My Inquiry
My Account
Renesas R8A77430HA02BG#UA
- Part No.:
- R8A77430HA02BG#UA
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- -
- Datasheet:
-
R8A77430HA02BG#UA.pdf
- Description:
- IC MPU RZ/G/G1M 1.5GHZ
- Quantity:
- Payment:
- Shipping:
Inventory:3,916
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R8A77430HA02BG#UA from Renesas Electronics is a high-performance heterogeneous multicore application processor for rich graphics and multimedia-intensive embedded systems, integrating four 1.4-GHz ARM Cortex-A15 cores, four 780-MHz ARM Cortex-A7 cores, dual-channel DDR3-1600 memory controller, 3D/2D graphics engines (R-GP2D, 3DGE), video processing units (VSP1, VCP3), and triple-display output capability. It targets premium in-vehicle infotainment systems requiring concurrent high-resolution UI rendering, video decoding, and real-time connectivity.
For engineers reviewing the R8A77430HA02BG#UA datasheet, R8A77430HA02BG#UA pinout, R8A77430HA02BG#UA application, or R8A77430HA02BG#UA equivalent, key selection criteria include ARMv7-A dual-cluster architecture support, AXI bus bandwidth (256-bit @ 260 MHz), DDR3-1600 interface timing compliance, integrated security extensions (TrustZone), and automotive-grade thermal and power management features.
Technical Context
The R8A77430HA02BG#UA implements a big.LITTLE heterogeneous compute architecture with independent L2 cache domains (2 MB for A15 cluster, 512 KB for A7 cluster), both supporting NEON and VFPv4. Its CPG module generates core clocks (1.4 GHz / 780 MHz), AXI bus clock (260 MHz), and DDR3 PHY clock (800 MHz), with dynamic voltage and frequency scaling (DVFS) coordinated via dedicated I²C3 interface.
System-level integration includes on-chip IPMMU for memory protection across CPU clusters and peripherals, CoreSight debug infrastructure with PTM trace for both A15 and A7, and SYSC-controlled power domain isolation for Cortex-A15/A7 clusters, 3DGE, and media subsystems - enabling selective shutdown without affecting real-time display or network functions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Heterogeneous dual-cluster: Quad Cortex-A15 @ 1.4 GHz + Quad Cortex-A7 @ 780 MHz, ARMv7-A with TrustZone security extension |
| Memory Interface | DDR3-1600 (800 MHz data rate), 32-bit × 2 channels, supporting up to 4 GB with ECC capability |
| Graphics Engine | Dedicated R-GP2D 2D accelerator and 3DGE 3D graphics engine compliant with OpenGL ES 2.0/3.0 and OpenVG 1.1 |
| Video Processing | VSP1 video signal processor with deinterlacing, scaling, blending; VCP3 video codec processor supporting H.264 decode up to 4K@30fps |
| Display Output | Three independent display units: DU0/DU1/DU2 supporting LVDS, RGB, HDMI (via companion PHY), up to 1920×1200@60Hz per channel |
| Peripheral Connectivity | PCIe Gen2 x2, SATA II ×2, USB 3.0 Host ×1 + USB 2.0 Host ×3, CAN 2.0B ×2, Gigabit Ethernet AVB MAC |
| Thermal Range | Industrial grade: –40°C to +85°C ambient operating temperature, qualified per Renesas "Standard" quality grade |
Pinout & Package
The R8A77430HA02BG#UA is housed in a 15 mm × 15 mm, 425-pin FC-BGA package (ball pitch: 0.65 mm) with 188 GPIOs, 128 dedicated power/ground balls, and defined ball-out for DDR3, PCIe, SATA, and high-speed display interfaces. Pin assignment follows JEDEC MO-271AC standard with controlled impedance routing guidelines for differential pairs (USB3, PCIe, LVDS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| EXTAL1 / EXTAL1# | Crystal oscillator input pair | Differential 20-MHz reference clock input for CPG PLL; requires external 20-MHz crystal with load capacitance ≤12.5 pF |
| DDR3_DQ[31:0] | Data bus (channel A) | 32-bit bidirectional DDR3 data lines with on-die termination; supports DDR3-1600 (CL=11, tRCD=13, tRP=13) |
| PCIe_TX[1:0] / PCIe_RX[1:0] | PCIe Gen2 differential lanes | Two full-duplex PCIe Gen2 lanes (5 GT/s); each lane requires AC-coupling capacitors and 100-Ω differential PCB trace impedance |
| DVDD_DDR / DVSS_DDR | DDR3 I/O power supply | 1.5-V supply for DDR3 interface; must be independently decoupled with ≥4× 10-μF low-ESR ceramic capacitors near BGA corner balls |
| DU0_LVDS_CLKP/N | LVDS display clock output | Differential 74.25-MHz clock for LVDS panel timing; routed as matched-length pair with 100-Ω differential impedance |
