Renesas R7FS5D37A3A01CFP#BA0
- Part No.:
- R7FS5D37A3A01CFP#BA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R7FS5D37A3A01CFP#BA0.pdf
- Description:
- IC MCU 32BIT 512KB FLSH 100LFQFP
- Quantity:
- Payment:

- Shipping:

Inventory:710
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Product details
Overview
R7FS5D37A3A01CFP#BA0 from Renesas Electronics is a high-integration Arm Cortex-M4 microcontroller operating at 120 MHz with FPU, 512-KB code flash, 256-KB SRAM, and dual CAN interfaces. It integrates CTSU for capacitive touch, USB 2.0 Full-Speed with on-chip transceiver, SDHI ×2, QSPI, and advanced analog peripherals including dual 12-bit ADCs with sample-and-hold and dual 12-bit DACs. It targets industrial HMI, motor control, and secure embedded gateways requiring functional safety and cryptographic acceleration.
For engineers reviewing the R7FS5D37A3A01CFP#BA0 datasheet, R7FS5D37A3A01CFP#BA0 pinout, R7FS5D37A3A01CFP#BA0 application, or R7FS5D37A3A01CFP#BA0 equivalent, key selection considerations include its -40°C to +105°C temperature grade, 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch), dual CAN 2.0B compliance, SCE7 crypto engine supporting AES-256/SHA256/RSA/ECC, and integrated RTC with VBATT backup.
Technical Context
This MCU implements an Armv7E-M architecture with DSP extensions and single-precision FPU, enabling deterministic real-time signal processing. Its memory subsystem includes ECC-protected SRAM (32 KB), parity-checked SRAM (224 KB), 8-KB data flash rated for 125,000 erase/write cycles, and Memory Mirror Function (MMF) for flexible firmware load/link address decoupling.
The peripheral set supports concurrent high-bandwidth I/O: dual SDHI controllers for redundant card slots, QSPI for external XIP flash, SSIE with 32-stage FIFOs for multi-channel audio, and ELC-driven autonomous peripheral chaining-eliminating CPU intervention for time-critical event sequences such as PWM-triggered ADC sampling or CAN-to-DMA transfers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M4 @ 120 MHz with FPU and DSP instruction set - enables real-time floating-point math for motor control and sensor fusion. |
| Memory | 512-KB code flash (zero-wait-state at 40 MHz), 8-KB data flash (125k cycles), 256-KB SRAM (32 KB ECC + 224 KB parity) - supports robust firmware storage and runtime data integrity. |
| Analog Peripherals | Dual 12-bit ADC12 (11+8 channels, 3-sample-and-hold per unit), dual 12-bit DAC12, 6× ACMPHS, 6× PGA, TSN - enables simultaneous multi-sensor acquisition and closed-loop analog control. |
| Connectivity | USB 2.0 FS (host/device, on-chip transceiver), CAN ×2 (ISO 11898-1, 32 mailboxes), SCI ×7, SPI ×2, I²C ×2, QSPI, SDHI ×2 - supports industrial fieldbus bridging and multimedia peripheral expansion. |
| Security & Safety | SCE7 crypto engine (AES-128/192/256, SHA256, RSA/ECC, TRNG), CAC, CRC, DOC, IWDT, MPU, SRAM ECC/parity - meets IEC 61508 SIL2 and ISO 26262 ASIL-B readiness requirements. |
| Package & Environment | 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), 2.7–3.6 V supply, -40°C to +105°C operation - suitable for extended-temperature industrial control cabinets and automotive under-hood modules. |
Pinout & Package
Package: 100-pin LQFP (PLQP0100KB-B), 14 mm × 14 mm body, 0.5 mm pitch, Pb-free Sn terminal finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Digital power supply and ground | Decoupled via 0.1-μF capacitor per VCC pin; VSS forms reference plane for all digital logic and analog circuits. |
| XTAL / EXTAL | Main clock oscillator interface | Supports 8–24 MHz crystal or external clock input; enables precise timing for USB, CAN, and RTC synchronization. |
| MD | Operating mode select | Configures boot mode (single-chip vs. SCI/USB boot) at reset; must remain stable during reset release. |
| RES | Active-low reset input | Asynchronous system reset; triggers full initialization sequence including register write protection and MPU setup. |
| USB_VBUS / USB_DP / USB_DM | USB 2.0 Full-Speed interface | On-chip transceiver eliminates external PHY; VBUS detection enables host/device role negotiation without external circuitry. |
| CTX0 / CTX1 / CTX2 / CTX3 | Capacitive Touch Sensing Unit electrodes | Direct connection to touch pads; CTSU hardware performs auto-calibration and noise rejection, reducing firmware overhead. |
| CAN0_TX / CAN0_RX / CAN1_TX / CAN1_RX | Controller Area Network differential pairs | Each pair requires external 120-Ω termination; supports fault-tolerant communication in noisy industrial environments up to 1 Mbps. |
