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Renesas R8A77440HA01BG#UA

Part No.:
R8A77440HA01BG#UA
Manufacturer:
Renesas
Category:
Microprocessors
Package:
-
Datasheet:
AetrixR8A77440HA01BG#UA.pdf
Description:
IC MPU RZ/G/G1N 1.5GHZ
Quantity:
Payment:
Payment
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Inventory:3,981

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Product details

Overview

R8A77440HA01BG#UA from Renesas Electronics is a high-performance heterogeneous multicore MPSoC designed for rich graphics and multimedia-intensive embedded applications. It integrates four 1.4-GHz ARM Cortex-A15 cores, four 780-MHz ARM Cortex-A7 cores, dual-channel DDR3-1600 memory controller, 3D/2D graphics engines (R-GP2D, 3DGE), video processing units (VSP1, VCP3), triple-display output, quad-video input, USB 3.0/2.0, PCIe, SATA, and dual CAN interfaces - deployed in automotive infotainment and industrial HMI systems.

For engineers reviewing the R8A77440HA01BG#UA datasheet, R8A77440HA01BG#UA pinout, R8A77440HA01BG#UA application, or R8A77440HA01BG#UA equivalent, this page delivers verified core architecture, validated I/O capabilities, confirmed graphics/video subsystem integration, and real-world deployment context for system-level design validation and BOM selection.

Technical Context

The R8A77440HA01BG#UA implements a big.LITTLE heterogeneous architecture with two independent CPU clusters: A15 cluster (1.4 GHz, 2 MB L2 cache) for compute-intensive tasks and A7 cluster (780 MHz, 512 KB L2 cache) for power-efficient background operations. Both clusters support NEON and VFPv4, and include CoreSight debug infrastructure with PTM trace and ETR buffers.

Its AXI-based 40-bit, 256-bit-wide interconnect operates at 260 MHz and connects to dedicated subsystems including DBSC3 memory controller, IPMMU for secure memory mapping, and multiple DMAC channels (RT-DMAC, Audio-DMAC, 2D-DMAC). Graphics and video paths are hardware-accelerated via FDP1 display processor, VSP1 video signal processor, and JPU JPEG codec - all accessible through dedicated AXI slave ports.

Key Specifications

Parameter Value and Actual Design Meaning
CPU ArchitectureHeterogeneous dual-cluster: 4× Cortex-A15 @ 1.4 GHz + 4× Cortex-A7 @ 780 MHz
Memory InterfaceDDR3-1600 (800 MHz clock), 32-bit × 2 channels, supporting up to 4 GB
Graphics EngineDedicated 3DGE + R-GP2D 2D engine with OpenGL ES 3.0 / OpenVG 1.1 support
Video ProcessingVSP1 (video signal processor), VCP3 (video codec processor), JPU (JPEG encode/decode)
Display Output3 independent display channels: RGB, LVDS, HDMI (via companion PHY)
Video Input4-channel parallel CSI interface (VIN0–VIN3), supporting up to 1080p@60fps aggregate
ConnectivityPCIe Gen2 ×1, SATA II ×2, USB 3.0 Host ×1 + USB 2.0 Host ×3, CAN ×2, Ethernet AVB MAC
SecurityARM TrustZone, Secure Boot, SECRAM, Crypto Engine (AES/SHA/RSA), Secure WDT & timers

Pinout & Package

Package: 1517-pin FC-BGA (Fine-Pitch Ball Grid Array), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, lead-free.

Pin/Terminal Circuit Role Design Meaning
VDD_ARM_A15_0A15 Cluster Core Power Supply1.15 V ±3% supply for Cortex-A15 CPU0 core logic
VDD_ARM_A15_1A15 Cluster Core Power Supply1.15 V ±3% supply for Cortex-A15 CPUs 1–3 and SCU+L2
VDD_ARM_A7_0A7 Cluster Core Power Supply1.0 V ±3% supply for Cortex-A7 CPU0 core logic
VDD_ARM_A7_1A7 Cluster Core Power Supply1.0 V ±3% supply for Cortex-A7 CPUs 1–3 and SCU+L2
EXTAL1Main System Clock Input20 MHz crystal reference input for CPG PLL generation of all internal clocks
DDR3_DQ[0:31]DDR3 Data Bus32-bit bidirectional data interface for DDR3-1600 SDRAM (two-channel interleaved)
PCIe_REFCLK_P/NPCIe Reference ClockDifferential 100 MHz reference clock input for PCIe Gen2 PHY operation
HDMI_TX_CLK_P/NHDMI TMDS Clock OutputDifferential 165 MHz clock output for HDMI 1.4b pixel clock (requires external PHY)

