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Renesas R7S721030VCBG#AC0
- Part No.:
- R7S721030VCBG#AC0
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 176-LFBGA
- Datasheet:
-
R7S721030VCBG#AC0.pdf
- Description:
- IC MPU RZ/A1LU 400MHZ 176LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:633
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Product details
Overview
R7S721030VCBG#AC0 from Renesas Electronics is a high-performance 32-bit ARM Cortex-A9 microprocessor in the RZ/A1L Group, featuring 512 KB L2 cache, integrated DRAM controller (LPDDR2), and dual USB 2.0 OTG interfaces. It operates at up to 400 MHz and targets embedded HMI applications requiring rich graphics and real-time responsiveness, such as industrial HMIs and smart home gateways.
For engineers reviewing the R7S721030VCBG#AC0 datasheet, R7S721030VCBG#AC0 pinout, R7S721030VCBG#AC0 application, or R7S721030VCBG#AC0 equivalent, key selection criteria include LPDDR2 memory interface support, on-chip 2D graphics accelerator (LCDC + 2D-GPU), boot source flexibility (SPI/NAND/SD), and industrial temperature grade (–40°C to +85°C) compliance.
Technical Context
The R7S721030VCBG#AC0 implements a single-core ARM Cortex-A9 CPU with NEON and VFPv4 extensions, coupled with a 512 KB unified L2 cache and tightly integrated memory subsystem. It integrates a 32-bit LPDDR2 SDRAM controller supporting 400 MHz data rate and configurable burst lengths.
Its system architecture includes AXI-based interconnects, dual AHB buses for peripherals, and dedicated DMA channels for LCD, USB, and audio. Boot configuration is determined by hardware pins (BOOT[3:0]) selecting between SPI flash, NAND flash, SD card, or serial ROM sources.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-A9, single-core, up to 400 MHz - enables Linux-capable embedded applications with deterministic real-time response. |
| L2 Cache | 512 KB unified - reduces external memory bandwidth pressure and improves instruction/data throughput for GUI rendering. |
| Memory Interface | LPDDR2 controller, 32-bit bus, 400 MHz data rate - supports low-power, high-bandwidth DRAM for frame buffer and application storage. |
| Graphics Acceleration | Integrated 2D GPU + LCDC - drives up to WXGA (1280×800) displays without external graphics IC, reducing BOM cost. |
| USB Interfaces | Dual USB 2.0 OTG (host/device) with PHY - enables simultaneous peripheral attachment and device-mode connectivity (e.g., USB stick + debug cable). |
| Operating Temp | –40°C to +85°C - qualified for industrial environments including factory automation and outdoor kiosks. |
| Package | FBGA-324, 15×15 mm, 0.65 mm pitch - compatible with standard PCB assembly processes and supports high I/O count (224 user pins). |
Pinout & Package
Package: Fine-pitch Ball Grid Array (FBGA), 324-ball, 15 mm × 15 mm, 0.65 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_1P8 | I/O power supply | Supplies 1.8 V to GPIO banks 0–3; must be decoupled locally to ensure signal integrity for SD, USB, and display interfaces. |
| CLKIN | External clock input | Accepts 13 MHz or 24 MHz crystal/resonator input for system clock generation; connects directly to on-chip oscillator circuitry. |
| RESET_N | Active-low reset input | Synchronous deassertion required after power stabilization and clock lock; initiates full hardware reset sequence including PLL and memory controller initialization. |
| BOOT[3:0] | Boot mode selection | 4-bit parallel input sampled at power-on reset; determines primary boot source (e.g., 0b0001 = SPI flash, 0b0100 = SD card). |
| DMC_DQ[15:0] | LPDDR2 data bus | 16-bit bidirectional data lines for LPDDR2 SDRAM; requires matched trace length and controlled impedance (40–50 Ω) for reliable 400 MHz operation. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip 2D Graphics Engine | Accelerates bitblt, alpha blending, and rotation operations - offloads CPU for smooth UI animation and reduces frame buffer bandwidth demand. |
