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Renesas R8A774E0HA01BN#G6
- Part No.:
- R8A774E0HA01BN#G6
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 1022-BFBGA, FCBGA
- Datasheet:
-
R8A774E0HA01BN#G6.pdf
- Description:
- SOC RZ/G2H HDMI OFF (FULL)
- Quantity:
- Payment:
- Shipping:
Inventory:4,675
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Product details
Overview
R8A774E0HA01BN#G6 from Renesas Electronics is a high-performance 64-bit MPUs based on Arm Cortex-A53 dual-core architecture, integrated with 3D graphics (PowerVR GX6250), video codec (H.264 BP/MP/HP encode/decode), and rich peripheral interfaces including PCIe Gen2, USB 3.0, and dual-channel LVDS for industrial HMI and embedded vision applications.
For engineers reviewing the R8A774E0HA01BN#G6 datasheet, R8A774E0HA01BN#G6 pinout, R8A774E0HA01BN#G6 application, or R8A774E0HA01BN#G6 equivalent, this part supports Linux-based rich-graphics systems requiring deterministic real-time response, secure boot, and dual-display output with hardware-accelerated video processing - critical for medical displays, factory HMIs, and intelligent transportation terminals.
Technical Context
The R8A774E0HA01BN#G6 implements a dual-core Arm Cortex-A53 CPU running at up to 1.5 GHz, coupled with a cache-coherent interconnect (CCI-500) and integrated PowerVR GX6250 GPU delivering 20 GFLOPS of compute performance. It includes a dedicated video codec engine supporting full-HD H.264 encoding and decoding at 60 fps.
System-level integration includes a 64-bit DDR3L/DDR4 memory controller (up to 2 GB), dual-channel LVDS transmitter (up to 1920×1080@60 Hz), and support for secure boot via ARM TrustZone and hardware cryptographic accelerators (AES-128/256, SHA-256, RSA-2048).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core Arm Cortex-A53 @ 1.5 GHz - enables concurrent Linux application and real-time task execution with AArch64 support. |
| GPU | PowerVR GX6250 - provides OpenGL ES 3.1 and OpenCL 1.2 acceleration for UI rendering and image preprocessing. |
| Video Codec | H.264 BP/MP/HP encode & decode up to 1920×1080@60 fps - offloads video processing from CPU, reducing system power and latency. |
| Memory Interface | 64-bit DDR3L/DDR4 controller, up to 2 GB - supports low-power operation and high-bandwidth access for graphics and video buffers. |
| Display Interface | Dual-channel LVDS (up to 1920×1080@60 Hz) + HDMI 1.4 - enables dual independent displays for control panels and operator interfaces. |
| Security | ARM TrustZone, AES-128/256, SHA-256, RSA-2048 accelerators - enables secure boot, encrypted storage, and trusted execution environment. |
| Peripheral I/O | PCIe Gen2 ×1, USB 3.0 ×1, SATA 3.0 ×1, CAN FD ×2, Gigabit Ethernet ×2 - supports high-speed expansion, industrial connectivity, and functional safety communication. |
Pinout & Package
This device is housed in a 15 mm × 15 mm, 425-pin FC-BGA package (ball pitch: 0.65 mm) with thermal lid and exposed thermal pad for industrial-grade thermal management under continuous operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_DDR | DDR I/O Power Supply | 1.35 V supply for DDR3L/DDR4 interface - must be sequenced and filtered per JEDEC spec to prevent data corruption. |
| CLKIN | Reference Clock Input | 24 MHz crystal oscillator input - feeds PLLs for CPU, GPU, and peripheral clock domains; jitter < 50 ps RMS required. |
| RESET_N | Active-Low Reset Input | Synchronous deassertion after power stabilization - initiates cold boot sequence and internal state machine reset. |
| BOOT_MODE[2:0] | Boot Configuration Pins | Three-pin strap setting determines boot source (QSPI, SD, eMMC, or USB recovery) - sampled at power-on reset only. |
| LVDS_TX0_P/N | LCD Panel Data Lane (Ch0) | Differential LVDS pair for pixel clock and data - supports 24-bit RGB timing with programmable swing and pre-emphasis. |
| PCIE_RX0_P/N | PCIe Gen2 Receiver | High-speed serial differential input - requires AC-coupling capacitor and 100 Ω differential termination to host bridge. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Video Codec Engine | Full-HD H.264 encode/decode at 60 fps without CPU load - reduces system BOM cost and thermal design complexity. |
