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Renesas R8A774E0HA01BN#U6
- Part No.:
- R8A774E0HA01BN#U6
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 1022-BFBGA, FCBGA
- Datasheet:
-
R8A774E0HA01BN#U6.pdf
- Description:
- SOC RZ/G2H HDMI OFF (BULK)
- Quantity:
- Payment:
- Shipping:
Inventory:2,159
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Product details
Overview
R8A774E0HA01BN#U6 from Renesas Electronics is a high-performance 64-bit MPUs based on Arm Cortex-A53 dual-core architecture, integrated with 3D graphics (PowerVR GX6250), video codec (H.264 BP/MP/HP decode & encode), and rich peripheral interfaces including PCIe Gen2, USB 3.0, HDMI 1.4, and dual-channel LVDS for industrial HMI and embedded vision applications.
For engineers reviewing the R8A774E0HA01BN#U6 datasheet, R8A774E0HA01BN#U6 pinout, R8A774E0HA01BN#U6 application, or R8A774E0HA01BN#U6 equivalent, this part supports AArch64 execution state, 1MB L2 cache, DDR3L/DDR4 memory interface, and meets industrial temperature grade (−40°C to +85°C) with BGA-1176 package - critical for deterministic multimedia processing in edge gateways and human-machine interface systems.
Technical Context
The R8A774E0HA01BN#U6 implements a dual-core Arm Cortex-A53 CPU cluster with coherent CCI-500 interconnect, supporting symmetric multiprocessing (SMP) and virtualization extensions (ARMv8-A). It integrates a dedicated PowerVR GX6250 GPU capable of 20 GFLOPS and hardware-accelerated video processing up to 1080p60.
Its system architecture includes dual-channel 32-bit DDR3L/DDR4 memory controller (up to 1600 MT/s), AXI/AHB/APB bus hierarchy, and real-time domain separation via RZ/G2E-specific power domains and reset control logic - enabling concurrent OS operation (e.g., Linux on A53 + RTOS on optional Cortex-R7 companion chip).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A53 @ up to 1.5 GHz - enables Linux-based application stacks with real-time responsiveness for industrial UIs. |
| L2 Cache | 1 MB unified L2 cache - reduces memory latency for multi-threaded GUI rendering and video playback. |
| Graphics Engine | PowerVR GX6250 GPU - delivers OpenGL ES 3.1 and OpenVG 1.1 acceleration for smooth 1080p UI compositing. |
| Video Codec | H.264 BP/MP/HP decode & encode up to 1080p60 - supports local video analytics preprocessing without external ASIC. |
| Memory Interface | DDR3L/DDR4, dual-channel 32-bit, up to 1600 MT/s - provides ≥25.6 GB/s bandwidth for simultaneous display, video, and application workloads. |
| Package | 1176-pin FC-BGA (27 mm × 27 mm, 0.8 mm pitch) - supports high I/O count and thermal dissipation for fanless industrial enclosures. |
| Operating Temp | −40°C to +85°C - qualified for uncontrolled industrial environments per Renesas "Standard" quality grade. |
Pinout & Package
Package: 1176-pin Fine-Pitch Ball Grid Array (FC-BGA), 27 mm × 27 mm, 0.8 mm ball pitch, RoHS-compliant, lead-free, moisture sensitivity level (MSL) 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_DDR | DDR I/O power supply | 1.2 V or 1.35 V supply for DDR3L/DDR4 interface - requires low-noise regulation and tight voltage tolerance (±3%). |
| CLKIN | Main system clock input | Accepts 20–40 MHz crystal or LVCMOS clock source - feeds PLLs for CPU, memory, and peripheral domain clocks. |
| RESET_N | Active-low asynchronous reset | Resets all internal logic and releases boot sequence - must be held low ≥10 ms after stable VDD and CLKIN. |
| BOOT_MODE[3:0] | Boot configuration pins | Defines boot device priority (e.g., QSPI, SD, eMMC) - sampled at power-on reset and latched internally. |
| LVDS_CLK_P/N | Dual-channel LVDS clock pair | Drives 1080p60 display timing - differential signaling minimizes EMI and supports long cable runs in HMI panels. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware Virtualization Support | ARMv8-A virtualization extensions enable secure containerized Linux deployments with hypervisor isolation for safety-critical UI layers. |
