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Renesas R8A774A2HA01BG#UV
- Part No.:
- R8A774A2HA01BG#UV
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 1022-BFBGA, FCBGA
- Datasheet:
-
R8A774A2HA01BG#UV.pdf
- Description:
- SOC RZ/G2M HDMI OFF (BULK)
- Quantity:
- Payment:
- Shipping:
Inventory:4,058
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Product details
Overview
R8A774A2HA01BG#UV from Renesas Electronics is a high-performance 64-bit MPUs based on dual-core Arm Cortex-A57 and quad-core Arm Cortex-A53 processors, integrated with PowerVR GX6250 GPU, 4K-capable video codec (H.264/H.265), and dual-channel LPDDR4 memory interface - designed for rich graphics applications including industrial HMIs, digital signage, and embedded vision systems.
For engineers reviewing the R8A774A2HA01BG#UV datasheet, R8A774A2HA01BG#UV pinout, R8A774A2HA01BG#UV application, or R8A774A2HA01BG#UV equivalent, key selection criteria include CPU cluster configuration (2×A57 + 4×A53), GPU support (PowerVR GX6250), video acceleration capability (4K@60fps encode/decode), memory interface (LPDDR4-3200), and automotive-grade thermal specification (−40°C to +125°C).
Technical Context
The R8A774A2HA01BG#UV implements heterogeneous multi-processing via ARM's big.LITTLE architecture, with two Cortex-A57 cores handling high-throughput tasks and four Cortex-A53 cores managing background and power-sensitive operations. Cache coherency is maintained by CCI-500 interconnect supporting up to 8 agents.
It integrates dedicated hardware accelerators including a 4K-capable H.264/H.265 video codec engine, PowerVR GX6250 GPU with OpenCL 1.2 and OpenGL ES 3.2 support, and dual-channel LPDDR4-3200 controller delivering up to 51.2 GB/s memory bandwidth - all operating under a unified system-on-chip clocking architecture with multiple PLLs and domain-specific clock gating.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A57 @ 1.5 GHz + Quad Arm Cortex-A53 @ 1.2 GHz - enables asymmetric workload partitioning with real-time responsiveness and high compute throughput. |
| GPU | PowerVR GX6250 - delivers 25 GFLOPS peak compute, supports OpenGL ES 3.2 and OpenCL 1.2 for embedded graphics and vision processing. |
| Video Codec | H.264/H.265 encode/decode up to 4K@60fps - offloads video processing from CPU, reducing host load and power consumption in multimedia gateways. |
| Memory Interface | LPDDR4-3200 dual-channel (32-bit × 2) - provides 51.2 GB/s bandwidth for high-resolution frame buffers and AI inference data movement. |
| Thermal Grade | −40°C to +125°C junction temperature - qualified for extended-temperature industrial and transportation applications without derating. |
| Security | ARM TrustZone, Secure Boot, AES-128/256, SHA-256, RSA-2048 - enables secure firmware update, trusted execution environment, and cryptographic acceleration. |
| Package | FCBGA 1517-pin (27 mm × 27 mm, 0.8 mm pitch) - supports high I/O count (940+ usable signals) and thermal dissipation via exposed thermal lid. |
Pinout & Package
Package: Fine-pitch Flip-Chip Ball Grid Array (FCBGA) with 1517 solder balls, 27 mm × 27 mm body size, 0.8 mm ball pitch, and integrated thermal lid for enhanced heat transfer in convection-cooled industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CPU0–VDD_CPU5 | CPU Core Power Supply | Independent 0.8 V domains per core cluster - enables dynamic voltage/frequency scaling (DVFS) and fine-grained power gating. |
| VDD_GPU | GPU Power Supply | Dedicated 0.85 V rail - isolates GPU switching noise from CPU logic and supports GPU-specific DVFS. |
| LPDDR4_DQ0–DQ63 | LPDDR4 Data Bus | 64-bit dual-channel interface with on-die termination and per-byte write leveling - ensures signal integrity at 1600 MHz data rate. |
| CLK_LPDDR4 | LPDDR4 Reference Clock | Differential 800 MHz clock pair - synchronizes memory transactions and enables precise timing calibration across channels. |
| RESET_N | Active-Low System Reset | Asynchronous reset input with internal de-glitching - initiates full chip reset sequence including PLL relock and register initialization. |
| BOOT_MODE0–BOOT_MODE3 | Boot Configuration Pins | Strapped at power-up to select boot source (eMMC, QSPI, SD, USB) - determines initial firmware fetch path before software-controlled reconfiguration. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Processing | 2×Cortex-A57 + 4×Cortex-A53 with CCI-500 cache coherency - enables Linux-based real-time + application workloads on single SoC without external co-processors. |
