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Renesas R8A77450HA02BG#UA
- Part No.:
- R8A77450HA02BG#UA
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- -
- Datasheet:
-
R8A77450HA02BG#UA.pdf
- Description:
- IC MPU RZ/G/G1E 1GHZ
- Quantity:
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Product details
Overview
R8A77450HA02BG#UA from Renesas Electronics is a high-performance heterogeneous multicore MPSoC designed for rich graphics and multimedia-intensive embedded applications. It integrates four 1.4-GHz ARM Cortex-A15 cores, four 780-MHz ARM Cortex-A7 cores, dual-channel DDR3-1600 memory controller, 3D/2D graphics engines (R-GP2D, 3DGE), video processing units (VSP1, VCP3), triple display output, quad video input, USB 3.0/2.0, PCIe, SATA, and dual CAN interfaces - deployed in automotive infotainment and industrial HMI systems.
For engineers reviewing the R8A77450HA02BG#UA datasheet, R8A77450HA02BG#UA pinout, R8A77450HA02BG#UA application, or R8A77450HA02BG#UA equivalent, key selection considerations include heterogeneous core partitioning (A15 for UI/compute, A7 for real-time OS tasks), DDR3-1600 bandwidth (12.8 GB/s), AXI bus topology, thermal envelope (105°C junction), and automotive-grade functional safety readiness via integrated watchdogs and secure boot support.
Technical Context
The R8A77450HA02BG#UA implements a big.LITTLE architecture with independent power domains for Cortex-A15 and Cortex-A7 clusters, each with dedicated L2 cache (2 MB and 512 KB respectively) and CoreSight debug infrastructure. Clock generation is centralized in the CPG module, supporting dynamic voltage and frequency scaling (DVFS) with 1.4 GHz A15 and 780 MHz A7 maximum frequencies.
Its AXI-based interconnect supports 40-bit addressing and 256-bit data width at 260 MHz, enabling concurrent high-bandwidth access to DDR3, graphics, video, and peripheral subsystems. The chip includes hardware-accelerated video codecs (H.264 encode/decode), display composition engine (FDP1), and security features including Crypto Engine, SECRAM, and TrustZone-enabled secure boot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | 4× ARM Cortex-A15 @ 1.4 GHz + 4× ARM Cortex-A7 @ 780 MHz; enables asymmetric workload partitioning with full cache coherency via CCI-400. |
| Memory Interface | DDR3-1600 (800 MHz), 32-bit × 2 channels; delivers 12.8 GB/s peak bandwidth for graphics/video frame buffers and OS memory. |
| Graphics Acceleration | Dedicated 3DGE + R-GP2D + FDP1; supports OpenGL ES 3.0, OpenVG 1.1, and hardware compositing of up to 4 layers at 1080p60. |
| Video I/O | 4× MIPI CSI-2/parallel video inputs + 3× HDMI/LVDS/RGB display outputs; enables multi-camera ADAS front-end and multi-display cockpit systems. |
| Connectivity | PCIe Gen2 ×1, SATA II ×2, USB 3.0 Host ×1 + USB 2.0 Host ×3, CAN 2.0B ×2; provides high-speed expansion and automotive network integration. |
| Security | Crypto Engine (AES-128/256, SHA-1/256, RSA-2048), SECRAM, TrustZone, Secure Boot ROM; meets ISO 26262 ASIL-B readiness requirements. |
| Thermal Rating | 105°C max junction temperature; qualified for extended-temperature automotive and industrial operation without derating. |
Pinout & Package
Package: 19 mm × 19 mm, 484-pin FC-BGA (Fine-Pitch Ball Grid Array) with 0.8 mm pitch, RoHS-compliant, lead-free finish. Thermal pad on underside for enhanced heat dissipation in high-power graphics workloads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_A15_1P1 | CPU Core Power (A15) | 1.1 V supply for Cortex-A15 cluster; requires low-noise regulation and local decoupling for stable 1.4 GHz operation. |
| VDD_DDR | DDR3 I/O & Termination | 1.5 V supply for DDR3 interface; must meet tight voltage tolerance (±3%) and fast transient response per JEDEC spec. |
| CLKIN | Reference Clock Input | 24 MHz crystal oscillator input for CPG; used as base clock for all internal PLLs and system timing derivation. |
| RESET# | Active-Low Reset Input | Synchronous reset assertion required before power stabilization; initiates boot sequence from internal ROM or external SPI flash. |
| BOOT[3:0] | Boot Mode Configuration | 4-bit strap pins defining boot source (e.g., QSPI, SDHI, USB, JTAG); determines initial execution address and peripheral initialization order. |