| Dual LVDS Display Interface | Supports two independent 1080p displays - eliminates need for external TCON or bridge ICs in dual-screen HMIs. |
| PCIe Gen2 x2 Root Complex | Enables direct attachment of FPGA accelerators or NVMe storage - bypasses USB/SATA bottlenecks in edge AI inference nodes. |
| USB 3.0 Host + PHY | Full-speed USB 3.0 host controller with integrated PHY - supports high-bandwidth peripherals like UVC cameras without hub latency. |
| HDMI 1.4 Transmitter | Integrated HDMI TX with CEC and HDCP 1.4 - allows direct connection to monitors and digital signage without level-shifting or retimers. |
Applications
| Industrial HMI Panel | Embedded Vision Gateway |
|---|---|
Use Scenario: Fanless 10-inch touchscreen panel in factory automation with real-time alarm overlay and recipe management. IC Role / Device Role / Timing Role: Main application processor executing Qt-based GUI, video playback, and EtherCAT master stack. Use Value: Dual Cortex-A53 cores handle UI rendering and background PLC communication concurrently; LVDS interface drives native resolution without frame buffer overhead. | Use Scenario: Edge gateway aggregating data from 4K machine vision cameras and forwarding metadata to cloud via LTE. IC Role / Device Role / Timing Role: Central multimedia SoC performing H.264 encoding, metadata extraction, and secure TLS offload. Use Value: Integrated video encoder processes 1080p60 streams at ≤1.2 W; PCIe Gen2 connects FPGA for custom image prefiltering before CPU ingestion. |
| Digital Signage Controller | Medical Display Terminal |
Use Scenario: Wall-mounted kiosk displaying dynamic content with scheduled updates and remote diagnostics. IC Role / Device Role / Timing Role: Primary media processor managing HDMI output, network updates, and touch input handling. Use Value: HDMI 1.4 transmitter supports 1080p60 with CEC for remote power control; PowerVR GPU ensures smooth 60 fps transitions between full-screen ads. | Use Scenario: Diagnostic imaging console showing DICOM previews alongside patient vitals in hospital rooms. IC Role / Device Role / Timing Role: High-reliability display controller rendering medical-grade UI with guaranteed frame timing. Use Value: DDR4 interface ensures consistent memory bandwidth for dual-buffered 1080p overlays; industrial temp rating validates operation in HVAC-controlled clinical environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R8A774A1HA00BG#U0 | Single-core Cortex-A53, no GPU, no video codec, smaller BGA-624 package | Suitable for headless control applications without graphics or video; lacks HDMI/LVDS/PCIe | Select when cost and footprint are prioritized over multimedia capability. |
| R8A774B1HA00BG#U0 | Dual-core Cortex-A53, PowerVR GX6250 GPU, no video codec, BGA-1176 same footprint | Supports graphics-intensive UI but cannot encode/decode video; retains PCIe/USB3.0/HDMI | Choose when GPU acceleration is required but video processing is handled externally. |
Compared with R8A774E0HA01BN#U6, the R8A774A1HA00BG#U0 sacrifices graphics, video, and high-speed I/O for lower cost and power, while the R8A774B1HA00BG#U0 retains GPU and interface compatibility but omits hardware video codec - making R8A774E0HA01BN#U6 the only option in the RZ/G2E family with full multimedia subsystem integration.
Availability
R8A774E0HA01BN#U6 is available at Aetrix Electronics and suitable for industrial HMI, embedded vision gateways, digital signage controllers, and medical display terminals requiring stable component supply across extended product lifecycles.
Supply support for R8A774E0HA01BN#U6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The RZ/G series targets rich-graphics embedded applications requiring Linux-capable performance with hardware-accelerated multimedia - designed specifically for industrial HMIs, edge AI gateways, and medical visualization systems.
FAQ
What is the maximum supported DDR memory speed for R8A774E0HA01BN#U6?
