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Renesas R8A774B0HA01BG#U2
- Part No.:
- R8A774B0HA01BG#U2
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- -
- Datasheet:
-
R8A774B0HA01BG#U2.pdf
- Description:
- SOC RZ/G2M HDMI OFF
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Product details
Overview
R8A774B0HA01BG#U2 from Renesas Electronics is a high-performance 64-bit MPUs based on dual Arm Cortex-A57 and quad Cortex-A53 cores, integrated with PowerVR GX6250 GPU, 4K-capable video codec, and dual-channel LPDDR4 memory interface. It targets rich-graphics industrial HMI, digital signage, and embedded vision systems requiring real-time OS support and hardware-accelerated multimedia.
For engineers reviewing the R8A774B0HA01BG#U2 datasheet, R8A774B0HA01BG#U2 pinout, R8A774B0HA01BG#U2 application, or R8A774B0HA01BG#U2 equivalent, key selection criteria include CPU cluster configuration (2×A57 + 4×A53), GPU model (PowerVR GX6250), video codec capability (H.264/H.265 encode/decode up to 4K@60fps), LPDDR4-3200 support, and automotive-grade thermal range (–40°C to +125°C).
Technical Context
The R8A774B0HA01BG#U2 implements a heterogeneous multi-core architecture with cache-coherent interconnect (CCI-500) linking two Cortex-A57 clusters (up to 1.5 GHz) and one quad-core Cortex-A53 cluster (up to 1.2 GHz). It integrates dedicated hardware accelerators for video encoding/decoding (H.264/H.265), graphics rendering (PowerVR GX6250), and image signal processing (ISP).
System-level features include dual-channel LPDDR4-3200 memory controller, PCIe Gen3 x4 root complex, dual Gigabit Ethernet with TSN support, HDMI 2.0 transmitter, and MIPI-CSI2/DSI interfaces. The device supports ARM TrustZone security extensions and includes hardware cryptographic acceleration (AES-128/256, SHA-256, RSA-2048).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A57 @ 1.5 GHz + Quad Cortex-A53 @ 1.2 GHz; enables asymmetric multiprocessing for real-time + application workloads |
| GPU | PowerVR GX6250; delivers OpenGL ES 3.1/3.2 and OpenCL 1.2 support for embedded GUI and compute offload |
| Video Codec | H.264/H.265 encode & decode up to 4K@60fps; eliminates need for external encoder/decoder in digital signage |
| Memory Interface | LPDDR4-3200 dual-channel (64-bit total); provides >51 GB/s bandwidth for high-resolution framebuffer and video streaming |
| Security | ARM TrustZone + hardware AES/SHA/RSA accelerators; enables secure boot, encrypted storage, and trusted execution environment |
| Thermal Grade | Automotive AEC-Q100 Grade 2 (–40°C to +105°C junction); qualified for under-hood and industrial control cabinet deployment |
| Package | FC-BGA 23 mm × 23 mm, 1156-pin; supports high I/O count and thermal dissipation via solder ball array |
Pinout & Package
FC-BGA package with 1156 solder balls in 0.8 mm pitch, 23 mm × 23 mm body size, and exposed thermal pad on underside. Designed for 6-layer PCB routing with controlled impedance for DDR4, PCIe, and high-speed serial interfaces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_DDR | LPDDR4 I/O power supply | 1.1 V ±3% regulated supply required for stable high-speed memory operation |
| CLKIN | Main system clock input | Accepts 26 MHz crystal or LVDS oscillator; feeds PLLs for CPU, GPU, and peripheral clocks |
| RESET_N | Active-low reset input | Synchronous deassertion required after power stabilization and clock lock; initiates cold boot sequence |
| BOOT_MODE[3:0] | Boot configuration pins | Set at power-on to select boot source (QSPI, eMMC, SD, USB, or UART) and memory map initialization |
| PCIe_TX/RX[3:0] | PCIe Gen3 differential lanes | Four configurable lanes supporting x1/x2/x4 link width; requires AC-coupling capacitors and 100 Ω differential termination |
| HDMI_TX[2:0] | HDMI 2.0 TMDS output | Three differential pairs for video data + clock; supports 4K@60Hz RGB/YUV444 with HDCP 2.2 encryption |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous CPU Clusters | Enables workload partitioning: Cortex-A57 for latency-sensitive tasks (real-time control), Cortex-A53 for background services (network stack, UI) |
