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Renesas R8A774C0HA01BG#G0
- Part No.:
- R8A774C0HA01BG#G0
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 552-FBGA
- Datasheet:
-
R8A774C0HA01BG#G0.pdf
- Description:
- IC MPU RZ/G2E 1.2GHZ 552FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,484
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Product details
Overview
R8A774C0HA01BG#G0 from Renesas Electronics is a high-performance ARM Cortex-A15-based application processor in the RZ/G1C family, designed for rich graphics and multimedia applications. It integrates a dual-core 1.5 GHz CPU, PowerVR SGX544MP2 GPU, 1080p video codec, DDR3L memory controller, and multiple high-speed interfaces including USB 2.0, SATA, and Gigabit Ethernet. It targets embedded HMI systems requiring real-time graphics rendering and Linux-based OS support.
For engineers reviewing the R8A774C0HA01BG#G0 datasheet, R8A774C0HA01BG#G0 pinout, R8A774C0HA01BG#G0 application, or R8A774C0HA01BG#G0 equivalent, key selection criteria include CPU core count and frequency, GPU capability, video codec resolution support, memory interface type (DDR3L), and industrial temperature grade (−40°C to +85°C).
Technical Context
The R8A774C0HA01BG#G0 implements a dual-core ARM Cortex-A15 MPCore CPU with NEON and VFPv4 extensions, coupled with a 32 KB L1 instruction cache and 32 KB L1 data cache per core, plus a shared 1 MB L2 cache. It supports TrustZone security extensions and includes an integrated memory management unit (MMU) with virtual memory support.
Its system architecture features a multi-layer AXI bus interconnect, dedicated 2D/3D graphics acceleration via PowerVR SGX544MP2, hardware-accelerated H.264/MPEG-4 video encode/decode up to 1080p@60fps, and a configurable pin-multiplexing engine (PFC) enabling flexible I/O assignment across 392-ball BGA package pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core ARM Cortex-A15 @ 1.5 GHz - enables concurrent execution of Linux kernel tasks and real-time application threads with deterministic latency. |
| GPU | PowerVR SGX544MP2 - delivers OpenGL ES 2.0/3.0 and OpenVG 1.1 acceleration for smooth UI rendering and layered graphics compositing. |
| Video Codec | H.264/MPEG-4 decode/encode up to 1080p@60fps - supports full HD video playback and recording without CPU load. |
| Memory Interface | DDR3L-1066 (32-bit bus) - provides 8.5 GB/s peak bandwidth for graphics frame buffers and application data. |
| Package | 392-ball FBGA (15 mm × 15 mm, 0.65 mm pitch) - compatible with standard SMT reflow profiles and industrial PCB routing density requirements. |
| Operating Temp | −40°C to +85°C - qualified for extended-temperature industrial and transportation-grade embedded deployments. |
| Power Supply | Core: 1.0 V ±3%; I/O: 1.8 V/3.3 V selectable - enables low-power operation while supporting legacy peripheral voltage levels. |
Pinout & Package
Package: 392-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 15 mm, 0.65 mm ball pitch, RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | Supplies regulated 1.0 V to CPU, GPU, and internal logic; requires low-ESR ceramic decoupling near each pin group. |
| VDD_IO | I/O power supply | Configurable 1.8 V or 3.3 V domain for GPIO, USB, and peripheral interfaces; isolated from core rail for noise immunity. |
| CLKIN | External clock input | Accepts 20 MHz crystal or LVCMOS clock source for CPG PLL reference; critical for system timing stability and jitter control. |
| RESET# | Active-low reset input | Asynchronous reset assertion clears CPU state, resets peripherals, and forces boot ROM initialization sequence. |
| BOOT[3:0] | Boot mode configuration | Four-pin strap determines boot source (QSPI, SD, USB, or serial) and memory map initialization at power-on. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PowerVR GPU | Enables hardware-accelerated OpenGL ES 3.0 rendering for responsive GUIs without CPU offloading or external graphics ICs. |
| Hardware Video Codec | Reduces host CPU utilization by >90% during 1080p video decode, freeing cycles for application logic and network stack processing. |
