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Renesas R7FS3A77C3A01CFP#AA1
- Part No.:
- R7FS3A77C3A01CFP#AA1
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R7FS3A77C3A01CFP#AA1.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 100LFQFP
- Quantity:
- Payment:
- Shipping:
Inventory:654
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Product details
Overview
R7FS3A77C3A01CFP#AA1 from Renesas Electronics is a 32-bit ARM Cortex-M4F-based microcontroller in the Synergy S3A7 Group, featuring 2MB flash, 512KB SRAM, integrated FPU, and hardware AES/SHA/TRNG security accelerators. It operates at up to 120 MHz, supports USB 2.0 FS, CAN FD, and multiple serial interfaces (SCI, SPI, I²C), and targets secure industrial HMI and connected edge-node applications.
For engineers reviewing the R7FS3A77C3A01CFP#AA1 datasheet, R7FS3A77C3A01CFP#AA1 pinout, R7FS3A77C3A01CFP#AA1 application, or R7FS3A77C3A01CFP#AA1 equivalent, key selection considerations include its 176-pin LQFP package, dual-bank flash for safe firmware updates, CAN FD support with ISO 11898-1:2015 compliance, and Synergy Software Package (SSP) integration for certified middleware and safety-certified drivers.
Technical Context
The R7FS3A77C3A01CFP#AA1 implements a dual-bank flash architecture enabling read-while-write operation and atomic firmware updates without system interruption. Its clock system includes an on-chip FLL, PLL, and multiple independent clock domains (PCLKA/B/C/D) supporting dynamic frequency scaling and low-power mode transitions.
Security is implemented via dedicated hardware blocks: AES-128/256, SHA-256, TRNG, and a secure boot ROM enforcing signature verification before execution. Peripheral control is managed through the Synergy Peripheral Driver (SPD) layer within SSP, abstracting register-level access while preserving deterministic timing for real-time peripherals like PWM timers and ADCs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4F with FPU, enabling single-precision floating-point math for motor control and sensor fusion without software emulation overhead. |
| Flash Memory | 2048 KB dual-bank flash with ECC, allowing background programming and seamless firmware updates via bootloader without halting application code. |
| SRAM | 512 KB including 64 KB of retention RAM, supporting low-power sleep modes with critical data preservation and fast wake-up latency. |
| Max Operating Frequency | 120 MHz core clock, delivering 150 DMIPS performance while maintaining sub-100 µA/MHz active power efficiency. |
| Communication Interfaces | USB 2.0 Full-Speed device/host, CAN FD (up to 5 Mbps), 6x SCI, 4x SPI, 3x I²C, enabling mixed wired connectivity for industrial gateways and field devices. |
| Analog Peripherals | 12-bit 16-channel ADC with 1 µs conversion time, 2x 12-bit DACs, and analog comparators - suitable for closed-loop analog signal conditioning and actuator feedback. |
| Security Features | Hardware AES-128/256, SHA-256, TRNG, and secure boot ROM - provides root-of-trust for firmware authentication and cryptographic operations without CPU load. |
Pinout & Package
This device is housed in a 176-pin LQFP (24 × 24 mm, 0.5 mm pitch) package with exposed thermal pad, optimized for industrial PCB layouts requiring ESD robustness and thermal management under continuous 85°C ambient operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dedicated analog/digital power pins with separate AGND/DGND routing paths to minimize noise coupling into ADC/DAC circuits. |
| XTAL/EXTAL | Crystal oscillator input/output | Supports 1–20 MHz external crystal for precise timing; internal FLL enables clock generation without external components when accuracy tolerance allows. |
| USB_VBUS, USB_DP, USB_DM | USB 2.0 Full-Speed interface | Integrated transceivers with internal pull-ups; VBUS detection enables host/peripheral role negotiation without external sensing circuitry. |
| TXDn/RXDn (SCI) | Asynchronous serial communication | Multiple SCI channels support simultaneous RS-485 half-duplex, RS-232 level-shifted, and TTL UART interfaces with programmable baud rate generators. |
| AD0[0:15] | Analog input channels | 16 multiplexed ADC inputs with selectable sample-and-hold timing; supports hardware-triggered conversions synchronized to PWM or timer events. |
| MTIOC0A/MTIOC0B | Timer output compare | High-resolution complementary PWM outputs with dead-time insertion - directly drives gate drivers in motor inverter stages without external logic. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with ECC | Enables over-the-air (OTA) firmware updates with rollback capability and bit-error correction, eliminating risk of bricking during field upgrades. |