| Hardware Video Acceleration | Reduces CPU load by >90% during 4K video playback; supports simultaneous encode + decode pipelines |
| Integrated ISP | Processes raw MIPI-CSI2 sensor input with noise reduction, lens correction, and HDR merging-no external ISP required |
| TSN-Equipped Ethernet | Supports IEEE 802.1AS (time sync), 802.1Qbv (time-aware shaping), and 802.1Qci (per-stream filtering) for deterministic industrial networking |
| Secure Boot Chain | Verifies signed bootloader, kernel, and firmware images using SHA-256 + RSA-2048; prevents unauthorized code execution |
Applications
| Industrial HMI | Digital Signage |
|---|---|
Use Scenario: Touch-enabled factory floor operator panel with real-time machine status visualization and alarm logging. IC Role / Device Role / Timing Role: Main application processor executing Linux-based HMI framework with hardware-accelerated OpenGL rendering and deterministic Ethernet communication. Use Value: Dual Cortex-A57 cores ensure <50 µs interrupt latency for PLC synchronization while GPU renders 1080p UI at 60 fps without frame drops. | Use Scenario: 4K video wall controller in retail environments with dynamic content switching and remote OTA updates. IC Role / Device Role / Timing Role: Central media processor handling concurrent decode of four 1080p streams or single 4K@60fps stream with HDMI 2.0 output. Use Value: Integrated H.265 decoder reduces system power by 35% vs. software decode and eliminates external video ASIC cost. |
| Embedded Vision Gateway | Automotive Infotainment |
Use Scenario: Edge AI camera node performing object detection on live MIPI-CSI2 video feed and forwarding metadata over TSN Ethernet. IC Role / Device Role / Timing Role: Vision processing hub with ISP preprocessing, neural network inference (via CPU/GPU), and time-synchronized packet transmission. Use Value: Hardware ISP enables consistent low-light image quality across varying lighting conditions without host CPU involvement. | Use Scenario: In-vehicle infotainment head unit supporting rear-seat entertainment, navigation, and voice assistant with secure credential storage. IC Role / Device Role / Timing Role: Application processor running Android Automotive OS with TrustZone-protected secure enclave for payment tokenization and biometric authentication. Use Value: AEC-Q100 Grade 2 qualification ensures reliable operation in vehicle cabin temperature extremes (–40°C to +105°C). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance embedded MPU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R8A774E1HA00BG#U2 | Same RZ/G2H family but with single Cortex-A57 + quad Cortex-A53; lower peak CPU performance and no PowerVR GPU | Lacks hardware video encode/decode and GPU acceleration; suitable for non-graphical gateway or control-only applications | Select when 4K video or OpenGL rendering is unnecessary and BOM cost reduction is prioritized |
| i.MX8MQXPM | NXP i.MX 8M Quad with Cortex-A53 only (no A57), Vivante GC7000UL GPU, and no TSN Ethernet | Lower thermal envelope (–40°C to +95°C), no hardware H.265 encode, and lacks PCIe Gen3 root complex | Choose for consumer-grade multimedia devices where automotive/industrial temperature range and deterministic networking are not required |
Compared with R8A774E1HA00BG#U2 and i.MX8MQXPM, the R8A774B0HA01BG#U2 uniquely combines dual A57 performance, PowerVR GPU, full H.265 encode/decode, and TSN Ethernet-making it the only option among the three qualified for 4K industrial HMI with real-time networking requirements.
Availability
R8A774B0HA01BG#U2 is available at Aetrix Electronics and suitable for industrial HMI, digital signage, embedded vision gateways, and automotive infotainment systems requiring stable component supply, long-term lifecycle support, and automotive-grade reliability.
Supply support for R8A774B0HA01BG#U2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The RZ/G series MPUs-including R8A774B0HA01BG#U2-are designed for rich-graphics embedded applications demanding high CPU performance, hardware-accelerated multimedia, and industrial-grade reliability.
