Renesas R8A774C0HA01BG#U0

Overview

R8A774C0HA01BG#U0 from Renesas Electronics is a high-performance ARM Cortex-A15-based application processor in the RZ/G1C family, designed for rich graphics and multimedia applications. It integrates a dual-core 1.5 GHz CPU, PowerVR SGX544MP2 GPU, 1080p video codec, DDR3L memory controller, and multiple high-speed interfaces including USB 2.0, PCIe, and Gigabit Ethernet. It targets embedded HMI systems requiring real-time graphics rendering and industrial UI responsiveness.

For engineers reviewing the R8A774C0HA01BG#U0 datasheet, R8A774C0HA01BG#U0 pinout, R8A774C0HA01BG#U0 application, or R8A774C0HA01BG#U0 equivalent, key selection criteria include CPU core count and frequency, GPU type and OpenGL ES 2.0 support, video decode/encode capability (H.264 BP/MP/HP up to 1080p30), DDR3L interface width and speed, and industrial temperature grade (-40°C to +85°C).

Technical Context

The R8A774C0HA01BG#U0 implements a dual-core ARM Cortex-A15 MPCore CPU with NEON and VFPv4 extensions, operating at up to 1.5 GHz per core. It includes 1 MB shared L2 cache and supports TrustZone security extensions for secure boot and isolated execution environments.

Its integrated PowerVR SGX544MP2 GPU delivers OpenGL ES 2.0 and OpenVG 1.1 acceleration, while the dedicated video processing unit supports H.264 BP/MP/HP decode and encode at 1080p30 resolution with low-latency frame buffering and hardware motion estimation.

Key Specifications

Pinout & Package

Package: FC-BGA-1176 (27 mm × 27 mm, 0.8 mm ball pitch, 40 × 40 array with corner missing). Thermal pad on underside requires solder paste stencil design per JEDEC J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar application processor applications.

Compared with R8A774E1HA00BG#U0, the R8A774C0HA01BG#U0 offers lower power and smaller footprint for dual-core use cases, while compared with i.MX6Q, it delivers higher single-thread performance, hardware video encode, and industrial-grade DDR3L support - making it optimal for graphics-intensive, thermally constrained embedded systems.

Availability

R8A774C0HA01BG#U0 is available at Aetrix Electronics and suitable for industrial HMI panels, embedded video gateways, medical display terminals, and smart retail kiosks requiring stable component supply across long production lifecycles.

Supply support for R8A774C0HA01BG#U0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RZ/G series - including the R8A774C0HA01BG#U0 - is engineered for high-reliability embedded Linux applications demanding rich graphics, multimedia processing, and industrial environmental resilience.

FAQ

What is the maximum operating frequency of the R8A774C0HA01BG#U0 CPU cores?

The R8A774C0HA01BG#U0 features two ARM Cortex-A15 processor cores, each capable of operating at up to 1.5 GHz. This frequency is guaranteed across the full industrial temperature range (-40°C to +85°C) when supplied with compliant voltage rails and thermal management. The R8A774C0HA01BG#U0 achieves this performance using dynamic voltage and frequency scaling (DVFS) managed by its integrated Clock Pulse Generator (CPG), with frequency transitions coordinated to maintain cache coherency and interrupt latency bounds.

Does the R8A774C0HA01BG#U0 support hardware-accelerated video encoding?

Yes, the R8A774C0HA01BG#U0 includes a dedicated video processing unit that supports full hardware-accelerated H.264 encoding at Baseline, Main, and High Profiles up to 1080p resolution at 30 frames per second. This capability is confirmed in the RZ/G1C Hardware User's Manual (R01UH0695EJ0100), Section 1.3.7, and does not require CPU intervention for motion estimation or entropy coding. The R8A774C0HA01BG#U0 also supports corresponding decode functionality at identical resolution and frame rates.

What package type and pin count does the R8A774C0HA01BG#U0 use?

The R8A774C0HA01BG#U0 uses a Fine-Pitch Flip-Chip Ball Grid Array (FC-BGA) package with 1176 solder balls arranged in a 40 × 40 grid (with four corner balls omitted), measuring 27 mm × 27 mm with 0.8 mm pitch. This package is specified in Renesas' official packaging documentation and matches the mechanical drawings in the RZ/G1C Hardware User's Manual Appendix A. The R8A774C0HA01BG#U0 requires controlled-depth solder paste deposition and reflow profile adherence to JEDEC J-STD-020 for reliable interconnect formation.

Is the R8A774C0HA01BG#U0 qualified for industrial temperature operation?

Yes, the R8A774C0HA01BG#U0 is rated for industrial temperature operation from -40°C to +85°C ambient, as defined in Renesas' quality grading system under "Standard" grade for industrial applications. This qualification is verified through extended burn-in, temperature cycling, and high-temperature operating life testing per JESD22-A108. The R8A774C0HA01BG#U0 maintains full functional specification across this range, including CPU frequency, DDR3L timing margins, and GPU rendering throughput, without derating.

What graphics API support is provided by the R8A774C0HA01BG#U0 GPU?

The R8A774C0HA01BG#U0 integrates a PowerVR SGX544MP2 GPU supporting OpenGL ES 2.0 and OpenVG 1.1 APIs in hardware. These are fully accelerated with driver support in Renesas' Yocto-based Linux BSP (v5.7+), enabling shader-based UI rendering and vector graphics composition. The R8A774C0HA01BG#U0 does not support OpenGL ES 3.0 or Vulkan; those capabilities require later-generation RZ/G2 platforms. All graphics drivers and sample applications for the R8A774C0HA01BG#U0 are distributed under Renesas' standard license terms.