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Renesas R7FS3A17C2A01CBJ#AC0

Part No.:
R7FS3A17C2A01CBJ#AC0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
121-LFBGA
Datasheet:
AetrixR7FS3A17C2A01CBJ#AC0.pdf
Description:
IC MCU 32BIT 1MB FLASH 121LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:257

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Product details

Overview

R7FS3A17C2A01CBJ from Renesas is a 48-MHz Arm Cortex-M4 microcontroller with FPU, 1-MB code flash, 192-KB SRAM, and integrated analog peripherals including 14-bit ADC, 12-bit DAC, dual ACMPLP comparators, and four OPAMPs. It supports USB 2.0 Full-Speed with on-chip transceiver, CAN 2.0B, SDHI, QSPI, and capacitive touch sensing (CTSU), targeting industrial HMI and battery-backed metering systems.

For engineers reviewing the R7FS3A17C2A01CBJ datasheet, R7FS3A17C2A01CBJ pinout, R7FS3A17C2A01CBJ application, or R7FS3A17C2A01CBJ equivalent, key selection criteria include its 121-pin BGA package, -40°C to +85°C operating range, 1.6–5.5 V supply, ECC-protected SRAM, and integrated Segment LCD Controller (SLCDC) for low-power display interfaces.

Technical Context

This MCU implements an Armv7E-M architecture with DSP extensions and single-precision FPU, supporting deterministic real-time control via GPT32×4 and AGT×2 timers. Its memory subsystem includes 1-MB code flash with 8-KB data flash (100k P/E cycles), 192-KB SRAM split into 16-KB ECC-protected and 176-KB parity-checked regions, and Memory Mirror Function for flexible firmware load/link separation.

The peripheral set enables mixed-signal edge-node processing: USBFS with Battery Charging 1.2 compliance, CAN module with 32 mailboxes and ISO 11898-1 support, SDHI for secure removable storage, and CTSU with 27 sensor channels - all coordinated via Event Link Controller (ELC) to minimize CPU intervention in time-critical signal chains.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-M4 @ 48 MHz with FPU and MPU (8 regions)
Memory1-MB code flash, 8-KB data flash (100k P/E), 192-KB SRAM (16-KB ECC + 176-KB parity)
Analog Peripherals14-bit ADC (25 ch), 12-bit DAC, dual 8-bit DAC (for ACMPLP), 2× ACMPLP, 4× OPAMP, TSN
ConnectivityUSB 2.0 FS (on-chip transceiver), CAN 2.0B (32 mailboxes), SCI×6, IIC×3, SPI×2, QSPI, SDHI
HMI & TimingSLCDC (4×54/8×50 seg), CTSU (27 ch), RTC with calendar & battery backup, AGT×2, GPT32×4/GPT16×6
Security & SafetySCE5 (AES128/256, GHASH, TRNG), CRC calculator, DOC, IWDT, CAC, register write protection
Package & Environment121-pin BGA (8 mm × 8 mm, 0.65 mm pitch), -40°C to +85°C, 1.6–5.5 V supply

Pinout & Package

Package: 121-pin BGA (PLBG0121JA-A), 8 mm × 8 mm, 0.65 mm pitch, RoHS-compliant Sn terminal finish.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower / GroundDual power domains: VCC (1.6–5.5 V main supply), VSS (digital ground); decoupling required per datasheet layout guidelines
VBATTBattery Backup SupplyEnables RTC/calendar retention and wakeup during main power loss; supports automatic VCC/VBATT switchover
XTAL / EXTALMain Clock InputAccepts 1–20 MHz crystal or external clock; enables high-accuracy timing for USB, CAN, and real-time control loops
XCIN / XCOUTSub-Clock Oscillator32.768 kHz crystal interface for RTC calendar mode and low-power wake-up timing
RESReset InputActive-low asynchronous reset pin; initiates full system initialization and register clearing
TMS / TCK / TDO / SWDIO / SWCLKDebug InterfaceSupports JTAG and Serial Wire Debug (SWD) for full-core visibility, trace (SWO), and non-intrusive firmware update
USB_VBUS / USB_DP / USB_DMUSB Physical LayerIntegrated USB 2.0 FS transceiver with internal 3.3-V LDO; VBUS detection enables host/device role negotiation
CTX0–CTX26CTSU Electrode Inputs27 dedicated pins for capacitive touch sensing; support mutual/self-capacitance measurement without external components
SEG0–SEG53 / COM0–COM7SLCDC OutputsDrive up to 54 segments × 4 commons or 50 segments × 8 commons; internal voltage boost enables direct LCD panel driving