| SD0_CLK / SD0_CMD / SD0_DAT0–3 | SD/MMC Host Interface 0 signals | Supports SDHC/SDXC cards in 1-bit or 4-bit bus mode; DMA-driven transfers enable streaming media playback without CPU load. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Mirror Function (MMF) | Maps flash load address to arbitrary link address in 23-bit unused space - simplifies firmware updates by eliminating relocation code and enabling A/B swap without linker script changes. |
| Event Link Controller (ELC) | Hardware routing of 128+ peripheral events (e.g., GPT overflow → ADC trigger → DMA transfer) - removes interrupt latency and CPU polling for deterministic real-time response. |
| Secure Crypto Engine 7 (SCE7) | Hardware-accelerated AES-256, SHA256, RSA-2048, ECC P-256, and TRNG - achieves >10× speedup over software crypto while isolating keys from main memory. |
| Capacitive Touch Sensing Unit (CTSU) | 12-channel self-capacitance measurement with built-in noise cancellation and automatic drift compensation - enables reliable touch buttons/sliders through 3-mm plastic overlays without shield layers. |
| Sampling Rate Converter (SRC) | Real-time audio sample rate conversion (e.g., 44.1 kHz ↔ 48 kHz) for SSIE streams - eliminates need for external audio DSP in voice-controlled HMI or industrial audio monitoring systems. |
Applications
| Industrial HMI Panel | Automotive Body Control Module |
|---|---|
Use Scenario: 7-inch capacitive touchscreen panel with real-time diagnostics, CAN bus gateway, and local firmware update capability. IC Role / Device Role / Timing Role: Main application processor handling GUI rendering, CTSU touch scanning, dual CAN message routing, and USB-based firmware download. Use Value: Integrated SCE7 enables signed firmware validation; MMF allows seamless in-field updates; 105°C rating ensures reliability in uncooled enclosures. | Use Scenario: Central body controller managing door locks, lighting, window lift, and climate fan via LIN/CAN networks. IC Role / Device Role / Timing Role: Safety-aware system controller executing ASIL-B diagnostic routines, driving high-current GPIOs (20 mA), and logging faults to data flash. Use Value: IWDT + CAC + SRAM ECC detect and recover from transient faults; 125k-cycle data flash stores lifetime calibration and error logs. |
| Smart Energy Gateway | Industrial BLDC Motor Drive |
Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU, M-Bus, and wireless sensor data for cloud upload via Ethernet/Wi-Fi bridge. IC Role / Device Role / Timing Role: Protocol translation hub with dual SDHI for local data buffering, QSPI for encrypted configuration storage, and USB host for field service tool connectivity. Use Value: Dual SDHI supports redundant logging; SCE7 secures OTA updates; 64-pin QFN variant (R7FS5D37A3A01CNB) offers smaller footprint for space-constrained designs. | Use Scenario: 3-phase BLDC drive for HVAC compressors with hall-effect commutation, current sensing, and thermal monitoring. IC Role / Device Role / Timing Role: Motion controller generating 3-phase PWM (GTOUUP/GTOULO etc.), sampling shunt voltages via ADC12 with synchronized sample-and-hold, and regulating speed via PID on FPU. Use Value: GPT32EH timers deliver <100 ns PWM resolution; ACMPHS + PGA enable fast overcurrent shutdown; TSN monitors die temperature for derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7FS5D37A3A01CLJ | LGA-100 package (7 mm × 7 mm, 0.65 mm pitch); identical electrical specs and feature set. | Better suited for high-density PCBs where footprint area is constrained; requires different reflow profile due to bottom-termination LGA. | Select when board space is critical and assembly process supports LGA; pinout is identical but land pattern differs. |
| R7FS5D37A2A01CLJ | Same LGA-100 package but rated for -40°C to +85°C; otherwise identical peripherals and memory. | Targeted at commercial/indoor applications without extended temperature requirements; lower cost due to reduced qualification testing. | Choose for cost-sensitive indoor equipment where ambient temperature stays below 85°C; not suitable for under-hood or outdoor deployments. |
Compared with R7FS5D37A3A01CFP#BA0, the LGA variants offer superior thermal dissipation and smaller footprint but require more complex PCB layout and assembly; the -85°C version reduces thermal margin and qualification scope, trading environmental robustness for bill-of-materials savings in benign environments.
Availability
R7FS5D37A3A01CFP#BA0 is available at Aetrix Electronics and suitable for industrial HMI, automotive body control, smart energy gateways, and BLDC motor drives requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for R7FS5D37A3A01CFP#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded design innovation since 2010, with expertise in microcontrollers, analog, power, and SoC solutions.