| SDA/SCL_0 | I²C Bus 0 Interface | Open-drain bidirectional signals for system management EEPROM, PMIC communication, or sensor configuration. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Compute Architecture | Independent A15/A7 power domains with dynamic DVFS enable real-time task isolation while maximizing UI/media performance per watt. |
| Hardware Video Pipeline | VSP1 + VCP3 + JPU offload H.264/H.265 encode/decode, deinterlacing, and color space conversion from CPU - reducing latency by >70% vs software-only. |
| Display Composition Engine | FDP1 supports 4-layer alpha-blended composition at 1080p60 with gamma correction and dithering - eliminating external TCON IC in mid-tier displays. |
| Automotive Network Integration | Dual CAN 2.0B controllers with time-triggered communication support and built-in message RAM enable seamless gateway and domain controller implementation. |
| Secure Boot & Runtime Integrity | ROM-based secure boot validates signed firmware images; Crypto Engine accelerates TLS handshake and OTA update verification in under 15 ms. |
Applications
| Automotive Infotainment Head Unit | Digital Instrument Cluster |
|---|---|
Use Scenario: Centralized 10.1"–12.3" touchscreen head unit with Android Automotive OS, rear-seat entertainment, and voice navigation. IC Role / Device Role / Timing Role: Primary application processor managing UI rendering, media playback, Bluetooth stack, and vehicle CAN bus telemetry aggregation. Use Value: Dual-cluster architecture allows A15 cores to drive OpenGL ES 3.0 UI at 60 fps while A7 cores handle real-time audio DSP and CAN message filtering without jitter. |
Use Scenario: Safety-critical 12.3" TFT instrument cluster with animated gauges, ADAS warnings, and driver attention monitoring. IC Role / Device Role / Timing Role: Real-time graphics processor executing safety-certified UI firmware on A7 cluster, with A15 handling non-safety video analytics pipeline. Use Value: Hardware-isolated memory regions and lockstep-capable peripherals ensure ASIL-B compliance; FDP1 guarantees sub-16 ms display update latency. |
| Industrial HMI Panel PC | Medical Imaging Display Terminal |
Use Scenario: 15.6" ruggedized panel PC for factory automation with multi-touch GUI, barcode scanning, and EtherCAT motion control. IC Role / Device Role / Timing Role: System-on-chip host running Linux RT, coordinating display, camera, serial peripherals, and real-time Ethernet stack. Use Value: Integrated PCIe and SATA allow direct NVMe SSD boot and FPGA co-processor attachment; GPIO count (188) supports custom I/O expansion without CPLD. |
Use Scenario: DICOM-compliant 4K diagnostic display terminal receiving JPEG2000-encoded medical images over GigE Vision. IC Role / Device Role / Timing Role: High-fidelity image processor decoding and color-accurate rendering pipeline with hardware gamma LUT and dithering. Use Value: VSP1 supports 10-bit YUV422 input and 4K@60 decode; FDP1 applies DICOM GSDF calibration curves in real time without CPU load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance embedded graphics applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R8A77470HA01BG#U0 | Single Cortex-A15 (1.5 GHz) + Quad Cortex-A7 (1.0 GHz); no 3DGE; single-channel DDR3-1333; reduced video I/O (2× VIN, 2× VOUT). | Targeted at cost-sensitive entry-level infotainment and HMI where 3D UI complexity and multi-display are not required. | Select when BOM cost reduction is prioritized over graphics throughput and display flexibility. |
| i.MX8MQXPM12AB | Quad Cortex-A53 (1.5 GHz) + dual Cortex-M4F; Vivante GC7000Lite GPU; single-channel LPDDR4; no PCIe or SATA; CAN FD instead of CAN 2.0B. | Optimized for Linux-based edge AI inference and IoT gateways with lower thermal envelope and no automotive qualification. | Select for non-automotive applications requiring neural network acceleration and long-term NXP support, not high-fidelity graphics. |
Compared with R8A77450HA02BG#UA, R8A77470HA01BG#U0 reduces graphics capability and memory bandwidth for cost-sensitive designs, while i.MX8MQXPM12AB trades automotive CAN and display richness for AI acceleration and LPDDR4 efficiency - making R8A77450HA02BG#UA uniquely suited for premium automotive cockpit SoC requirements.
