Renesas R7FS3A17C2A01CBJ#AC0
- Part No.:
- R7FS3A17C2A01CBJ#AC0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 121-LFBGA
- Datasheet:
-
R7FS3A17C2A01CBJ#AC0.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 121LFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:257
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Product details
Overview
R7FS3A17C2A01CBJ from Renesas is a 48-MHz Arm Cortex-M4 microcontroller with FPU, 1-MB code flash, 192-KB SRAM, and integrated analog peripherals including 14-bit ADC, 12-bit DAC, dual ACMPLP comparators, and four OPAMPs. It supports USB 2.0 Full-Speed with on-chip transceiver, CAN 2.0B, SDHI, QSPI, and capacitive touch sensing (CTSU), targeting industrial HMI and battery-backed metering systems.
For engineers reviewing the R7FS3A17C2A01CBJ datasheet, R7FS3A17C2A01CBJ pinout, R7FS3A17C2A01CBJ application, or R7FS3A17C2A01CBJ equivalent, key selection criteria include its 121-pin BGA package, -40°C to +85°C operating range, 1.6–5.5 V supply, ECC-protected SRAM, and integrated Segment LCD Controller (SLCDC) for low-power display interfaces.
Technical Context
This MCU implements an Armv7E-M architecture with DSP extensions and single-precision FPU, supporting deterministic real-time control via GPT32×4 and AGT×2 timers. Its memory subsystem includes 1-MB code flash with 8-KB data flash (100k P/E cycles), 192-KB SRAM split into 16-KB ECC-protected and 176-KB parity-checked regions, and Memory Mirror Function for flexible firmware load/link separation.
The peripheral set enables mixed-signal edge-node processing: USBFS with Battery Charging 1.2 compliance, CAN module with 32 mailboxes and ISO 11898-1 support, SDHI for secure removable storage, and CTSU with 27 sensor channels - all coordinated via Event Link Controller (ELC) to minimize CPU intervention in time-critical signal chains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M4 @ 48 MHz with FPU and MPU (8 regions) |
| Memory | 1-MB code flash, 8-KB data flash (100k P/E), 192-KB SRAM (16-KB ECC + 176-KB parity) |
| Analog Peripherals | 14-bit ADC (25 ch), 12-bit DAC, dual 8-bit DAC (for ACMPLP), 2× ACMPLP, 4× OPAMP, TSN |
| Connectivity | USB 2.0 FS (on-chip transceiver), CAN 2.0B (32 mailboxes), SCI×6, IIC×3, SPI×2, QSPI, SDHI |
| HMI & Timing | SLCDC (4×54/8×50 seg), CTSU (27 ch), RTC with calendar & battery backup, AGT×2, GPT32×4/GPT16×6 |
| Security & Safety | SCE5 (AES128/256, GHASH, TRNG), CRC calculator, DOC, IWDT, CAC, register write protection |
| Package & Environment | 121-pin BGA (8 mm × 8 mm, 0.65 mm pitch), -40°C to +85°C, 1.6–5.5 V supply |
Pinout & Package
Package: 121-pin BGA (PLBG0121JA-A), 8 mm × 8 mm, 0.65 mm pitch, RoHS-compliant Sn terminal finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power / Ground | Dual power domains: VCC (1.6–5.5 V main supply), VSS (digital ground); decoupling required per datasheet layout guidelines |
| VBATT | Battery Backup Supply | Enables RTC/calendar retention and wakeup during main power loss; supports automatic VCC/VBATT switchover |
| XTAL / EXTAL | Main Clock Input | Accepts 1–20 MHz crystal or external clock; enables high-accuracy timing for USB, CAN, and real-time control loops |
| XCIN / XCOUT | Sub-Clock Oscillator | 32.768 kHz crystal interface for RTC calendar mode and low-power wake-up timing |
| RES | Reset Input | Active-low asynchronous reset pin; initiates full system initialization and register clearing |
| TMS / TCK / TDO / SWDIO / SWCLK | Debug Interface | Supports JTAG and Serial Wire Debug (SWD) for full-core visibility, trace (SWO), and non-intrusive firmware update |
| USB_VBUS / USB_DP / USB_DM | USB Physical Layer | Integrated USB 2.0 FS transceiver with internal 3.3-V LDO; VBUS detection enables host/device role negotiation |
| CTX0–CTX26 | CTSU Electrode Inputs | 27 dedicated pins for capacitive touch sensing; support mutual/self-capacitance measurement without external components |