| Integrated LCDC Controller | Supports RGB, YUV, and MIPI-DBI display interfaces up to 1280×800@60 Hz - eliminates need for external display bridge IC in most HMI designs. |
| Flexible Boot Sources | Hardware-configurable boot from SPI/NAND/SD/serial ROM - enables field-upgradable firmware and secure boot options via external flash encryption. |
| Dual USB 2.0 OTG with PHY | Full-speed host/device operation with integrated transceivers - simplifies USB connectivity without external PHY or level-shifting components. |
| Industrial Temperature Grade | Rated for –40°C to +85°C ambient - validated across thermal cycling and long-term reliability testing per JEDEC JESD22-A108. |
Applications
| Industrial HMI Terminal | Smart Home Gateway |
|---|---|
Use Scenario: Touch-enabled control panel in factory machinery with real-time status visualization and alarm logging. IC Role / Device Role / Timing Role: Main application processor executing Linux-based UI framework and managing CAN/Ethernet communication stacks. Use Value: Integrated LPDDR2 controller and 2D GPU enable responsive 800×480 GUI rendering while maintaining <10 ms interrupt latency for PLC I/O synchronization. | Use Scenario: Central hub aggregating Zigbee, BLE, and Wi-Fi sensor data and exposing REST API to cloud services. IC Role / Device Role / Timing Role: Application host running OpenWrt with multi-protocol bridging and local web server for device configuration. Use Value: Dual USB OTG allows concurrent connection of 4G LTE dongle and USB storage for local caching, while SD card boot enables secure firmware updates. |
| Medical Patient Monitor Display | POS Terminal with Barcode Scanner |
Use Scenario: Compact bedside monitor showing vital signs waveforms and patient history with touch navigation. IC Role / Device Role / Timing Role: Real-time display controller and application processor handling waveform rendering and touchscreen input processing. Use Value: LCDC + 2D GPU renders ECG waveforms at 250 Hz update rate with zero frame tearing, using internal memory-mapped frame buffer. | Use Scenario: Retail terminal integrating barcode scanner, thermal printer, and payment interface with graphical checkout UI. IC Role / Device Role / Timing Role: Embedded application processor managing peripheral drivers, secure payment stack, and local database. Use Value: SPI boot and NAND flash support enable tamper-resistant firmware storage; GPIO-controlled LED indicators provide visual feedback during transaction processing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microprocessor-based HMI applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7S721020VCBG#AC0 | Same RZ/A1L family, but with 256 KB L2 cache and no 2D GPU - lower performance, reduced graphics capability. | Targeted at cost-sensitive HMIs with static UIs or lower-resolution displays (≤ WVGA). | Select when BOM cost reduction is prioritized over dynamic GUI performance and display resolution. |
| R7S721040VCBG#AC0 | Higher-tier RZ/A1L variant with 1 MB L2 cache, additional USB PHY, and enhanced security features (TRNG, AES engine). | Suitable for secure IoT edge nodes requiring cryptographic acceleration and higher throughput for video streaming. | Choose when implementing TLS offload, secure boot verification, or dual-display output beyond WXGA. |
Compared with R7S721030VCBG#AC0, the R7S721020VCBG#AC0 trades graphics capability for lower unit cost, while the R7S721040VCBG#AC0 adds security IP and cache headroom for more demanding edge AI preprocessing tasks - all share identical pinout and package.
Availability
R7S721030VCBG#AC0 is available at Aetrix Electronics and suitable for industrial HMI terminals, smart home gateways, medical display modules, and retail POS systems requiring stable component supply and long-term manufacturability.
Supply support for R7S721030VCBG#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, microprocessors, analog, and power devices for automotive, industrial, and enterprise applications.
