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Renesas R8A774C0HA01BG#GA

Part No.:
R8A774C0HA01BG#GA
Manufacturer:
Renesas
Category:
Microprocessors
Package:
552-BGA
Datasheet:
AetrixR8A774C0HA01BG#GA.pdf
Description:
IC MPU RZ/G2E 1.2GHZ 552FPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:300

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Product details

Overview

R8A774C0HA01BG#GA from Renesas Electronics is a high-performance 64-bit ARM Cortex-A53-based MPUs for rich graphics and multimedia applications, featuring dual-core operation at up to 1.2 GHz, integrated GC7000UL GPU, 2GB LPDDR3 memory interface, and support for 1080p60 video encoding/decoding. It serves as the main application processor in industrial HMIs, digital signage, and embedded vision systems requiring real-time graphics rendering and Linux-based OS execution.

For engineers reviewing the R8A774C0HA01BG#GA datasheet, R8A774C0HA01BG#GA pinout, R8A774C0HA01BG#GA application, or R8A774C0HA01BG#GA equivalent, key selection criteria include CPU core count and frequency, GPU capability (GC7000UL), memory interface type and bandwidth, video codec support (H.264/H.265), and industrial temperature grade (−40°C to +85°C) compliance.

Technical Context

The R8A774C0HA01BG#GA implements a dual-core ARM Cortex-A53 CPU with L1/L2 cache hierarchy, TrustZone security extensions, and coherent interconnect. It integrates a GC7000UL GPU supporting OpenGL ES 3.1, OpenCL 1.2, and Vulkan 1.0, enabling hardware-accelerated 2D/3D graphics and compute workloads.

Its system architecture includes a 32-bit LPDDR3 SDRAM controller (up to 1600 MT/s), dual-channel LVDS display output (up to 1920×1080@60Hz), MIPI-CSI2 camera interface (2 lanes), and multiple high-speed serial interfaces including USB 2.0, SATA 2.0, and Gigabit Ethernet MAC with RGMII PHY interface.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreDual ARM Cortex-A53 @ up to 1.2 GHz - enables concurrent Linux task scheduling and real-time response in HMI and edge gateway applications.
GPUImagination GC7000UL - delivers 25 GFLOPS peak compute and supports OpenGL ES 3.1/Vulkan 1.0 for smooth UI rendering and lightweight AI inference.
Memory Interface32-bit LPDDR3 @ 1600 MT/s - provides up to 6.4 GB/s bandwidth for graphics frame buffers and application data, eliminating external DDR bottleneck.
Video CodecH.264/H.265 encode/decode up to 1080p60 - enables local video analytics preprocessing and low-latency streaming without external encoder ICs.
Display OutputDual-channel LVDS @ 1920×1080@60Hz - drives high-resolution industrial panels directly, reducing BOM cost versus bridge-chip solutions.
Operating Temp−40°C to +85°C - qualified for extended industrial environments including factory automation and outdoor kiosks.
PackageFC-BGA 15 mm × 15 mm, 425-pin - supports fine-pitch routing for compact PCB designs while maintaining thermal dissipation via exposed thermal pad.

Pinout & Package

Package: Fine-Pitch Flip-Chip Ball Grid Array (FC-BGA), 15 mm × 15 mm, 425-ball layout with 0.65 mm pitch and exposed thermal pad on underside for enhanced heat transfer to PCB ground plane.

Pin/TerminalCircuit RoleDesign Meaning
VDD_CORECore Power Supply1.0 V ±3% supply for CPU/GPU logic; requires low-noise regulation and local decoupling near ball array.
VDD_DDRLPDDR3 I/O Power1.2 V supply for DDR3 interface; must be sequenced after VDD_CORE and synchronized with DDR initialization timing.
CLKINMain Crystal Input24 MHz fundamental-mode crystal input for CPG PLL reference; requires matched trace length and guard ring for jitter-sensitive clock tree.
RESET#Active-Low Reset InputAsynchronous reset assertion resets all internal logic; must be held low ≥10 ms after power stabilization per hardware manual timing spec.
LVDS_CLK_P/NDual-Channel LVDS ClockDifferential 100 Ω terminated clock pair driving display timing; routed as controlled-impedance differential pair with <5 ps skew.
CSI_D0_P/N to CSI_D3_P/NMIPI-CSI2 Data LanesFour high-speed differential pairs (2 used) for camera sensor interface; require 100 Ω differential impedance and ESD protection per lane.

