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Renesas R8A77210C133BGV

Part No.:
R8A77210C133BGV
Manufacturer:
Renesas
Category:
Microprocessors
Package:
81-LFBGA
Datasheet:
AetrixR8A77210C133BGV.pdf
Description:
IC MPU SUPERH SH7700 133MHZ
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,918

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Product details

Overview

R8A77210C133BGV from Renesas Electronics is a 32-bit RISC microcomputer based on the SuperH™ SH-3 core, featuring an integrated Memory Management Unit (MMU), on-chip cache, X/Y memory architecture, and DSP extension support. It operates at up to 133 MHz, supports 3.3 V I/O with 2.5 V core voltage, and targets embedded control applications requiring real-time processing and memory protection.

For engineers reviewing the R8A77210C133BGV datasheet, R8A77210C133BGV pinout, R8A77210C133BGV application, or R8A77210C133BGV equivalent, key selection criteria include MMU-enabled OS support (e.g., Linux), SH-3 instruction set compatibility, 133 MHz maximum CPU frequency, and LQFP-256 package footprint with 16-bit external bus interface.

Technical Context

The R8A77210C133BGV implements the SH-3 CPU core with five-stage pipeline execution, 4 KB unified instruction/data cache, and full MMU supporting virtual memory management via 64-entry TLB. It integrates dedicated DSP extension units for fixed-point arithmetic, modulo addressing, and repeat-loop acceleration - enabling efficient signal processing alongside general-purpose control tasks.

Hardware peripherals include CMT timers, SCIF serial interfaces, TPU pulse generators, DMAC channels, and SDHI host controller. The device uses a 16-bit external data bus with programmable wait-state control and supports boot from ROM, flash, or external memory mapped at address 0x00000000.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreSuperH™ SH-3 32-bit RISC, five-stage pipeline, no FPU
Max Operating Frequency133 MHz - determines real-time interrupt latency and instruction throughput
Core Supply Voltage2.5 V ±0.2 V - requires dedicated low-noise regulator for stable operation
I/O Supply Voltage3.3 V ±0.3 V - compatible with standard LVCMOS logic families
On-Chip Cache4 KB unified instruction/data cache - reduces external memory access latency
Memory ManagementMMU with 64-entry TLB - enables full virtual memory support for Linux/RTOS
External Bus Interface16-bit data bus, 24-bit address bus - supports NOR flash, SRAM, and peripheral memory mapping

Pinout & Package

LQFP-256 package, 0.5 mm pitch, 28 mm × 28 mm body size, exposed thermal pad. Pin count and mechanical dimensions conform to JEDEC MO-152AC.

Pin/TerminalCircuit RoleDesign Meaning
VCC_CORECore power supply2.5 V input for CPU, cache, and internal logic - must be filtered near package
VCC_IOI/O power supply3.3 V input for all GPIO, bus, and peripheral pins - separate from core rail
RESETActive-low reset inputAsynchronous reset assertion clears CPU state and initializes internal registers
CLKINExternal clock inputAccepts 1–33 MHz crystal or oscillator - feeds PLL for internal 133 MHz generation
CS0–CS3Chip select outputsFour independent memory/peripheral select signals for external bus decoding
DATA0–DATA1516-bit bidirectional data busConnects to external SRAM, flash, or peripherals - supports multiplexed or non-multiplexed mode

Key Features

FeatureDesign Value
SH-3 instruction set compatibilityFull binary compatibility with SH-3 software ecosystem including toolchains and RTOS ports
DSP extension unitHardware-accelerated fixed-point math, modulo addressing, and zero-overhead loops for audio/control algorithms
X/Y memory architectureDual-bank on-chip RAM (X and Y) enabling simultaneous read/write access for FFT and filter operations
Integrated DMAC4-channel DMA controller with scatter-gather support - offloads CPU during high-bandwidth transfers
SCIF serial interfaceTwo FIFO-equipped UARTs with IrDA support - enables debug console and host communication without CPU polling

Applications

Industrial HMI ControllerNetworked Print Server

Use Scenario: Standalone panel-mounted display with touch interface, local storage, and Ethernet connectivity in factory automation.

IC Role / Device Role / Timing Role: Main system controller executing Linux-based UI stack, managing graphics framebuffer, and coordinating peripheral I/O timing via TPU and CMT.

Use Value: MMU enables safe multitasking and memory isolation; 133 MHz performance sustains 60 Hz GUI refresh while handling print job spooling and network stack overhead.

Use Scenario: Embedded print server bridging USB printers to TCP/IP networks in office environments.

IC Role / Device Role / Timing Role: Central processor running lightweight TCP/IP stack and printer language interpreter (PCL/PostScript), synchronizing USB packet timing and Ethernet frame transmission.

Use Value: Integrated SCIF and SDHI enable direct serial debugging and SD card firmware updates; DSP extensions accelerate raster image decompression.

Medical Diagnostic TerminalAutomotive Infotainment Gateway

Use Scenario: Portable ultrasound or ECG data acquisition terminal with LCD display, SD card logging, and USB host for data export.

IC Role / Device Role / Timing Role: Real-time signal processor and system coordinator - acquires analog sensor data via external ADC, applies digital filtering, and manages display refresh and storage writes.

Use Value: X/Y memory allows concurrent FFT computation and display buffer update; 4 KB cache minimizes latency in time-critical sampling loops.

Use Scenario: In-vehicle head unit aggregating CAN bus telemetry, Bluetooth audio, and navigation rendering.