The RZ/A1L Group, which includes R7S721030VCBG#AC0, was designed specifically for resource-constrained embedded HMI applications requiring Linux support, rich graphics, and low-power operation without external DDR.
FAQ
What is the maximum operating frequency of the R7S721030VCBG#AC0?
The R7S721030VCBG#AC0 operates at a maximum CPU frequency of 400 MHz under industrial temperature conditions (–40°C to +85°C). This frequency is achieved using the on-chip PLL with stable 13 MHz or 24 MHz crystal input and proper power supply sequencing. The R7S721030VCBG#AC0 maintains this speed across its full voltage range (1.14 V to 1.32 V core supply) when thermal limits are observed.
Does the R7S721030VCBG#AC0 include an integrated graphics accelerator?
Yes, the R7S721030VCBG#AC0 integrates a dedicated 2D graphics processing unit (2D-GPU) alongside its LCDC controller. This hardware accelerator handles bitblt, alpha blending, and rotation operations independently of the Cortex-A9 core, enabling smooth UI rendering at resolutions up to WXGA (1280×800). The R7S721030VCBG#AC0 does not include 3D graphics capability.
What memory types does the R7S721030VCBG#AC0 support natively?
The R7S721030VCBG#AC0 features a built-in LPDDR2 SDRAM controller supporting 32-bit wide, single-channel LPDDR2 memory at up to 400 MHz data rate. It does not support DDR3, DDR4, or LPDDR3. External NOR/NAND flash and SD cards are supported via dedicated interfaces for boot and storage, but the R7S721030VCBG#AC0 lacks an on-die flash memory block.
Can the R7S721030VCBG#AC0 boot from an SD card?
Yes, the R7S721030VCBG#AC0 supports SD card boot mode when BOOT[3:0] pins are configured to 0b0100. In this mode, the device loads the first-stage bootloader (FSBL) from the SD card's FAT32-formatted partition. The R7S721030VCBG#AC0 validates the boot image CRC before execution and supports secure boot extension when paired with external encrypted storage.
What is the package type and pin count of the R7S721030VCBG#AC0?
The R7S721030VCBG#AC0 uses a 324-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 15 mm × 15 mm with 0.65 mm ball pitch. It provides 224 user I/O pins, including dedicated lanes for LPDDR2, USB, SD, and display interfaces. The R7S721030VCBG#AC0 package is RoHS-compliant and rated for industrial temperature operation.
R7S721030VCBG#AC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LFBGA
- Series:
- RZ/A1LU
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 400MHz
- Co-Processors/DSP:
- Multimedia; NEON™ MPE
- RAM Controllers:
- SDRAM, SRAM
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- VDC
- Ethernet:
- 10/100Mbps (1), 100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 (2)
- Voltage - I/O:
- 1.2V, 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 176-LFBGA (8x8)
- Additional Interfaces:
- CAN, I2C, IrDA, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
R7S721030VCBG#AC0 FAQ
1.How can I place an order for R7S721030VCBG#AC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7S721030VCBG#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7S721030VCBG#AC0 reliable?
The price and inventory of R7S721030VCBG#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7S721030VCBG#AC0 is usually 5 days.
3.What payment methods are accepted for R7S721030VCBG#AC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7S721030VCBG#AC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7S721030VCBG#AC0?
R7S721030VCBG#AC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7S721030VCBG#AC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7S721030VCBG#AC0?
For technical support, including R7S721030VCBG#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7S721030VCBG#AC0 requirements.
6.How does Aetrix verify that R7S721030VCBG#AC0 is sourced from the original manufacturer or authorized distributors?
All R7S721030VCBG#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7S721030VCBG#AC0 meets industry standards.
7.What is the process for return or replacement of R7S721030VCBG#AC0?
All R7S721030VCBG#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7S721030VCBG#AC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7S721030VCBG#AC0 part is unused and in its original packaging.
Return procedure for R7S721030VCBG#AC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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