Key Features

FeatureDesign Value
Memory Mirror Function (MMF)Decouples firmware load address from link address-enables field updates without re-linking or address remapping
Event Link Controller (ELC)Hardware-triggered peripheral chaining (e.g., ADC conversion → DMA transfer → CRC calculation) without CPU overhead
Secure Crypto Engine 5 (SCE5)Hardware-accelerated AES128/256 encryption/decryption and GHASH authentication-reduces latency vs. software-only crypto
Low-Power Analog Comparator (ACMPLP)Dual ultra-low-power comparators with selectable speed modes (high-speed/low-current) and DAC8 reference inputs
Segment LCD Controller (SLCDC)On-chip voltage boosting and contrast control (16-step Vref) eliminate external LCD bias circuitry and reduce BOM cost

Applications

Industrial MeteringSmart Home HMI

Use Scenario: Electricity/water/gas meter with tamper detection, battery backup, and local display.

IC Role / Device Role / Timing Role: Main controller managing metrology ADC sampling, RTC-based billing intervals, SLCDC-driven segment display, and CTSU-based keypad.

Use Value: Integrated 14-bit ADC, battery-backed RTC, and SLCDC eliminate external precision references and display drivers-reducing component count by ≥4 ICs.

Use Scenario: Wall-mounted thermostat with capacitive touch buttons, temperature sensing, and LCD status display.

IC Role / Device Role / Timing Role: System-on-chip handling ambient TSN reading, CTSU button scan, SLCDC display refresh, and USB/SDHI firmware updates.

Use Value: Single-chip integration of OPAMP (for sensor conditioning), ACMPLP (for window comparator thresholds), and CTSU (27-channel touch) enables compact, low-cost PCB layout.

Automotive Body ControlMedical Portable Device

Use Scenario: Door module controlling window lift, mirror adjustment, and interior lighting with CAN diagnostics.

IC Role / Device Role / Timing Role: CAN node processor executing LIN/CAN gateway logic, PWM motor control (GPT32), and fault monitoring (IWDT, LVD).

Use Value: CAN 2.0B compliance with 32 mailboxes and hardware ELC-triggered diagnostics reduces software interrupt latency by >60% vs. polling-based implementations.

Use Scenario: Handheld blood glucose monitor with analog front-end, touch UI, and USB data export.

IC Role / Device Role / Timing Role: Mixed-signal controller acquiring biosensor signals via ADC14, filtering with OPAMP, validating via SCE5-secured calibration data, and exporting via USBFS.

Use Value: On-chip TRNG and AES256 enable HIPAA-compliant data encryption at source-eliminating need for external secure element and associated I²C routing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R7FS3A17C2A01CLK145-pin LGA package; supports full 54-segment × 4-common SLCDC and 28-channel ADC14Higher pin count enables more GPIO, larger LCD, and additional analog inputs for expanded HMI or sensor fusionSelect when requiring maximum SLCDC resolution or >25 ADC channels; not pin-compatible with R7FS3A17C2A01CBJ
R7FS3A17C3A01CFB144-pin LQFP, extended temp (-40°C to +105°C), same peripherals but reduced CTSU (24 ch) and SLCDC (46 seg × 4 com)Targeted for under-hood automotive or industrial environments where thermal robustness outweighs touch channel countChoose for high-temp operation; requires PCB redesign due to LQFP vs. BGA footprint and different pin mapping

Compared with R7FS3A17C2A01CBJ, the CLK variant offers higher I/O and analog channel density in LGA packaging for space-constrained HMI, while the CFB variant trades touch and display capability for extended temperature resilience in LQFP-neither is pin-compatible, requiring layout revision for migration.

