renesas Secure IP (RSIP-E51A) engine, which provides hardware acceleration for symmetric cryptography (AES-128/256), asymmetric cryptography (RSA-2048/4096, ECC NIST P-256/P-384), and message digest computation (SHA-256). It also includes a 128-bit unique ID, 256-bit hardware unique key (HUK), true random number generation, and SPA/DPA countermeasures - all confirmed in R01DS0417EJ0130 Rev.1.30 Section 1.12.
What package type and pin count does the R7FA8M1AHECFC#BA0 use, and is it RoHS-compliant?
The R7FA8M1AHECFC#BA0 uses a 176-pin LQFP package (PLQP0176KJ-A), measuring 24 mm × 24 mm with 0.5 mm pitch. It is RoHS-compliant with Sn (tin) terminal finish (denoted by "A" in the part number suffix). This package supports 128 general-purpose I/O pins and is rated for −40°C to +125°C junction temperature, making it suitable for demanding industrial and automotive environments.
How does the R7FA8M1AHECFC#BA0 implement secure boot and runtime isolation?
The R7FA8M1AHECFC#BA0 implements secure boot via immutable ROM-based First Stage Bootloader (FSBL) and hardware-enforced TrustZone® memory regions. TrustZone partitions code flash into up to four configurable regions, data flash into two regions, and SRAM into two regions - each assigned Secure or Non-secure attribution. Combined with RSIP-E51A key management and secure debug disable, this creates a certified root of trust for firmware validation and runtime domain separation.
What external memory interfaces does the R7FA8M1AHECFC#BA0 support, and what standards do they comply with?
The R7FA8M1AHECFC#BA0 supports Octal SPI (OSPI) compliant with JEDEC JESD251 (xSPI), JESD251-1, and JESD252 standards - enabling direct XIP from HyperFlash™ and HyperRAM™. It also supports SD/MMC Host Interface (SDHI) compliant with SD 4.0/SDHC/SDXC and eMMC 4.51 (JESD84-B451), plus optional external bus interface (EBI) and SDRAM controller in selected variants - though EBI/SDRAM are not enabled in the 176-pin LQFP variant per Table 1.14.
R7FA8M1AHECFC#BA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LQFP
- Series:
- RA8M1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-M85
- Core Size:
- 32-Bit
- Speed:
- 400MHz
- Connectivity:
- CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB
- Peripherals:
- AES, DMA, LVD, POR, PWM, RSA, Temp Sensor, WDT
- Number of I/O:
- 128
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 12K x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.65V ~ 3.6V
- Data Converters:
- A/D 24x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FA8M1AHECFC#BA0 FAQ
1.How can I place an order for R7FA8M1AHECFC#BA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FA8M1AHECFC#BA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FA8M1AHECFC#BA0 reliable?
The price and inventory of R7FA8M1AHECFC#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FA8M1AHECFC#BA0 is usually 5 days.
3.What payment methods are accepted for R7FA8M1AHECFC#BA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FA8M1AHECFC#BA0 transactions.
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4.How is shipping managed for R7FA8M1AHECFC#BA0?
R7FA8M1AHECFC#BA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FA8M1AHECFC#BA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FA8M1AHECFC#BA0?
For technical support, including R7FA8M1AHECFC#BA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FA8M1AHECFC#BA0 requirements.
6.How does Aetrix verify that R7FA8M1AHECFC#BA0 is sourced from the original manufacturer or authorized distributors?
All R7FA8M1AHECFC#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FA8M1AHECFC#BA0 meets industry standards.
7.What is the process for return or replacement of R7FA8M1AHECFC#BA0?
All R7FA8M1AHECFC#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FA8M1AHECFC#BA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FA8M1AHECFC#BA0 part is unused and in its original packaging.
Return procedure for R7FA8M1AHECFC#BA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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