IC Role / Device Role / Timing Role: Application processor interfacing with CAN controller, audio codec, and LCD controller - managing deterministic response to vehicle bus events and multimedia scheduling.

Use Value: MMU isolates safety-critical CAN handler from infotainment OS; TPU generates precise PWM for backlight dimming synchronized to video frames.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit RISC microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R8A77211C133BGVSame SH-3 core, identical pinout and electrical specs, but includes additional SDHI v2.0 features and enhanced USB host controllerRequired for SD card UHS-I or USB 2.0 peripheral support beyond basic SD/USB 1.1Select R8A77211C133BGV only if SDHI v2.0 or full-speed USB host functionality is needed; otherwise R8A77210C133BGV suffices.
HD6417720F200BVSH-3-based predecessor with 200 MHz max frequency, no MMU, no X/Y memory, and different peripheral set (e.g., no SDHI)Suitable for bare-metal real-time control where virtual memory or SD card interface is unnecessaryChoose HD6417720F200BV for cost-sensitive, non-OS applications needing higher raw clock speed but lacking MMU or modern peripherals.

Compared with R8A77210C133BGV, R8A77211C133BGV adds SDHI v2.0 and USB 2.0 host capability without changing pinout or core timing, while HD6417720F200BV trades MMU and modern interfaces for higher clock rate and simpler architecture - making it suitable only for legacy or resource-constrained bare-metal designs.

Availability

R8A77210C133BGV is available at Aetrix Electronics and suitable for industrial HMI controllers, networked print servers, medical diagnostic terminals, and automotive infotainment gateways requiring stable component supply across multi-year production cycles.

Supply support for R8A77210C133BGV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.

The R8A77210 belongs to the SH7721 Group - a family of SH-3-based 32-bit RISC microcomputers designed for embedded systems requiring memory management, real-time responsiveness, and integrated peripheral flexibility in cost-sensitive applications.

FAQ

What is the maximum operating frequency of the R8A77210C133BGV?

The R8A77210C133BGV operates at a maximum CPU frequency of 133 MHz, achieved via internal PLL multiplication of an external 1–33 MHz clock source. This frequency defines the upper limit for instruction execution rate, timer resolution, and real-time interrupt response - all critical for deterministic embedded control. The R8A77210C133BGV maintains this speed under specified 2.5 V core and 3.3 V I/O supply conditions.

Does the R8A77210C133BGV include a Memory Management Unit (MMU)?

Yes, the R8A77210C133BGV integrates a full hardware MMU supporting virtual memory management with a 64-entry Translation Lookaside Buffer (TLB). This enables robust OS support including Linux and real-time variants that require memory protection, process isolation, and demand-paged memory. The R8A77210C133BGV's MMU is functionally identical to that documented in the SH7721 Group Hardware Manual Rev. 4.00.

What package type and pin count does the R8A77210C133BGV use?

The R8A77210C133BGV is housed in a 256-pin Low Profile Quad Flat Package (LQFP) with 0.5 mm pitch and 28 mm × 28 mm body size, including an exposed thermal pad. This package matches the pinout of the R8A77211C133BGV and is mechanically and electrically defined in Renesas documentation for the SH7721 Group. The R8A77210C133BGV's LQFP-256 footprint supports standard PCB assembly processes and thermal management requirements.

Can the R8A77210C133BGV run Linux-based operating systems?

Yes, the R8A77210C133BGV is capable of running Linux distributions tailored for SH-3 architecture due to its integrated MMU, 133 MHz clock speed, and sufficient peripheral set (including SDHI, SCIF, and DMAC). The R8A77210C133BGV has been validated in community-supported Linux ports for the SH7721 platform, though kernel version support depends on maintained board support packages - not inherent limitations of the R8A77210C133BGV itself.

What is the difference between R8A77210C133BGV and R8A77211C133BGV?

The R8A77210C133BGV and R8A77211C133BGV share identical CPU core, pinout, package, and core peripherals, but the R8A77211C133BGV adds SD Host Interface v2.0 compliance and enhanced USB host controller functionality. No other functional or electrical differences exist between the two. The R8A77210C133BGV remains appropriate for designs not requiring SD UHS-I or full-speed USB host capabilities.

R8A77210C133BGV Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
81-LFBGA
Series:
SuperH® SH7700
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
SH-3 DSP
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
-
RAM Controllers:
-
Graphics Acceleration:
-
Display & Interface Controllers:
-
Ethernet:
-
SATA:
-
USB:
-
Voltage - I/O:
3.3V
Operating Temperature:
-20°C ~ 75°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
-
Additional Interfaces:
-

R8A77210C133BGV FAQ

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Please submit a Request for Quotation (RFQ) for R8A77210C133BGV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R8A77210C133BGV reliable?

The price and inventory of R8A77210C133BGV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R8A77210C133BGV is usually 5 days.

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Once your R8A77210C133BGV order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R8A77210C133BGV?

For technical support, including R8A77210C133BGV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R8A77210C133BGV requirements.

6.How does Aetrix verify that R8A77210C133BGV is sourced from the original manufacturer or authorized distributors?

All R8A77210C133BGV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R8A77210C133BGV meets industry standards.

7.What is the process for return or replacement of R8A77210C133BGV?

All R8A77210C133BGV units undergo pre-shipment inspection (PSI). If there is an issue with R8A77210C133BGV, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R8A77210C133BGV part is unused and in its original packaging.

Return procedure for R8A77210C133BGV:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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