Availability

R7FS3A17C2A01CBJ is available at Aetrix Electronics and suitable for industrial metering, smart home HMI, automotive body control, and portable medical devices requiring stable component supply across long product lifecycles.

Supply support for R7FS3A17C2A01CBJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.

The R7FS3A17C2A01CBJ belongs to the S3A1 Microcontroller Group-a Renesas Synergy™ platform product line designed for scalable, secure, and low-power human-machine interface and mixed-signal edge applications.

FAQ

What is the maximum operating frequency and core architecture of the R7FS3A17C2A01CBJ?

The R7FS3A17C2A01CBJ features an Arm Cortex-M4 core with Floating Point Unit (FPU), operating at a maximum frequency of 48 MHz. It implements the Armv7E-M architecture with DSP instruction set and Arm Memory Protection Unit (MPU) supporting eight protected memory regions. This configuration delivers deterministic real-time performance for control-intensive applications while maintaining energy efficiency in battery-powered systems.

Does the R7FS3A17C2A01CBJ support USB device functionality with integrated physical layer?

Yes, the R7FS3A17C2A01CBJ integrates a USB 2.0 Full-Speed Module (USBFS) with an on-chip transceiver and internal 3.3-V LDO regulator. It supports both host and device roles, complies with USB Battery Charging Specification 1.2, and provides up to 10 configurable pipes. The USBFS eliminates the need for external PHY components, reducing BOM cost and PCB area-critical for compact HMI and portable designs using the R7FS3A17C2A01CBJ.

How many analog input channels does the 14-bit ADC (ADC14) support on the R7FS3A17C2A01CBJ?

The R7FS3A17C2A01CBJ's 14-bit A/D Converter (ADC14) supports 25 analog input channels, as confirmed in Table 1.15 (Function Comparison) of the datasheet. This count is specific to the 121-pin BGA variant (R7FS3A17C2A01CBJ); other packages offer 26–28 channels. The ADC14 also supports selectable 12-/14-bit resolution modes and internal references (TSN, Vref), enabling optimization between speed and precision in sensor acquisition workflows.

What is the purpose of the Memory Mirror Function (MMF) in the R7FS3A17C2A01CBJ?

The Memory Mirror Function (MMF) in the R7FS3A17C2A01CBJ allows application code to be linked to execute from a virtual "mirror" address space (23-bit unused region), while being physically stored at any location in the 1-MB code flash. This decouples firmware load address from link address-enabling over-the-air updates, bootloader flexibility, and simplified field firmware patching without requiring recompilation or address remapping in the R7FS3A17C2A01CBJ's toolchain.

Which security features are implemented in hardware on the R7FS3A17C2A01CBJ?

The R7FS3A17C2A01CBJ integrates Renesas' Secure Crypto Engine 5 (SCE5), providing hardware-accelerated AES128/256 encryption/decryption, GHASH authentication, and True Random Number Generation (TRNG). Additional hardware security includes ECC for 16-KB SRAM, CRC calculator with snoop function, Data Operation Circuit (DOC), register write protection, and illegal memory access detection-all enforced without CPU intervention to ensure deterministic, low-latency protection in the R7FS3A17C2A01CBJ's runtime environment.

R7FS3A17C2A01CBJ#AC0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
121-LFBGA
Series:
Renesas Synergy™ S3
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, EBI/EMI, I2C, MMC/SD, QSPI, SCI, SSIE, SPI, UART/USART, USB
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
192K x 8
Voltage - Supply (Vcc/Vdd):
1.6V ~ 5.5V
Data Converters:
A/D 26x14b; D/A 2x8b, 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

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All R7FS3A17C2A01CBJ#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FS3A17C2A01CBJ#AC0 meets industry standards.

7.What is the process for return or replacement of R7FS3A17C2A01CBJ#AC0?

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1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7FS3A17C2A01CBJ#AC0 part is unused and in its original packaging.

Return procedure for R7FS3A17C2A01CBJ#AC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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