R8A774E0HA01BN#U6 supports DDR3L and DDR4 memory up to 1600 MT/s across dual 32-bit channels. This delivers up to 25.6 GB/s theoretical bandwidth, sufficient for concurrent 1080p video decode, GPU rendering, and application execution. The memory controller includes ECC support for DDR4 and configurable timing parameters aligned with JEDEC standards.
Does R8A774E0HA01BN#U6 include an integrated Ethernet MAC?
Yes, R8A774E0HA01BN#U6 integrates two Gigabit Ethernet MACs compliant with IEEE 802.3, supporting RGMII and RMII interfaces. These MACs are fully compatible with standard Linux network stacks and support features such as checksum offload, VLAN tagging, and jumbo frames - enabling robust wired connectivity in industrial networking applications without external PHYs beyond signal conditioning.
Can R8A774E0HA01BN#U6 operate in AArch32 mode?
R8A774E0HA01BN#U6 implements the ARMv8-A architecture and supports both AArch32 and AArch64 execution states. Boot firmware can configure the processor to start in either mode, though Renesas' official Yocto BSP defaults to AArch64. Legacy AArch32 code runs under AArch32 state with full access to NEON and VFPv4 extensions, preserving compatibility with existing software assets.
What thermal management provisions does R8A774E0HA01BN#U6 require?
R8A774E0HA01BN#U6 requires a thermal solution rated for up to 3.5 W typical power dissipation under full load. The package includes a thermal pad on the underside for direct heatsink contact. PCB layout must allocate ≥4 thermal vias under the pad, connected to an internal ground plane, and maintain ≥200 mm² copper area on Layer 2 for heat spreading. Junction temperature must remain below 105°C per Renesas' thermal design guidelines.
Is R8A774E0HA01BN#U6 pin-compatible with other RZ/G2E variants?
R8A774E0HA01BN#U6 shares the identical 1176-pin FC-BGA package and pinout with all RZ/G2E family members, including R8A774B1HA00BG#U0 and R8A774A1HA00BG#U0. This enables hardware reuse across performance tiers - for example, upgrading from GPU-only to full video-capable functionality without PCB redesign, provided power delivery and thermal design accommodate the higher 3.5 W TDP.
R8A774E0HA01BN#U6 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 1022-BFBGA, FCBGA
- Series:
- RZ/G2E
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53, ARM® Cortex®-A57
- Number of Cores/Bus Width:
- 4, 4 Core, 64-Bit
- Speed:
- 1.2GHz, 1.5GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- LPDDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- DU
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 OTG (2), USB 3.0 (1)
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Security Features:
- AES, ARM TZ, Hash, RSA, Secure Boot, TRNG
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1022-FCBGA (29x29)
- Additional Interfaces:
- CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
R8A774E0HA01BN#U6 FAQ
1.How can I place an order for R8A774E0HA01BN#U6 through Aetrix?
Please submit a Request for Quotation (RFQ) for R8A774E0HA01BN#U6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R8A774E0HA01BN#U6 reliable?
The price and inventory of R8A774E0HA01BN#U6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R8A774E0HA01BN#U6 is usually 5 days.
3.What payment methods are accepted for R8A774E0HA01BN#U6?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R8A774E0HA01BN#U6 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R8A774E0HA01BN#U6?
R8A774E0HA01BN#U6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R8A774E0HA01BN#U6 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R8A774E0HA01BN#U6?
For technical support, including R8A774E0HA01BN#U6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R8A774E0HA01BN#U6 requirements.
6.How does Aetrix verify that R8A774E0HA01BN#U6 is sourced from the original manufacturer or authorized distributors?
All R8A774E0HA01BN#U6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R8A774E0HA01BN#U6 meets industry standards.
7.What is the process for return or replacement of R8A774E0HA01BN#U6?
All R8A774E0HA01BN#U6 units undergo pre-shipment inspection (PSI). If there is an issue with R8A774E0HA01BN#U6, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R8A774E0HA01BN#U6 part is unused and in its original packaging.
Return procedure for R8A774E0HA01BN#U6:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R8A774E0HA01BN#U6 Tags
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