The R7FS5D37A3A01CFP#BA0 belongs to the Synergy S5D3 microcontroller group, designed specifically for scalable, secure, and safety-conscious industrial and automotive applications demanding high analog integration, real-time connectivity, and cryptographic acceleration.
FAQ
What is the maximum operating frequency and core architecture of the R7FS5D37A3A01CFP#BA0?
The R7FS5D37A3A01CFP#BA0 features an Arm Cortex-M4 core with Floating Point Unit (FPU) operating at a maximum frequency of 120 MHz. It implements the Armv7E-M architecture with DSP instruction extensions, enabling high-performance real-time signal processing. This specification is confirmed in the official Renesas datasheet R01DS0328EU0120 Rev.1.20, Section 1.1 and Table 1.1. The R7FS5D37A3A01CFP#BA0 delivers deterministic execution for motor control, sensor fusion, and audio processing tasks.
Does the R7FS5D37A3A01CFP#BA0 support CAN FD or only classical CAN 2.0?
The R7FS5D37A3A01CFP#BA0 supports only classical CAN 2.0A/B (ISO 11898-1), not CAN FD. Its dual CAN modules provide 32 configurable mailboxes, standard (11-bit) and extended (29-bit) identifier support, and bit rates up to 1 Mbps. This is explicitly stated in Section 1.8 of the R01DS0328EU0120 datasheet. For CAN FD functionality, designers must consider higher-tier Synergy S7 series MCUs. The R7FS5D37A3A01CFP#BA0 remains fully compatible with legacy CAN networks in industrial automation and automotive body systems.
What package type and pin count does the R7FS5D37A3A01CFP#BA0 use?
The R7FS5D37A3A01CFP#BA0 uses a 100-pin LQFP package (PLQP0100KB-B) with 14 mm × 14 mm body size and 0.5 mm pitch. This is confirmed in Table 1.14 (Product List) and Figure 1.2 (Part Numbering Scheme) of the R01DS0328EU0120 datasheet. The "FP" suffix in the part number directly denotes LQFP-100. The R7FS5D37A3A01CFP#BA0 provides 67 CMOS I/O pins, 14 of which are 5 V tolerant, making it suitable for mixed-voltage industrial interfaces.
How does the Memory Mirror Function (MMF) benefit firmware development for the R7FS5D37A3A01CFP#BA0?
The Memory Mirror Function (MMF) in the R7FS5D37A3A01CFP#BA0 maps the physical flash load address to a virtual link address in unused 23-bit memory space, allowing application code to be linked and executed from a fixed address regardless of its actual flash location. As described in Section 1.2 and Table 1.2 of R01DS0328EU0120, this eliminates manual relocation code and simplifies A/B firmware swapping. Developers can update R7FS5D37A3A01CFP#BA0 firmware without modifying linker scripts or runtime address calculations.
What security features are implemented in the Secure Crypto Engine 7 (SCE7) of the R7FS5D37A3A01CFP#BA0?
The R7FS5D37A3A01CFP#BA0 integrates SCE7 supporting AES-128/192/256, 3DES, ARC4, SHA1/224/256, MD5, GHASH, RSA/DSA/ECC, and a True Random Number Generator (TRNG). These are detailed in Table 1.12 and Section 1.12 of R01DS0328EU0120. SCE7 operates independently of the CPU, protecting keys in secure memory and accelerating cryptographic operations by >10× versus software-only implementations - critical for secure boot, firmware signing, and TLS offload in the R7FS5D37A3A01CFP#BA0.
R7FS5D37A3A01CFP#BA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- Renesas Synergy™ S5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, I2C, IrDA, SCI, SDH, SPI, SSI, UART, USB
- Peripherals:
- Cap Sense, DMA, LVD, POR, PWM, RTC, WDT
- Number of I/O:
- 76
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 19x12b SAR; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7FS5D37A3A01CFP#BA0 FAQ
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The price and inventory of R7FS5D37A3A01CFP#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7FS5D37A3A01CFP#BA0 is usually 5 days.
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5.How can I obtain technical support or documentation for R7FS5D37A3A01CFP#BA0?
For technical support, including R7FS5D37A3A01CFP#BA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7FS5D37A3A01CFP#BA0 requirements.
6.How does Aetrix verify that R7FS5D37A3A01CFP#BA0 is sourced from the original manufacturer or authorized distributors?
All R7FS5D37A3A01CFP#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7FS5D37A3A01CFP#BA0 meets industry standards.
7.What is the process for return or replacement of R7FS5D37A3A01CFP#BA0?
All R7FS5D37A3A01CFP#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7FS5D37A3A01CFP#BA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7FS5D37A3A01CFP#BA0 part is unused and in its original packaging.
Return procedure for R7FS5D37A3A01CFP#BA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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