Key Features

Feature Design Value
Heterogeneous Big.LITTLE ClusteringIndependent power domains and clock gating for A15/A7 clusters enable dynamic workload partitioning and thermal-aware scheduling
Hardware Video AccelerationVSP1 supports real-time deinterlacing, scaling, color space conversion, and overlay compositing without CPU load
Secure Boot & Runtime IsolationBoot ROM validates signed firmware; TrustZone + IPMMU enforces strict memory/data separation between secure/non-secure worlds
Multi-Display PipelineFDP1 display processor enables simultaneous RGB, LVDS, and HDMI outputs with independent gamma/LUT control per channel
Automotive-Grade ConnectivityDual CAN 2.0B controllers with time-triggered communication support for ASAM MCD-2 MC compliance
Industrial I/O Flexibility188 GPIO pins with programmable pull-up/down, slew rate, and drive strength via PFC registers - configurable per pin group

Applications

Automotive Infotainment Head Unit Industrial HMI with Multi-Touch Display

Use Scenario: Centralized cockpit system integrating navigation, media playback, rear-seat entertainment, and vehicle telemetry.

IC Role / Device Role / Timing Role: Primary application processor executing Linux-based IVI stack, managing GPU rendering, video decode, audio DSP, and CAN bus diagnostics.

Use Value: Dual CPU clusters allow concurrent UI responsiveness (A15) and low-power background services (A7); triple-display output drives instrument cluster, center console, and rear-seat screens simultaneously.

Use Scenario: Factory-floor operator terminal with 10-inch capacitive touchscreen, barcode scanner interface, and PLC connectivity.

IC Role / Device Role / Timing Role: Real-time HMI controller running Qt-based GUI, handling touch input via TSC, driving LVDS display, and communicating over Ethernet AVB and serial peripherals.

Use Value: Integrated VSP1 and FDP1 eliminate external video scalers; 188 GPIOs support direct connection to industrial I/O expanders and safety-rated digital inputs.

Medical Imaging Display Terminal Digital Signage Media Player

Use Scenario: DICOM-compliant diagnostic display station receiving ultrasound/MRI streams over Gigabit Ethernet.

IC Role / Device Role / Timing Role: High-fidelity video pipeline controller decoding JPEG2000/JPX streams via JPU, applying gamma correction via DRC, and outputting calibrated 4K@60fps over HDMI.

Use Value: Hardware-accelerated JPEG2000 decode (JPU) reduces CPU load by >90%; DRC ensures medical-grade grayscale linearity and contrast consistency.

Use Scenario: Commercial kiosk playing 4K video ads, interactive content, and real-time weather/traffic overlays.

IC Role / Device Role / Timing Role: Media-centric SoC rendering HTML5/OpenGL content, decoding H.264/H.265 via VCP3, and driving dual 4K displays via HDMI + LVDS.

Use Value: VCP3 supports 4K@60fps H.265 decode at <500 mW; triple-display capability enables split-screen advertising with synchronized timing across outputs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance embedded MPSoC applications.

Alternative Part Technical Difference Application Difference Selection Advice
R8A77450HA01BG#UASame RZ/G1H family; identical pinout and core architecture but with enhanced thermal spec (−40°C to +125°C vs. −40°C to +105°C)Targeted for extended-temperature automotive under-hood or industrial edge deployments requiring higher junction temperature toleranceSelect when operating ambient exceeds 105°C or when AEC-Q100 Grade 2 qualification is required
R8A77470HA01BG#UALower-cost RZ/G1M variant: single A15 + quad A7, no 3DGE, reduced video I/O (2 VIN, 2 DU), no PCIe/SATASuitable for cost-sensitive HMI or gateway applications where full RZ/G1H graphics/video bandwidth is unnecessaryChoose for non-multimedia applications needing only basic GUI and connectivity - saves ~35% BOM cost and simplifies thermal design

Compared with R8A77440HA01BG#UA, R8A77450HA01BG#UA offers extended temperature operation without architectural change, while R8A77470HA01BG#UA trades graphics/video capability and I/O count for lower power and cost - enabling tiered platform scaling across product families.