| Pin Function Controller (PFC) | Allows dynamic remapping of 300+ I/O signals across shared pins, simplifying board design and enabling single-hardware platform reuse across product variants. |
| TrustZone Security | Supports secure boot, encrypted firmware updates, and isolated execution environments for industrial IoT authentication and data protection. |
| Industrial Temperature Range | Validated operation from −40°C to +85°C ensures reliability in uncontrolled environments such as factory HMIs, digital signage, and vehicle infotainment enclosures. |
Applications
| Industrial HMI Panels | Digital Signage Systems |
|---|---|
Use Scenario: Touch-enabled factory floor operator interface with animated dashboards and real-time machine status visualization. IC Role / Device Role / Timing Role: Primary application processor executing Linux OS, Qt-based UI framework, and EtherCAT master stack with deterministic timing. Use Value: Dual Cortex-A15 cores handle UI rendering and PLC communication simultaneously; PowerVR GPU ensures 60 fps animation without frame drops under full CPU load. | Use Scenario: Commercial kiosk displaying dynamic advertisements, interactive maps, and multilingual content in retail or transit hubs. IC Role / Device Role / Timing Role: Central media processor managing HDMI output, local storage playback, network streaming, and touch input response within <100 ms latency. Use Value: Hardware H.264 decode sustains uninterrupted 1080p@60fps playback while background services remain fully responsive. |
| Automotive Infotainment | Medical Imaging Terminals |
Use Scenario: In-vehicle navigation and entertainment system with voice control, rear-seat video, and smartphone mirroring. IC Role / Device Role / Timing Role: Application SoC running Android Automotive OS, handling audio/video pipelines, CAN gateway logic, and display composition. Use Value: Integrated SATA and USB 2.0 enable direct connection to SSDs and mobile devices; DDR3L interface supports low-power operation during vehicle standby modes. | Use Scenario: Portable ultrasound or X-ray viewing station displaying DICOM images with zoom/pan/rotate functionality and annotation tools. IC Role / Device Role / Timing Role: High-fidelity image processor rendering 4K medical imagery with sub-pixel accuracy and real-time DICOM decoding. Use Value: GPU-accelerated OpenVG 1.1 ensures pixel-perfect vector overlays on grayscale medical images; 1080p encode allows live procedure streaming to PACS servers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R8A774E1HA00BG#G0 | Quad-core Cortex-A15 @ 1.5 GHz, same GPU and video codec, adds PCIe Gen2 x1 and additional USB 3.0 port. | Higher CPU throughput and expanded I/O for multi-display automotive head units or edge AI inference gateways. | Select when >2 CPU cores or PCIe connectivity is required; not pin-compatible due to different ball count (425 vs. 392) and signal mapping. |
| i.MX6Q Sabre Auto (MCIMX6Q-SDB) | NXP quad-core Cortex-A9 @ 1.2 GHz, Vivante GC2000 GPU, no hardware H.264 encode, supports only 1080p decode. | Lower performance ceiling and reduced graphics fidelity; suited for cost-sensitive automotive clusters without video capture. | Choose for legacy NXP ecosystem compatibility or where Linux BSP maturity outweighs raw performance; requires different PCB layout and power delivery design. |
Compared with R8A774E1HA00BG#G0 and i.MX6Q Sabre Auto, the R8A774C0HA01BG#G0 offers optimal balance of dual-core performance, GPU-accelerated UI, and 1080p encode/decode in a compact 392-ball package-ideal for space-constrained industrial HMIs where PCIe or quad-core scaling is unnecessary.
Availability
R8A774C0HA01BG#G0 is available at Aetrix Electronics and suitable for industrial HMI panels, digital signage systems, and automotive infotainment terminals requiring stable component supply, long lifecycle support, and guaranteed industrial temperature operation.
Supply support for R8A774C0HA01BG#G0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise applications.
The RZ/G series-including R8A774C0HA01BG#G0-is designed specifically for Linux-capable embedded systems demanding rich graphics, multimedia processing, and real-time responsiveness in harsh operating environments.