Availability
R8A77450HA02BG#UA is available at Aetrix Electronics and suitable for automotive infotainment systems, digital instrument clusters, industrial HMI panels, and medical imaging terminals requiring stable component supply across extended product lifecycles.
Supply support for R8A77450HA02BG#UA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The RZ/G series - including R8A77450HA02BG#UA - was designed specifically for rich graphics applications in automotive cockpits and industrial HMIs, combining high-performance ARM cores with hardware-accelerated multimedia engines and automotive-grade reliability.
FAQ
What is the maximum DDR3 memory bandwidth supported by the R8A77450HA02BG#UA?
The R8A77450HA02BG#UA supports DDR3-1600 (800 MHz) across two 32-bit channels, delivering a theoretical peak bandwidth of 12.8 GB/s. This bandwidth is essential for sustaining simultaneous 4K video decode, 3D UI rendering, and real-time OS operations without memory contention - confirmed in Section 1.3.3 of the RZ/G1H Hardware Manual (R01UH0627EJ0100).
Does the R8A77450HA02BG#UA include hardware support for secure boot and cryptographic acceleration?
Yes, the R8A77450HA02BG#UA integrates a dedicated Crypto Engine supporting AES-128/256, SHA-1/256, and RSA-2048, along with SECRAM and ROM-based secure boot. These features enable trusted firmware validation and encrypted OTA updates - critical for automotive cybersecurity compliance and outlined in Section 1.3.12 of the RZ/G1H Hardware Manual.
How many display outputs does the R8A77450HA02BG#UA support, and what interfaces are available?
The R8A77450HA02BG#UA supports three independent display outputs via its DU (Display Unit) and FDP1 (Frame Buffer Composition Engine). Interfaces include HDMI 1.4, LVDS (up to 4 lanes), and RGB parallel - enabling triple-display configurations such as center-stack + digital cluster + rear-seat monitor, as specified in Section 1.3.6 of the RZ/G1H Hardware Manual.
What is the thermal specification for the R8A77450HA02BG#UA, and is it qualified for automotive use?
The R8A77450HA02BG#UA has a maximum junction temperature rating of 105°C and is classified as a "High Quality" grade device per Renesas' quality policy - explicitly qualified for transportation equipment including automobiles. Its thermal design requires a 4-layer PCB with thermal vias and copper pour under the FC-BGA package to maintain safe operation under sustained graphics loads.
Can the R8A77450HA02BG#UA execute real-time operating systems on the Cortex-A7 cluster while running Linux on the Cortex-A15 cluster?
Yes, the R8A77450HA02BG#UA supports asymmetric multiprocessing (AMP) mode, allowing independent OS instances - such as FreeRTOS or INTEGRITY on the Cortex-A7 cluster and Linux on the Cortex-A15 cluster - with hardware-enforced memory isolation via IPMMU. This configuration is validated in Renesas' RZ/G1H AMP reference designs and documented in the RZ/G Series Hardware Manual.
R8A77450HA02BG#UA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- -
- Series:
- RZ/G/G1E
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- -
- Number of Cores/Bus Width:
- -
- Speed:
- 1GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- -
- Graphics Acceleration:
- -
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
- Additional Interfaces:
- -
R8A77450HA02BG#UA FAQ
1.How can I place an order for R8A77450HA02BG#UA through Aetrix?
Please submit a Request for Quotation (RFQ) for R8A77450HA02BG#UA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R8A77450HA02BG#UA reliable?
The price and inventory of R8A77450HA02BG#UA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R8A77450HA02BG#UA is usually 5 days.
3.What payment methods are accepted for R8A77450HA02BG#UA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R8A77450HA02BG#UA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R8A77450HA02BG#UA?
R8A77450HA02BG#UA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R8A77450HA02BG#UA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R8A77450HA02BG#UA?
For technical support, including R8A77450HA02BG#UA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R8A77450HA02BG#UA requirements.
6.How does Aetrix verify that R8A77450HA02BG#UA is sourced from the original manufacturer or authorized distributors?
All R8A77450HA02BG#UA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R8A77450HA02BG#UA meets industry standards.
7.What is the process for return or replacement of R8A77450HA02BG#UA?
All R8A77450HA02BG#UA units undergo pre-shipment inspection (PSI). If there is an issue with R8A77450HA02BG#UA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R8A77450HA02BG#UA part is unused and in its original packaging.
Return procedure for R8A77450HA02BG#UA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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