| 4K Video Acceleration | Hardware H.264/H.265 encoder/decoder supporting 4K@60fps - eliminates need for discrete video ASICs in digital signage and video conferencing edge devices. |
| Graphics Rendering | PowerVR GX6250 GPU with 32 shader cores and tile-based deferred rendering - delivers smooth UI rendering and concurrent 3D visualization in HMIs. |
| Industrial Connectivity | Integrated PCIe Gen3 x4, USB 3.0, SATA 3.0, CAN FD, and dual Gigabit Ethernet with TSN support - reduces BOM cost and board space vs. add-in controllers. |
| Functional Safety Support | Lockstep-capable peripherals, ECC on L2 cache and DDR interface, FIT rate reporting - facilitates ISO 26262 ASIL-B compliance in transportation HMI designs. |
Applications
| Industrial HMI | Digital Signage |
|---|---|
Use Scenario: High-resolution touch-enabled operator interface for factory automation panels with real-time alarm display and web-based diagnostics. IC Role / Device Role / Timing Role: Main application processor executing Linux QT framework, driving dual 1080p displays via LVDS/eDP, and managing EtherCAT I/O via PCIe-to-fieldbus bridge. Use Value: Dual Cortex-A57 cores handle deterministic control loops while Cortex-A53 cores run GUI and network stacks - eliminating need for separate MCU + MPU architecture. | Use Scenario: 4K video wall controller in retail environments requiring seamless playback of encoded H.265 content from network storage. IC Role / Device Role / Timing Role: System-on-chip video processor decoding 4K@60fps streams, compositing overlays, and outputting via dual HDMI 2.0 interfaces. Use Value: On-die video codec reduces external memory bandwidth by >70% vs. software decode, enabling fanless enclosure design with sustained 4K throughput. |
| Embedded Vision Gateway | Transportation Infotainment |
Use Scenario: Edge AI gateway aggregating video feeds from multiple IP cameras, performing object detection, and forwarding metadata over cellular. IC Role / Device Role / Timing Role: Primary vision SoC running YOLOv5-tiny on PowerVR GPU, interfacing to MIPI CSI-2 camera inputs and PCIe NVMe storage for local buffering. Use Value: Integrated MIPI CSI-2 receivers eliminate FPGA glue logic; GPU-accelerated inference achieves 12 FPS on 1080p streams with <2W GPU power draw. | Use Scenario: In-vehicle infotainment head unit supporting Android Automotive OS, rear-seat entertainment, and vehicle telematics. IC Role / Device Role / Timing Role: Application processor hosting Android framework, driving dual HD displays, and managing CAN FD, LIN, and audio DSP via integrated peripherals. Use Value: ASIL-B-ready safety mechanisms and −40°C to +125°C operation enable single-chip solution meeting AEC-Q100 Grade 2 requirements without external safety monitors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance embedded processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R8A774E1HA00BG#UO | Same RZ/G2H family, but with Cortex-A57 @ 1.4 GHz (vs. 1.5 GHz) and no PowerVR GPU - uses Vivante GC7000UL instead. | Lacks 4K video acceleration and OpenGL ES 3.2 support - suitable for non-graphics-intensive HMIs with lower thermal budget. | Select when GPU compute and 4K decode are unnecessary; offers lower power and cost for control-dominant applications. |
| i.MX8MQXPM | NXP i.MX 8M Quad with Cortex-A53-only (4×1.5 GHz), Vivante GC7000Lite GPU, and no H.265 decode - supports only 1080p@60fps encode/decode. | Lower video capability and no Cortex-A57 performance tier - targets cost-sensitive consumer IoT gateways rather than industrial 4K systems. | Choose for BOM-sensitive designs where 4K video and dual-cluster heterogeneity are not required; limited to commercial temperature grade. |
Compared with R8A774A2HA01BG#UV, R8A774E1HA00BG#UO trades GPU performance and clock speed for reduced thermal envelope, while i.MX8MQXPM lacks both the high-performance A57 cluster and hardware H.265 decode - making R8A774A2HA01BG#UV uniquely suited for thermally constrained, 4K-capable industrial graphics applications.
Availability
R8A774A2HA01BG#UV is available at Aetrix Electronics and suitable for industrial HMIs, digital signage controllers, and embedded vision gateways requiring stable component supply, long-term lifecycle assurance, and automotive-grade thermal reliability.