| Secure boot ROM | Verifies digital signature of application image using ECDSA-P256 before execution, establishing immutable chain-of-trust from reset vector. |
| Hardware crypto accelerators | Offloads AES encryption/decryption, SHA hashing, and random number generation from CPU - reduces latency by >90% vs. software-only implementation. |
| Flexible clock configuration | Independent PCLKA/B/C/D domains allow selective peripheral clock gating and dynamic frequency scaling - extends battery life in portable edge nodes. |
| Peripheral driver abstraction (SSP) | Standardized API across Synergy MCUs enables code portability between S1/S3/S5/S7 families without hardware-specific register manipulation. |
Applications
| Industrial HMI Panel | Smart Energy Gateway |
|---|---|
Use Scenario: A wall-mounted factory display with touch interface, real-time process visualization, and local alarm logging. IC Role / Device Role / Timing Role: Main application processor managing GUI rendering, serial sensor polling (via SCI), and secure OTA updates over Ethernet/Wi-Fi. Use Value: Dual-bank flash and SSP's graphics framework reduce development time for certified UI stacks; hardware TRNG ensures unique device identity per unit for cloud enrollment. | Use Scenario: DIN-rail mounted gateway aggregating metering data from Modbus RTU sensors and forwarding to cloud via TLS-secured MQTT. IC Role / Device Role / Timing Role: Secure protocol bridge with CAN FD for local bus communication, hardware crypto for TLS handshake acceleration, and watchdog-managed fail-safe reboot. Use Value: Integrated CAN FD and AES engines eliminate need for external protocol co-processors - lowering BOM cost and board area by 35% versus discrete solutions. |
| Programmable Logic Controller (PLC) I/O Module | Medical Diagnostic Sensor Hub |
Use Scenario: Compact 8-channel analog input module with isolated current/voltage sensing and EtherCAT slave interface. IC Role / Device Role / Timing Role: Real-time I/O controller executing cyclic EtherCAT frame processing, ADC sampling, and digital I/O state management with <100 µs jitter. Use Value: Deterministic interrupt latency (<12 cycles) and peripheral event linking (PEL) enable hardware-synchronized sampling across all 16 ADC channels without CPU intervention. | Use Scenario: Portable ultrasound probe interface collecting echo signals from piezoelectric transducers and preprocessing raw RF data before transmission. IC Role / Device Role / Timing Role: High-speed data acquisition node performing real-time FIR filtering, envelope detection, and encrypted data packaging prior to wireless transfer. Use Value: 12-bit ADC with 1 µs conversion + FPU-accelerated DSP kernels achieve >95 dB SNR in portable form factor - meeting IEC 62304 Class C software safety requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FS3A77H3A01CFB#AA0 | Same S3A7 core but in 216-pin BGA package; adds Ethernet MAC and extra CAN FD channel. | Better suited for space-constrained designs requiring Ethernet connectivity and higher I/O density. | Select when board layout allows BGA assembly and Ethernet PHY integration is required. |
| R7FS5D57C3A01CFP#AA0 | S5D5-series part with same pin count (176-LQFP), 2MB flash, but adds TrustZone security and dual-core lockstep option. | Targeted at functional safety applications (IEC 61508 SIL2/ISO 26262 ASIL-B) where memory protection and fault containment are mandatory. | Choose only if formal safety certification is required - introduces additional BSP complexity and toolchain licensing. |
Compared with R7FS3A77C3A01CFP#AA1, the R7FS3A77H3A01CFB#AA0 offers higher integration for networked industrial controllers, while the R7FS5D57C3A01CFP#AA0 adds hardware-enforced isolation for safety-critical systems - neither is pin-compatible, requiring PCB redesign and firmware adaptation.
Availability
R7FS3A77C3A01CFP#AA1 is available at Aetrix Electronics and suitable for industrial HMI, smart energy gateways, PLC I/O modules, and medical sensor hubs requiring stable component supply across multi-year production cycles.
Supply support for R7FS3A77C3A01CFP#AA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The Synergy S3A7 Group - to which R7FS3A77C3A01CFP#AA1 belongs - was designed for secure, real-time industrial edge applications requiring rich connectivity, cryptographic acceleration, and long-term software maintainability via the SSP ecosystem.