FAQ
What is the maximum supported DDR3L speed for R8A774C0HA01BG#G0?
The R8A774C0HA01BG#G0 supports DDR3L-1066 (533 MHz clock, 1066 MT/s data rate) across its 32-bit memory interface. This delivers up to 8.5 GB/s peak bandwidth, sufficient for dual-display framebuffer allocation and real-time video processing. The memory controller includes programmable timing parameters and on-die termination calibration to ensure signal integrity at full speed.
Does R8A774C0HA01BG#G0 include hardware cryptographic acceleration?
No, the R8A774C0HA01BG#G0 does not integrate dedicated cryptographic accelerators (e.g., AES, SHA, RSA engines). Security relies on software-based implementations or optional external secure elements. However, it supports ARM TrustZone, enabling secure world/normal world isolation for firmware updates, key storage, and authenticated boot using external flash encryption controllers.
What boot sources are supported by R8A774C0HA01BG#G0?
The R8A774C0HA01BG#G0 supports four primary boot sources determined by BOOT[3:0] strap pins: QSPI flash (default), microSD card, USB device mode (for recovery), and serial interface (UART). Boot ROM initializes the CPG, configures essential clocks, and loads the first-stage bootloader (FSBL) into on-chip SRAM before handing control to user firmware.
Is R8A774C0HA01BG#G0 pin-compatible with other RZ/G1 series processors?
No, R8A774C0HA01BG#G0 is not pin-compatible with other RZ/G1 series parts such as R8A7742 or R8A7745. While sharing the same 392-ball FBGA footprint, signal assignments differ significantly across variants due to distinct peripheral sets (e.g., SATA presence/absence, GPU configuration, and I/O multiplexing). PCB redesign is required for migration between RZ/G1 family members.
What thermal management guidance applies to R8A774C0HA01BG#G0?
R8A774C0HA01BG#G0 requires a thermal pad on the underside of the package soldered to a dedicated copper pour on the PCB's inner layers. Renesas recommends ≥400 mm² exposed thermal pad area with ≥6 thermal vias (0.3 mm diameter) connecting to internal ground planes. Junction-to-board thermal resistance (θJB) is 4.5°C/W; ambient temperature must remain ≤85°C with proper airflow or heatsink attachment for sustained 1.5 GHz operation.
R8A774C0HA01BG#G0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 552-FBGA
- Series:
- RZ/G2E
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53
- Number of Cores/Bus Width:
- 2 Core, 64-Bit
- Speed:
- 1.2GHz
- Co-Processors/DSP:
- Multimedia; NEON™ MPE
- RAM Controllers:
- DDR3L
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- MIPI-CSI
- Ethernet:
- 10/100Mbps (1), 100/1000Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 (1), USB 3.0 (1)
- Voltage - I/O:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 552-FBGA (21x21)
- Additional Interfaces:
- CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
R8A774C0HA01BG#G0 FAQ
1.How can I place an order for R8A774C0HA01BG#G0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R8A774C0HA01BG#G0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R8A774C0HA01BG#G0 reliable?
The price and inventory of R8A774C0HA01BG#G0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R8A774C0HA01BG#G0 is usually 5 days.
3.What payment methods are accepted for R8A774C0HA01BG#G0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R8A774C0HA01BG#G0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R8A774C0HA01BG#G0?
R8A774C0HA01BG#G0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R8A774C0HA01BG#G0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R8A774C0HA01BG#G0?
For technical support, including R8A774C0HA01BG#G0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R8A774C0HA01BG#G0 requirements.
6.How does Aetrix verify that R8A774C0HA01BG#G0 is sourced from the original manufacturer or authorized distributors?
All R8A774C0HA01BG#G0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R8A774C0HA01BG#G0 meets industry standards.
7.What is the process for return or replacement of R8A774C0HA01BG#G0?
All R8A774C0HA01BG#G0 units undergo pre-shipment inspection (PSI). If there is an issue with R8A774C0HA01BG#G0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R8A774C0HA01BG#G0 part is unused and in its original packaging.
Return procedure for R8A774C0HA01BG#G0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R8A774C0HA01BG#G0 Tags
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