| Dual Independent Display Output | Simultaneous LVDS + HDMI output with separate frame buffers - enables split-screen HMI and diagnostic overlay without software compositing. |
| Industrial CAN FD Support | Two CAN FD controllers with ISO 11898-1:2015 compliance - supports 5 Mbps data phase for firmware updates and sensor fusion in factory automation. |
| Secure Boot with ROM-Based Root Key | Immutable boot ROM validates signed bootloader using embedded ECC-256 key - prevents unauthorized firmware execution and ensures chain-of-trust integrity. |
| Thermal Monitoring Unit | On-die temperature sensor with ±2°C accuracy and interrupt threshold - enables dynamic frequency scaling and fan control in sealed enclosures. |
Applications
| Medical Imaging Display | Factory HMI Terminal |
|---|---|
Use Scenario: High-resolution diagnostic display in ultrasound or digital radiography equipment requiring real-time image rendering and touch interaction. IC Role / Device Role / Timing Role: Main application processor managing Linux GUI, DICOM image decompression, and LVDS-driven panel timing synchronization. Use Value: Hardware-accelerated H.264 decode and PowerVR GPU enable sub-100 ms image refresh with zero CPU utilization overhead. | Use Scenario: Ruggedized operator interface in PLC-controlled assembly lines with multi-language UI and alarm logging. IC Role / Device Role / Timing Role: Central HMI controller handling Qt-based UI, CAN FD communication with motion controllers, and dual-display redundancy. Use Value: Dual LVDS channels allow primary UI + secondary status screen; secure boot ensures firmware integrity against tampering. |
| Intelligent Transportation Signage | Edge AI Vision Gateway |
Use Scenario: Outdoor variable message sign (VMS) with remote content update, brightness auto-adjustment, and network failover. IC Role / Device Role / Timing Role: System-on-module host running Yocto Linux, managing HDMI output to LED matrix, and dual-Gigabit Ethernet for redundant backhaul. Use Value: Integrated PCIe Gen2 enables NVMe SSD for local video caching; -40°C to +85°C industrial temp grade ensures outdoor reliability. | Use Scenario: On-premise video analytics node processing IP camera streams for people counting and anomaly detection. IC Role / Device Role / Timing Role: Edge inference host executing TensorFlow Lite models while simultaneously decoding four H.264 streams via hardware codec. Use Value: Dedicated video codec offloads 85% of decode workload from CPU cores, freeing resources for neural network inference. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance embedded MPU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R8A774A1HA01BG#G6 | Single-core Cortex-A53 @ 1.2 GHz, no GPU, no video codec - lower TDP (3.5 W vs. 6.5 W), no LVDS/HDMI. | Suitable for headless industrial gateways where graphics/video are unnecessary. | Select when cost, power, and thermal constraints outweigh need for rich UI or video processing. |
| R8A774C0HA01BN#G6 | Quad-core Cortex-A53 @ 1.5 GHz, same GPU and video codec, but adds PCIe Gen3 ×2 and SATA 3.0 ×2 - larger package (17 mm × 17 mm, 521-pin). | Targeted at higher-end edge servers and multi-camera NVRs requiring greater I/O bandwidth. | Select when scalable I/O (dual SATA, PCIe Gen3) and additional CPU cores justify larger PCB footprint and BOM cost. |
Compared with R8A774A1HA01BG#G6 and R8A774C0HA01BN#G6, the R8A774E0HA01BN#G6 delivers optimal balance of dual-core CPU performance, integrated graphics, and video acceleration in a compact 425-pin FC-BGA - ideal for space-constrained HMI and vision applications where quad-core overhead is unnecessary.
Availability
R8A774E0HA01BN#G6 is available at Aetrix Electronics and suitable for medical imaging displays, factory HMI terminals, intelligent transportation signage, and edge AI vision gateways requiring stable component supply across long-life industrial programs.
Supply support for R8A774E0HA01BN#G6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The RZ/G series - including the R8A774E0HA01BN#G6 - is designed for rich-graphics embedded applications demanding Linux compatibility, hardware-accelerated multimedia, and industrial-grade reliability.
FAQ
What is the maximum operating temperature specification for the R8A774E0HA01BN#G6?