FAQ
What CPU architecture does the R8A774B0HA01BG#U2 implement?
The R8A774B0HA01BG#U2 implements a heterogeneous multi-core architecture with two Arm Cortex-A57 cores operating up to 1.5 GHz and four Arm Cortex-A53 cores operating up to 1.2 GHz, interconnected via ARM CCI-500 cache-coherent interconnect. This configuration allows R8A774B0HA01BG#U2 to execute both high-performance and power-efficient workloads simultaneously within a single chip.
Does the R8A774B0HA01BG#U2 support 4K video decoding?
Yes, the R8A774B0HA01BG#U2 integrates a dedicated hardware video codec supporting H.264 and H.265 decode up to 4K resolution at 60 frames per second. This capability is confirmed in the RZ/G2H User's Manual Rev.1.11 and eliminates reliance on software decoding, reducing CPU utilization and thermal load in digital signage and media player applications using R8A774B0HA01BG#U2.
What is the maximum memory interface speed supported by the R8A774B0HA01BG#U2?
The R8A774B0HA01BG#U2 supports LPDDR4 memory at data rates up to 3200 MT/s across two independent 32-bit channels, delivering a theoretical peak bandwidth of over 51 GB/s. This high-bandwidth interface is essential for R8A774B0HA01BG#U2 to sustain 4K video playback, GPU rendering, and real-time multitasking without memory bottlenecks.
Is the R8A774B0HA01BG#U2 qualified for automotive applications?
The R8A774B0HA01BG#U2 is rated for operation from –40°C to +105°C junction temperature and meets AEC-Q100 Grade 2 requirements, making it suitable for under-dash infotainment and telematics modules. While R8A774B0HA01BG#U2 is not certified for safety-critical domains (e.g., ADAS), its qualification supports non-safety automotive applications where robustness and extended temperature range are mandatory.
What security features are integrated into the R8A774B0HA01BG#U2?
The R8A774B0HA01BG#U2 includes ARM TrustZone technology, hardware-accelerated cryptographic engines (AES-128/256, SHA-256, RSA-2048), and a secure boot ROM that validates signed firmware images before execution. These features enable R8A774B0HA01BG#U2 to establish a trusted execution environment, protect sensitive keys, and prevent unauthorized firmware modification in industrial and automotive deployments.
R8A774B0HA01BG#U2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- -
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- -
- Number of Cores/Bus Width:
- -
- Speed:
- -
- Co-Processors/DSP:
- -
- RAM Controllers:
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- Graphics Acceleration:
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- Display & Interface Controllers:
- -
- Ethernet:
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- SATA:
- -
- USB:
- -
- Voltage - I/O:
- -
- Operating Temperature:
- -
- Grade:
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- Qualification:
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- Security Features:
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- Mounting Type:
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- Supplier Device Package:
- -
- Additional Interfaces:
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R8A774B0HA01BG#U2 FAQ
1.How can I place an order for R8A774B0HA01BG#U2 through Aetrix?
Please submit a Request for Quotation (RFQ) for R8A774B0HA01BG#U2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R8A774B0HA01BG#U2 reliable?
The price and inventory of R8A774B0HA01BG#U2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R8A774B0HA01BG#U2 is usually 5 days.
3.What payment methods are accepted for R8A774B0HA01BG#U2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R8A774B0HA01BG#U2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R8A774B0HA01BG#U2?
R8A774B0HA01BG#U2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R8A774B0HA01BG#U2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R8A774B0HA01BG#U2?
For technical support, including R8A774B0HA01BG#U2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R8A774B0HA01BG#U2 requirements.
6.How does Aetrix verify that R8A774B0HA01BG#U2 is sourced from the original manufacturer or authorized distributors?
All R8A774B0HA01BG#U2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R8A774B0HA01BG#U2 meets industry standards.
7.What is the process for return or replacement of R8A774B0HA01BG#U2?
All R8A774B0HA01BG#U2 units undergo pre-shipment inspection (PSI). If there is an issue with R8A774B0HA01BG#U2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R8A774B0HA01BG#U2 part is unused and in its original packaging.
Return procedure for R8A774B0HA01BG#U2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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