| SEG0–SEG53 / COM0–COM7 | SLCDC Outputs | Drive up to 54 segments × 4 commons or 50 segments × 8 commons; internal voltage boost enables direct LCD panel driving |
Key Features
| Feature | Design Value |
|---|---|
| Memory Mirror Function (MMF) | Decouples firmware load address from link address-enables field updates without re-linking or address remapping |
| Event Link Controller (ELC) | Hardware-triggered peripheral chaining (e.g., ADC conversion → DMA transfer → CRC calculation) without CPU overhead |
| Secure Crypto Engine 5 (SCE5) | Hardware-accelerated AES128/256 encryption/decryption and GHASH authentication-reduces latency vs. software-only crypto |
| Low-Power Analog Comparator (ACMPLP) | Dual ultra-low-power comparators with selectable speed modes (high-speed/low-current) and DAC8 reference inputs |
| Segment LCD Controller (SLCDC) | On-chip voltage boosting and contrast control (16-step Vref) eliminate external LCD bias circuitry and reduce BOM cost |
Applications
| Industrial Metering | Smart Home HMI |
|---|---|
Use Scenario: Electricity/water/gas meter with tamper detection, battery backup, and local display. IC Role / Device Role / Timing Role: Main controller managing metrology ADC sampling, RTC-based billing intervals, SLCDC-driven segment display, and CTSU-based keypad. Use Value: Integrated 14-bit ADC, battery-backed RTC, and SLCDC eliminate external precision references and display drivers-reducing component count by ≥4 ICs. | Use Scenario: Wall-mounted thermostat with capacitive touch buttons, temperature sensing, and LCD status display. IC Role / Device Role / Timing Role: System-on-chip handling ambient TSN reading, CTSU button scan, SLCDC display refresh, and USB/SDHI firmware updates. Use Value: Single-chip integration of OPAMP (for sensor conditioning), ACMPLP (for window comparator thresholds), and CTSU (27-channel touch) enables compact, low-cost PCB layout. |
| Automotive Body Control | Medical Portable Device |
Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting with CAN diagnostics. IC Role / Device Role / Timing Role: CAN node processor executing LIN/CAN gateway logic, PWM motor control (GPT32), and fault monitoring (IWDT, LVD). Use Value: CAN 2.0B compliance with 32 mailboxes and hardware ELC-triggered diagnostics reduces software interrupt latency by >60% vs. polling-based implementations. | Use Scenario: Handheld blood glucose monitor with analog front-end, touch UI, and USB data export. IC Role / Device Role / Timing Role: Mixed-signal controller acquiring biosensor signals via ADC14, filtering with OPAMP, validating via SCE5-secured calibration data, and exporting via USBFS. Use Value: On-chip TRNG and AES256 enable HIPAA-compliant data encryption at source-eliminating need for external secure element and associated I²C routing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FS3A17C2A01CLK | 145-pin LGA package; supports full 54-segment × 4-common SLCDC and 28-channel ADC14 | Higher pin count enables more GPIO, larger LCD, and additional analog inputs for expanded HMI or sensor fusion | Select when requiring maximum SLCDC resolution or >25 ADC channels; not pin-compatible with R7FS3A17C2A01CBJ |
| R7FS3A17C3A01CFB | 144-pin LQFP, extended temp (-40°C to +105°C), same peripherals but reduced CTSU (24 ch) and SLCDC (46 seg × 4 com) | Targeted for under-hood automotive or industrial environments where thermal robustness outweighs touch channel count | Choose for high-temp operation; requires PCB redesign due to LQFP vs. BGA footprint and different pin mapping |
Compared with R7FS3A17C2A01CBJ, the CLK variant offers higher I/O and analog channel density in LGA packaging for space-constrained HMI, while the CFB variant trades touch and display capability for extended temperature resilience in LQFP-neither is pin-compatible, requiring layout revision for migration.