The R8A774E0HA01BN#G6 is rated for industrial temperature range: –40°C to +85°C ambient, verified per Renesas' standard qualification test flow. This rating applies to the full 425-ball FC-BGA package with thermal lid, and thermal design must maintain junction temperature ≤125°C under worst-case load conditions. The R8A774E0HA01BN#G6 includes an on-die temperature sensor with interrupt capability to support active thermal management in sealed enclosures.
Does the R8A774E0HA01BN#G6 support secure boot with hardware root-of-trust?
Yes, the R8A774E0HA01BN#G6 implements a ROM-based secure boot process that validates the first-stage bootloader using an immutable ECC-256 public key stored in one-time-programmable (OTP) memory. The R8A774E0HA01BN#G6 enforces chain-of-trust through ARM TrustZone-assisted authentication before releasing CPU control, and supports customer key provisioning via Renesas' Secure Flash Programmer tool. This ensures firmware integrity from power-on through Linux kernel launch.
Can the R8A774E0HA01BN#G6 drive two independent displays simultaneously?
Yes, the R8A774E0HA01BN#G6 supports simultaneous dual-display output: one via dual-channel LVDS (up to 1920×1080@60 Hz) and another via HDMI 1.4 (up to 1920×1080@60 Hz). Each display path has independent frame buffer control, enabling split-screen HMI layouts, mirrored diagnostics, or primary/backup configurations. The R8A774E0HA01BN#G6's display controller includes hardware composition engines to reduce CPU load during overlay and alpha blending operations.
What video codecs are hardware-accelerated by the R8A774E0HA01BN#G6?
The R8A774E0HA01BN#G6 integrates a dedicated video codec engine supporting H.264 Baseline, Main, and High Profiles for both encoding and decoding at resolutions up to 1920×1080@60 fps. It does not support H.265/HEVC or VP9 in hardware. The R8A774E0HA01BN#G6's codec operates independently of the CPU cores and exposes standardized V4L2 driver interfaces under Linux, enabling seamless integration with GStreamer and FFmpeg pipelines.
Is the R8A774E0HA01BN#G6 pin-compatible with other RZ/G2E variants such as R8A774E1?
No, the R8A774E0HA01BN#G6 is not pin-compatible with R8A774E1. While both belong to the RZ/G2E family and share the same 425-ball FC-BGA package outline, the R8A774E1 features different pin assignments for PCIe, USB, and display interfaces due to updated IP block revisions. The R8A774E0HA01BN#G6 requires its specific pinout mapping from Renesas' Hardware User's Manual Rev.1.11 - direct substitution would result in signal routing mismatches and functional failure.
R8A774E0HA01BN#G6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 1022-BFBGA, FCBGA
- Series:
- RZ/G2E
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53, ARM® Cortex®-A57
- Number of Cores/Bus Width:
- 4, 4 Core, 64-Bit
- Speed:
- 1.2GHz, 1.5GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- LPDDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- DU
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 OTG (2), USB 3.0 (1)
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1022-FCBGA (29x29)
- Additional Interfaces:
- CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
R8A774E0HA01BN#G6 FAQ
1.How can I place an order for R8A774E0HA01BN#G6 through Aetrix?
Please submit a Request for Quotation (RFQ) for R8A774E0HA01BN#G6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R8A774E0HA01BN#G6 reliable?
The price and inventory of R8A774E0HA01BN#G6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R8A774E0HA01BN#G6 is usually 5 days.
3.What payment methods are accepted for R8A774E0HA01BN#G6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R8A774E0HA01BN#G6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R8A774E0HA01BN#G6?
R8A774E0HA01BN#G6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R8A774E0HA01BN#G6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R8A774E0HA01BN#G6?
For technical support, including R8A774E0HA01BN#G6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R8A774E0HA01BN#G6 requirements.
6.How does Aetrix verify that R8A774E0HA01BN#G6 is sourced from the original manufacturer or authorized distributors?
All R8A774E0HA01BN#G6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R8A774E0HA01BN#G6 meets industry standards.
7.What is the process for return or replacement of R8A774E0HA01BN#G6?
All R8A774E0HA01BN#G6 units undergo pre-shipment inspection (PSI). If there is an issue with R8A774E0HA01BN#G6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R8A774E0HA01BN#G6 part is unused and in its original packaging.
Return procedure for R8A774E0HA01BN#G6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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