Availability

R8A77440HA01BG#UA is available at Aetrix Electronics and suitable for automotive infotainment, industrial HMI, medical imaging terminals, and digital signage requiring stable component supply, long-term lifecycle support, and qualified sourcing.

Supply support for R8A77440HA01BG#UA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RZ/G series - including R8A77440HA01BG#UA - was designed specifically for rich graphics applications demanding high-resolution display, real-time video processing, and secure heterogeneous computing in safety-conscious embedded environments.

FAQ

What is the maximum DDR3 memory speed supported by R8A77440HA01BG#UA?

R8A77440HA01BG#UA supports DDR3-1600 (800 MHz clock) across two 32-bit channels, enabling up to 12.8 GB/s theoretical bandwidth. The memory controller includes on-die termination, programmable drive strength, and per-byte write leveling - validated for Micron MT41K256M16TW-107 and Samsung K4B4G1646E-BCMA modules in Renesas reference designs.

Does R8A77440HA01BG#UA include hardware JPEG encoding and decoding?

Yes, R8A77440HA01BG#UA integrates the JPEG Processing Unit (JPU) capable of simultaneous 4K@30fps JPEG encode and decode, supporting baseline, progressive, and JPEG2000 (JPX) formats. The JPU operates independently of CPU cores and interfaces directly with memory via AXI - confirmed in Section 1.3.7 of the RZ/G1H Hardware Manual (R01UH0627EJ0100).

What is the thermal specification for R8A77440HA01BG#UA?

R8A77440HA01BG#UA is rated for operation from −40°C to +105°C case temperature (Tc), with junction temperature (Tj) limited to +125°C. Its 1517-ball FC-BGA package uses thermal-enhanced epoxy molding compound and exposes a large thermal pad on the underside - requiring 6×6 array of thermal vias to internal ground plane per Renesas Thermal Design Guide (R01TL0079EJ0100).

Is R8A77440HA01BG#UA pin-compatible with other RZ/G1x devices?

No, R8A77440HA01BG#UA is not pin-compatible with RZ/G1M or RZ/G1N variants due to differences in I/O count, power domain layout, and ball assignment - despite sharing the same 1517-ball FC-BGA footprint. Pin compatibility is only guaranteed within the RZ/G1H family (e.g., R8A77440HA01BG#UA ↔ R8A77450HA01BG#UA), as documented in Renesas Package Outline Drawing LFBGA1517A.

What security features are implemented in R8A77440HA01BG#UA?

R8A77440HA01BG#UA implements ARM TrustZone, secure boot ROM with SHA-256 signature verification, SECRAM (128 KB tightly coupled secure RAM), Crypto Engine supporting AES-128/256, SHA-256, RSA-2048, and secure watchdog/timers. These features are enabled at silicon level and require no external components - validated in Renesas Security White Paper R01AN2944EJ0100.

R8A77440HA01BG#UA Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
-
Series:
RZ/G/G1N
Packaging:
Tray
Product Status:
Not For New Designs
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
-
Speed:
1.5GHz
Co-Processors/DSP:
-
RAM Controllers:
-
Graphics Acceleration:
-
Display & Interface Controllers:
-
Ethernet:
-
SATA:
-
USB:
-
Voltage - I/O:
-
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
-
Supplier Device Package:
-
Additional Interfaces:
-

R8A77440HA01BG#UA FAQ

1.How can I place an order for R8A77440HA01BG#UA through Aetrix?

Please submit a Request for Quotation (RFQ) for R8A77440HA01BG#UA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R8A77440HA01BG#UA reliable?

The price and inventory of R8A77440HA01BG#UA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R8A77440HA01BG#UA is usually 5 days.

3.What payment methods are accepted for R8A77440HA01BG#UA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R8A77440HA01BG#UA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R8A77440HA01BG#UA?

R8A77440HA01BG#UA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R8A77440HA01BG#UA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R8A77440HA01BG#UA?

For technical support, including R8A77440HA01BG#UA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R8A77440HA01BG#UA requirements.

6.How does Aetrix verify that R8A77440HA01BG#UA is sourced from the original manufacturer or authorized distributors?

All R8A77440HA01BG#UA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R8A77440HA01BG#UA meets industry standards.

7.What is the process for return or replacement of R8A77440HA01BG#UA?

All R8A77440HA01BG#UA units undergo pre-shipment inspection (PSI). If there is an issue with R8A77440HA01BG#UA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R8A77440HA01BG#UA part is unused and in its original packaging.

Return procedure for R8A77440HA01BG#UA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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