Availability
R7FS3A17C2A01CBJ is available at Aetrix Electronics and suitable for industrial metering, smart home HMI, automotive body control, and portable medical devices requiring stable component supply across long product lifecycles.
Supply support for R7FS3A17C2A01CBJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.
The R7FS3A17C2A01CBJ belongs to the S3A1 Microcontroller Group-a Renesas Synergy™ platform product line designed for scalable, secure, and low-power human-machine interface and mixed-signal edge applications.
FAQ
What is the maximum operating frequency and core architecture of the R7FS3A17C2A01CBJ?
The R7FS3A17C2A01CBJ features an Arm Cortex-M4 core with Floating Point Unit (FPU), operating at a maximum frequency of 48 MHz. It implements the Armv7E-M architecture with DSP instruction set and Arm Memory Protection Unit (MPU) supporting eight protected memory regions. This configuration delivers deterministic real-time performance for control-intensive applications while maintaining energy efficiency in battery-powered systems.
Does the R7FS3A17C2A01CBJ support USB device functionality with integrated physical layer?
Yes, the R7FS3A17C2A01CBJ integrates a USB 2.0 Full-Speed Module (USBFS) with an on-chip transceiver and internal 3.3-V LDO regulator. It supports both host and device roles, complies with USB Battery Charging Specification 1.2, and provides up to 10 configurable pipes. The USBFS eliminates the need for external PHY components, reducing BOM cost and PCB area-critical for compact HMI and portable designs using the R7FS3A17C2A01CBJ.
How many analog input channels does the 14-bit ADC (ADC14) support on the R7FS3A17C2A01CBJ?
The R7FS3A17C2A01CBJ's 14-bit A/D Converter (ADC14) supports 25 analog input channels, as confirmed in Table 1.15 (Function Comparison) of the datasheet. This count is specific to the 121-pin BGA variant (R7FS3A17C2A01CBJ); other packages offer 26–28 channels. The ADC14 also supports selectable 12-/14-bit resolution modes and internal references (TSN, Vref), enabling optimization between speed and precision in sensor acquisition workflows.
What is the purpose of the Memory Mirror Function (MMF) in the R7FS3A17C2A01CBJ?
The Memory Mirror Function (MMF) in the R7FS3A17C2A01CBJ allows application code to be linked to execute from a virtual "mirror" address space (23-bit unused region), while being physically stored at any location in the 1-MB code flash. This decouples firmware load address from link address-enabling over-the-air updates, bootloader flexibility, and simplified field firmware patching without requiring recompilation or address remapping in the R7FS3A17C2A01CBJ's toolchain.
Which security features are implemented in hardware on the R7FS3A17C2A01CBJ?
The R7FS3A17C2A01CBJ integrates Renesas' Secure Crypto Engine 5 (SCE5), providing hardware-accelerated AES128/256 encryption/decryption, GHASH authentication, and True Random Number Generation (TRNG). Additional hardware security includes ECC for 16-KB SRAM, CRC calculator with snoop function, Data Operation Circuit (DOC), register write protection, and illegal memory access detection-all enforced without CPU intervention to ensure deterministic, low-latency protection in the R7FS3A17C2A01CBJ's runtime environment.
R7FS3A17C2A01CBJ#AC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 121-LFBGA
- Series:
- Renesas Synergy™ S3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 48MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB
- Peripherals:
- DMA, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 104
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.6V ~ 5.5V
- Data Converters:
- A/D 26x14b; D/A 2x8b, 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FS3A17C2A01CBJ#AC0 FAQ
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6.How does Aetrix verify that R7FS3A17C2A01CBJ#AC0 is sourced from the original manufacturer or authorized distributors?
All R7FS3A17C2A01CBJ#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FS3A17C2A01CBJ#AC0 meets industry standards.
7.What is the process for return or replacement of R7FS3A17C2A01CBJ#AC0?
All R7FS3A17C2A01CBJ#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FS3A17C2A01CBJ#AC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FS3A17C2A01CBJ#AC0 part is unused and in its original packaging.
Return procedure for R7FS3A17C2A01CBJ#AC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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