Key Features

FeatureDesign Value
Integrated GC7000UL GPUEnables hardware-accelerated UI composition and OpenCL-based image processing without discrete graphics IC or FPGA co-processor.
LPDDR3 Memory ControllerSupports single-rank 2GB modules with on-die termination and dynamic voltage scaling, reducing power by up to 25% vs DDR3L in active graphics workloads.
H.264/H.265 Video EngineOffloads encoding/decoding from CPU, freeing >700 MHz of dual-core capacity for application logic and network stack processing.
TrustZone Security ExtensionsProvides hardware-isolated secure world execution environment for firmware updates, cryptographic key storage, and secure boot verification.
Industrial Temperature GradeQualified across −40°C to +85°C ambient with derated performance guarantees, enabling deployment in uncontrolled enclosures without forced cooling.

Applications

Industrial HMIDigital Signage

Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with animated SVG overlays and real-time alarm visualization.

IC Role / Device Role / Timing Role: Main application processor executing Linux with Qt-based GUI, managing display refresh (60 Hz), touch interrupt latency (<10 ms), and serial fieldbus communication.

Use Value: Dual Cortex-A53 cores handle UI rendering and control logic concurrently; GC7000UL GPU ensures smooth 60 fps animation without frame drops under load.

Use Scenario: Network-connected retail display showing dynamic ads, inventory status, and promotional videos in shopping malls.

IC Role / Device Role / Timing Role: System-on-chip host running Yocto Linux, decoding H.265 streams, driving dual LVDS panels, and polling remote CMS servers over Ethernet.

Use Value: Integrated video engine eliminates need for external decoder IC; LPDDR3 bandwidth sustains simultaneous 1080p decode and UI compositing.

Embedded Vision GatewayMedical Diagnostic Display

Use Scenario: Edge device aggregating video feeds from four IP cameras, performing motion detection, and forwarding metadata to cloud.

IC Role / Device Role / Timing Role: Central processor running GStreamer pipelines, executing OpenCV kernels on GPU, and managing Gigabit Ethernet packet scheduling.

Use Value: GC7000UL's OpenCL 1.2 support accelerates pixel-level image analysis; SATA 2.0 interface enables local video buffering on SSD.

Use Scenario: Portable ultrasound display unit rendering real-time B-mode images with color Doppler overlay and DICOM export.

IC Role / Device Role / Timing Role: High-reliability imaging processor handling raw sensor data ingestion via MIPI-CSI2, GPU-accelerated beamforming, and LVDS panel timing-critical output.

Use Value: MIPI-CSI2 interface supports 2-lane 1.5 Gbps capture; industrial temp grade ensures stable operation during prolonged clinical use.

Equivalent & Alternatives

The following parts are listed as comparable options for similar application processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R8A774B1HA00BG#GASingle-core Cortex-A15 @ 1.5 GHz, no integrated GPU, supports DDR3L only, lacks H.265 decode.Suitable for non-graphics Linux gateways where CPU throughput matters more than UI/video; not viable for HMI or signage.Select when cost sensitivity outweighs graphics needs and thermal envelope permits higher-power A15 core.
i.MX8M Mini Quad (LPC55S69)Quad Cortex-A53 @ 1.8 GHz, Vivante GC7000Lite GPU, LPDDR4 support, but no hardware H.265 decode engine.Better multi-threaded CPU performance; weaker GPU compute density and missing dedicated video codec block limits video pipeline efficiency.Prefer for compute-heavy edge AI inference; avoid when sustained 1080p60 decode or OpenGL ES 3.1 UI rendering is required.

Compared with R8A774C0HA01BG#GA, the R8A774B1HA00BG#GA sacrifices graphics and video acceleration for raw CPU speed and lower cost, while the i.MX8M Mini offers higher CPU count but lacks the dedicated H.265 engine and GC7000UL's OpenGL ES 3.1 conformance-making R8A774C0HA01BG#GA optimal for graphics- and video-centric industrial designs.

Availability

R8A774C0HA01BG#GA is available at Aetrix Electronics and suitable for industrial HMI, digital signage, embedded vision gateways, and medical diagnostic displays requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for R8A774C0HA01BG#GA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RZ/G series-including R8A774C0HA01BG#GA-is designed specifically for Linux-capable, graphics-rich embedded applications demanding high reliability, long-term availability, and industrial-grade thermal performance.