Key Features
| Feature | Design Value |
|---|---|
| Big.LITTLE Power Management | Independent power gating of A15/A7 clusters and L2 caches via SYSC registers, enabling OS-driven workload migration with <50 μs state transition latency |
| Hardware Virtualization Support | ARM Generic Interrupt Controller (GIC-400) and virtualization extensions enable Type-1 hypervisor deployment for mixed-criticality IVI systems |
| Real-Time Video Pipeline | VSP1 + VCP3 pipeline supports simultaneous 4K H.264 decode, chroma keying, and overlay composition with <16-ms end-to-end latency |
| Secure Boot & Runtime Protection | ROM-based secure boot loader validates signed firmware images; SECRAM provides 256 KB of tamper-resistant SRAM for cryptographic key storage |
| Automotive Interface Integration | Dual CAN 2.0B controllers with time-triggered communication support (ISO 11898-1), IE-BUS interface for legacy car audio networks |
Applications
| IVI Head Unit | Digital Instrument Cluster |
|---|---|
Use Scenario: Central infotainment system combining navigation, media playback, smartphone projection (Android Auto/CarPlay), and vehicle telemetry. IC Role / Device Role / Timing Role: Primary application processor executing Linux-based HMI, managing GPU-accelerated UI rendering, video decode, and multi-display output synchronization. Use Value: Dual-cluster architecture enables concurrent high-priority UI updates (A15) and background services (A7), while VSP1/VCP3 offload video processing to sustain 60-fps UI responsiveness during 4K video playback. | Use Scenario: Real-time driver information display with animated gauges, ADAS warnings, and camera feed overlay. IC Role / Device Role / Timing Role: System-on-chip handling instrument cluster graphics generation, CAN message parsing, and safety-critical display timing via DU0/DU1 dual-channel output. Use Value: Integrated DU with hardware compositor and frame buffer compression reduces external memory bandwidth by 40%, enabling smooth 1200×800@60Hz rendering with minimal latency. |
| Advanced Rear-Seat Entertainment | Commercial Vehicle Telematics Gateway |
Use Scenario: Dual-screen passenger entertainment system with independent video decode, audio routing, and wireless streaming. IC Role / Device Role / Timing Role: Media processor driving two independent HDMI/LVDS displays, decoding multiple H.264 streams, and managing audio DSP resources. Use Value: VCP3 supports simultaneous decode of two 1080p@30fps streams; audio DSP handles multi-zone audio mixing and noise cancellation without CPU intervention. | Use Scenario: Fleet management gateway aggregating CAN bus data, GPS location, cellular telemetry, and over-the-air firmware updates. IC Role / Device Role / Timing Role: Embedded Linux host managing secure OTA updates, TLS-encrypted cellular comms (via PCIe-connected modem), and time-synchronized logging of vehicle events. Use Value: Crypto Engine accelerates AES-256 and SHA-256 operations for secure firmware signing verification; dual CAN interfaces enable concurrent access to powertrain and chassis networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R8A77420HA02BG#UA | Same RZ/G1H family but with single Cortex-A15 + quad Cortex-A7; no 3DGE; reduced DDR3 bandwidth (single channel) | Suitable for cost-sensitive IVI systems without 3D UI or 4K video requirements | Select when target BOM cost reduction outweighs need for dual-cluster performance headroom and 3D acceleration |
| NXP i.MX8MQ | Quad Cortex-A53 + Cortex-M4; single-channel LPDDR4; Vivante GC7000Lite GPU; no integrated video codec processor | Better suited for Linux-based smart displays with modest multimedia needs and lower thermal envelope | Prefer for designs prioritizing long-term software support, Android compatibility, and lower power consumption over raw graphics throughput |
Compared with R8A77430HA02BG#UA, R8A77420HA02BG#UA trades peak compute and graphics capability for lower cost and power, while NXP i.MX8MQ offers stronger Android ecosystem alignment and M4 co-processor for real-time control - making R8A77430HA02BG#UA optimal for high-end IVI demanding concurrent 4K decode, 3D UI, and multi-display precision timing.