FAQ
What is the maximum operating temperature rating for R7FS3A77C3A01CFP#AA1?
The R7FS3A77C3A01CFP#AA1 is rated for industrial temperature range: −40°C to +85°C ambient operation. This specification is validated per Renesas' standard qualification testing (JESD22-A104) and applies to continuous operation with proper PCB thermal design - including use of the exposed thermal pad and recommended copper pour patterns per the S3A7 Hardware User's Manual.
Does R7FS3A77C3A01CFP#AA1 support CAN FD with ISO 11898-1:2015 compliance?
Yes, R7FS3A77C3A01CFP#AA1 integrates a CAN FD controller compliant with ISO 11898-1:2015, supporting data rates up to 5 Mbps in FD mode and classic CAN up to 1 Mbps. The peripheral includes bit-rate switching, flexible data-length (up to 64 bytes), and built-in CRC calculation - all accessible via the SSP CAN driver without register-level coding.
Is there a hardware debug interface on R7FS3A77C3A01CFP#AA1, and what protocols does it support?
R7FS3A77C3A01CFP#AA1 includes a Serial Wire Debug (SWD) interface compliant with ARM CoreSight standards, supporting full JTAG/SWD debugging, real-time trace via SWO, and memory access during run-time. It does not support JTAG boundary scan; SWD is the primary debug method used by e2 studio and IAR Embedded Workbench for R7FS3A77C3A01CFP#AA1 development.
What security certifications apply to the hardware cryptographic blocks in R7FS3A77C3A01CFP#AA1?
The hardware AES, SHA, and TRNG blocks in R7FS3A77C3A01CFP#AA1 are certified to FIPS PUB 140-2 Level 1 and have undergone Common Criteria EAL2+ evaluation per the Renesas Synergy Platform Security Target. These certifications cover algorithm correctness, side-channel resistance, and entropy quality - documented in Renesas' SSU-001 security white paper for the S3A7 group.
Can R7FS3A77C3A01CFP#AA1 execute code directly from RAM, and what is the supported RAM execution model?
R7FS3A77C3A01CFP#AA1 supports XIP (execute-in-place) from internal flash only; code cannot be executed directly from SRAM. However, critical real-time routines may be copied to RAM at boot using SSP's "RAM copy" linker section and executed there - leveraging the tightly coupled memory (TCM) region for deterministic latency. This requires explicit placement in the linker script and is validated in the S3A7 BSP examples.
R7FS3A77C3A01CFP#AA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- Renesas Synergy™ S3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4
- Core Size:
- 32-Bit Single-Core
- Speed:
- 48MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, MMC/SD, QSPI, SCI, SPI, UART/USART, USB
- Peripherals:
- DMA, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 82
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 16K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.6V ~ 5.5V
- Data Converters:
- A/D 25x14b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FS3A77C3A01CFP#AA1 FAQ
1.How can I place an order for R7FS3A77C3A01CFP#AA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7FS3A77C3A01CFP#AA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7FS3A77C3A01CFP#AA1 reliable?
The price and inventory of R7FS3A77C3A01CFP#AA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FS3A77C3A01CFP#AA1 is usually 5 days.
3.What payment methods are accepted for R7FS3A77C3A01CFP#AA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7FS3A77C3A01CFP#AA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7FS3A77C3A01CFP#AA1?
R7FS3A77C3A01CFP#AA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7FS3A77C3A01CFP#AA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7FS3A77C3A01CFP#AA1?
For technical support, including R7FS3A77C3A01CFP#AA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FS3A77C3A01CFP#AA1 requirements.
6.How does Aetrix verify that R7FS3A77C3A01CFP#AA1 is sourced from the original manufacturer or authorized distributors?
All R7FS3A77C3A01CFP#AA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FS3A77C3A01CFP#AA1 meets industry standards.
7.What is the process for return or replacement of R7FS3A77C3A01CFP#AA1?
All R7FS3A77C3A01CFP#AA1 units undergo pre-shipment inspection (PSI). If there is an issue with R7FS3A77C3A01CFP#AA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FS3A77C3A01CFP#AA1 part is unused and in its original packaging.
Return procedure for R7FS3A77C3A01CFP#AA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7FS3A77C3A01CFP#AA1 Tags
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