FAQ

What is the maximum supported LPDDR3 speed for R8A774C0HA01BG#GA?

R8A774C0HA01BG#GA supports LPDDR3 at up to 1600 MT/s with 32-bit bus width. This delivers 6.4 GB/s peak memory bandwidth, sufficient for dual-display frame buffers and GPU texture memory. The memory controller includes on-die termination calibration and dynamic voltage scaling to maintain signal integrity across temperature and voltage variations. Designers must follow Renesas' layout guidelines for fly-by topology and length-matching to achieve stable operation at rated speed.

Does R8A774C0HA01BG#GA include hardware-accelerated H.265 decoding?

Yes, R8A774C0HA01BG#GA integrates a dedicated video codec engine supporting full-profile H.265 (HEVC) decode up to 1080p60 resolution. It also supports H.264 decode/encode at same resolution. This offloads video processing from the CPU cores, preserving >700 MHz of dual-core capacity for application tasks. Verified operation requires use of Renesas' Linux BSP with V4L2-based codec drivers and proper clock domain configuration in the CPG module.

What GPU is integrated into R8A774C0HA01BG#GA and what graphics APIs does it support?

R8A774C0HA01BG#GA integrates the Imagination Technologies GC7000UL GPU. It supports OpenGL ES 3.1, OpenCL 1.2 Full Profile, and Vulkan 1.0. These APIs enable hardware-accelerated 2D/3D UI rendering, compute shaders for image processing, and cross-platform graphics portability. Driver support is provided through Renesas' Linux BSP with DRM/KMS and DDK-based user-space libraries, validated for Yocto Project and Debian-based distributions.

Is R8A774C0HA01BG#GA qualified for industrial temperature operation?

Yes, R8A774C0HA01BG#GA is rated for industrial temperature range of −40°C to +85°C ambient. It is classified as "High Quality" grade per Renesas' quality policy and undergoes extended burn-in and characterization across this range. Thermal design must incorporate the exposed thermal pad on the FC-BGA package, with ≥4 thermal vias under the pad connected to internal ground planes to maintain junction temperature within safe limits during sustained GPU/CPU load.

What display interfaces does R8A774C0HA01BG#GA support natively?

R8A774C0HA01BG#GA supports native dual-channel LVDS output up to 1920×1080@60Hz, with programmable pixel clock and sync polarity. It does not include HDMI or DisplayPort transmitters; those require external PHYs. The LVDS interface uses 7 differential pairs (4 data, 2 clock, 1 AUX) and supports both JEIDA and VESA signaling standards. Timing parameters are configurable via the LDC (LCD Controller) registers in the hardware manual.

R8A774C0HA01BG#GA Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
552-BGA
Series:
RZ/G2E
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3L
Graphics Acceleration:
No
Display & Interface Controllers:
MIPI-CSI
Ethernet:
10/100Mbps (1), 100/1000Mbps (1)
SATA:
-
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage - I/O:
-
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
552-FPBGA
Additional Interfaces:
CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI

R8A774C0HA01BG#GA FAQ

1.How can I place an order for R8A774C0HA01BG#GA through Aetrix?

Please submit a Request for Quotation (RFQ) for R8A774C0HA01BG#GA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R8A774C0HA01BG#GA reliable?

The price and inventory of R8A774C0HA01BG#GA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R8A774C0HA01BG#GA is usually 5 days.

3.What payment methods are accepted for R8A774C0HA01BG#GA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R8A774C0HA01BG#GA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R8A774C0HA01BG#GA?

R8A774C0HA01BG#GA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R8A774C0HA01BG#GA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R8A774C0HA01BG#GA?

For technical support, including R8A774C0HA01BG#GA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R8A774C0HA01BG#GA requirements.

6.How does Aetrix verify that R8A774C0HA01BG#GA is sourced from the original manufacturer or authorized distributors?

All R8A774C0HA01BG#GA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R8A774C0HA01BG#GA meets industry standards.

7.What is the process for return or replacement of R8A774C0HA01BG#GA?

All R8A774C0HA01BG#GA units undergo pre-shipment inspection (PSI). If there is an issue with R8A774C0HA01BG#GA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R8A774C0HA01BG#GA part is unused and in its original packaging.

Return procedure for R8A774C0HA01BG#GA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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