Availability
R8A77430HA02BG#UA is available at Aetrix Electronics and suitable for in-vehicle infotainment systems, digital instrument clusters, advanced rear-seat entertainment units, and commercial telematics gateways requiring stable component supply across extended product lifecycles.
Supply support for R8A77430HA02BG#UA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog devices, and SoCs for automotive, industrial, and enterprise applications.
The RZ/G series - including R8A77430HA02BG#UA - was designed specifically for rich graphics applications in automotive infotainment and human-machine interface systems, emphasizing heterogeneous processing, integrated multimedia acceleration, and functional safety-aware architecture.
FAQ
What is the maximum DDR3-SDRAM speed supported by R8A77430HA02BG#UA?
R8A77430HA02BG#UA supports DDR3-1600 operation (800 MHz data rate) across two independent 32-bit channels. This requires strict adherence to JEDEC JESD79-3F timing parameters including tRCD = 13 cycles, tRP = 13 cycles, and CL = 11 at 1.5 V. The memory controller includes on-die termination and programmable drive strength to maintain signal integrity on high-density PCB layouts.
Does R8A77430HA02BG#UA include hardware support for secure boot?
Yes, R8A77430HA02BG#UA implements ROM-based secure boot with public-key signature verification (RSA-2048) of the first-stage bootloader. It uses SECRAM - a 256 KB tamper-resistant SRAM block - to store cryptographic keys and runtime secrets. Secure boot flow enforces chain-of-trust validation before releasing A15/A7 cores from reset, meeting ISO/SAE 21434 threat mitigation requirements for automotive software updates.
Can R8A77430HA02BG#UA drive three independent displays simultaneously?
Yes, R8A77430HA02BG#UA integrates three Display Units (DU0, DU1, DU2) capable of concurrent output. Each supports LVDS, RGB, or HDMI (with external PHY), with resolutions up to 1920×1200@60Hz. Hardware overlays, alpha blending, and gamma correction are applied per-DU, enabling independent UI rendering for instrument cluster, center stack, and rear-seat displays without CPU or memory bandwidth contention.
What video codecs does the VCP3 unit in R8A77430HA02BG#UA support?
The VCP3 (Video Codec Processor 3) in R8A77430HA02BG#UA supports H.264/AVC decode up to 4K resolution at 30 fps and encode up to 1080p at 60 fps. It does not support H.265/HEVC or VP9. Decode acceleration includes CABAC entropy decoding, motion compensation, and deblocking - offloading >90% of video processing from CPU cores and reducing DDR3 bandwidth usage by 65% compared to software-only decode.
Is R8A77430HA02BG#UA qualified for automotive applications?
R8A77430HA02BG#UA is classified as a "Standard" quality grade device per Renesas documentation, intended for computers, office equipment, communications gear, and industrial robots - not for safety-critical automotive systems like ADAS or powertrain control. While widely used in IVI systems, it lacks AEC-Q100 qualification and functional safety certification (ISO 26262 ASIL-B or higher). Customers deploying R8A77430HA02BG#UA in vehicles must perform their own hazard analysis and implement additional safety mechanisms.
R8A77430HA02BG#UA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- -
- Series:
- RZ/G/G1M
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- -
- Number of Cores/Bus Width:
- -
- Speed:
- 1.5GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- -
- Graphics Acceleration:
- -
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
- Additional Interfaces:
- -
R8A77430HA02BG#UA FAQ
1.How can I place an order for R8A77430HA02BG#UA through Aetrix?
Please submit a Request for Quotation (RFQ) for R8A77430HA02BG#UA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R8A77430HA02BG#UA reliable?
The price and inventory of R8A77430HA02BG#UA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R8A77430HA02BG#UA is usually 5 days.
3.What payment methods are accepted for R8A77430HA02BG#UA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R8A77430HA02BG#UA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R8A77430HA02BG#UA?
R8A77430HA02BG#UA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R8A77430HA02BG#UA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R8A77430HA02BG#UA?
For technical support, including R8A77430HA02BG#UA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R8A77430HA02BG#UA requirements.
6.How does Aetrix verify that R8A77430HA02BG#UA is sourced from the original manufacturer or authorized distributors?
All R8A77430HA02BG#UA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R8A77430HA02BG#UA meets industry standards.
7.What is the process for return or replacement of R8A77430HA02BG#UA?
All R8A77430HA02BG#UA units undergo pre-shipment inspection (PSI). If there is an issue with R8A77430HA02BG#UA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R8A77430HA02BG#UA part is unused and in its original packaging.
Return procedure for R8A77430HA02BG#UA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R8A77430HA02BG#UA Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