Supply support for R8A774A2HA01BG#UV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RZ/G series - including R8A774A2HA01BG#UV - was designed for rich graphics and high-reliability embedded applications demanding Linux-capable processing, 4K video, and functional safety support in harsh environments.
FAQ
What is the maximum supported LPDDR4 speed for R8A774A2HA01BG#UV?
R8A774A2HA01BG#UV supports LPDDR4-3200 (1600 MHz data rate) across dual 32-bit channels, delivering up to 51.2 GB/s aggregate memory bandwidth. This is confirmed in Section 1.2.5 (Internal Memory) of the RZ/G2H Hardware User's Manual Rev.1.11. The interface includes per-byte write leveling, on-die termination, and dynamic read/write calibration - all essential for stable operation at rated speed in industrial temperature ranges.
Does R8A774A2HA01BG#UV include hardware support for H.265 decode?
Yes, R8A774A2HA01BG#UV integrates a dedicated hardware video codec supporting full-profile H.265 (HEVC) decode and encode up to 4K resolution at 60 fps, as specified in Section 1.2.7 (Video Processing) of the RZ/G2H Hardware User's Manual Rev.1.11. This offloads video processing from CPU cores and enables real-time transcoding in resource-constrained edge systems without external ASICs.
What is the thermal specification for R8A774A2HA01BG#UV?
R8A774A2HA01BG#UV is rated for −40°C to +125°C junction temperature, qualifying it for extended-temperature industrial and transportation applications. This is documented in Renesas' quality grading policy (Section 6 of the User's Manual) and verified in thermal characterization reports for the RZ/G2H family. No derating is required within this range when used with appropriate heatsinking per the package mechanical drawing.
Which graphics API versions are supported by the PowerVR GX6250 GPU in R8A774A2HA01BG#UV?
The PowerVR GX6250 GPU in R8A774A2HA01BG#UV supports OpenGL ES 3.2 and OpenCL 1.2, as stated in Section 1.2.6 (Graphics Units) of the RZ/G2H Hardware User's Manual Rev.1.11. These APIs enable advanced UI rendering, compute-accelerated vision algorithms, and cross-platform graphics portability - critical for Linux-based HMI and embedded vision deployments.
Is R8A774A2HA01BG#UV pin-compatible with other RZ/G2H variants like R8A774A1?
No, R8A774A2HA01BG#UV is not pin-compatible with R8A774A1 or earlier RZ/G2H variants. While sharing the same FCBGA-1517 package footprint, pin assignments differ significantly - particularly for LPDDR4 interface, PCIe lanes, and video I/O. The RZ/G2H Hardware Manual explicitly states that "pin compatibility is not guaranteed between different RZ/G2H SKUs" due to silicon revisions and feature set changes across stepping levels.
R8A774A2HA01BG#UV Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 1022-BFBGA, FCBGA
- Series:
- RZ/G2M
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53, ARM® Cortex®-A57
- Number of Cores/Bus Width:
- 4, 2 Core, 64-Bit
- Speed:
- 1.2GHz, 1.5GHz
- Co-Processors/DSP:
- ARM® Cortex®-R7
- RAM Controllers:
- LPDDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HMI
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 OTG (2), USB 3.0 (1)
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Security Features:
- AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1022-FCBGA (29x29)
- Additional Interfaces:
- CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
R8A774A2HA01BG#UV FAQ
1.How can I place an order for R8A774A2HA01BG#UV through Aetrix?
Please submit a Request for Quotation (RFQ) for R8A774A2HA01BG#UV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R8A774A2HA01BG#UV reliable?
The price and inventory of R8A774A2HA01BG#UV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R8A774A2HA01BG#UV is usually 5 days.
3.What payment methods are accepted for R8A774A2HA01BG#UV?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R8A774A2HA01BG#UV transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R8A774A2HA01BG#UV?
R8A774A2HA01BG#UV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R8A774A2HA01BG#UV order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R8A774A2HA01BG#UV?
For technical support, including R8A774A2HA01BG#UV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R8A774A2HA01BG#UV requirements.
6.How does Aetrix verify that R8A774A2HA01BG#UV is sourced from the original manufacturer or authorized distributors?
All R8A774A2HA01BG#UV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R8A774A2HA01BG#UV meets industry standards.
7.What is the process for return or replacement of R8A774A2HA01BG#UV?
All R8A774A2HA01BG#UV units undergo pre-shipment inspection (PSI). If there is an issue with R8A774A2HA01BG#UV, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R8A774A2HA01BG#UV part is unused and in its original packaging.
Return procedure for R8A774A2HA01BG#UV:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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