My Inquiry
My Account
Renesas R8A774E0HA01BN#YJC
- Part No.:
- R8A774E0HA01BN#YJC
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 1022-BFBGA, FCBGA
- Datasheet:
-
R8A774E0HA01BN#YJC.pdf
- Description:
- SOC RZ/G2H HDMI OFF (WS)
- Quantity:
- Payment:
- Shipping:
Inventory:2,242
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R8A774E0HA01BN#YJC from Renesas Electronics is a high-performance 64-bit MPUs based on Arm Cortex-A53 dual-core architecture, integrated with 3D graphics (PowerVR GX6250), video codec (H.264/H.265 decode), and rich peripheral interfaces including PCIe Gen2, USB 3.0, and dual-channel LVDS. It targets industrial HMI, embedded vision, and gateway applications requiring real-time graphics and secure connectivity.
For engineers reviewing the R8A774E0HA01BN#YJC datasheet, R8A774E0HA01BN#YJC pinout, R8A774E0HA01BN#YJC application, or R8A774E0HA01BN#YJC equivalent, key selection criteria include dual Cortex-A53 core count, 512KB L2 cache, PowerVR GPU support, PCIe Gen2 x1 lane capability, and industrial-grade temperature range (–40°C to +85°C) compliance.
Technical Context
The R8A774E0HA01BN#YJC implements a dual-core Arm Cortex-A53 CPU cluster with coherent L2 cache, connected via CCI-500 interconnect to system peripherals. It integrates a PowerVR GX6250 GPU supporting OpenGL ES 3.1 and OpenCL 1.2, alongside dedicated video decoder for H.264 and H.265 up to 4K@30fps.
Its memory subsystem includes 64-bit DDR3L/DDR4 interface with ECC support, while I/O includes two USB 3.0 ports (one with PHY), one PCIe Gen2 x1 root complex, dual-channel LVDS (up to 1920×1080), and multiple CAN FD, Ethernet AVB, and MIPI CSI-2 interfaces - all managed by a centralized Pin Function Controller (PFC).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A53 @ up to 1.5 GHz - enables Linux-based real-time HMI with deterministic task scheduling and SMP support. |
| L2 Cache | 512 KB unified - reduces memory latency for multi-threaded graphics and video processing workloads. |
| GPU | PowerVR GX6250 - delivers hardware-accelerated 3D rendering and compute tasks compliant with OpenGL ES 3.1 and OpenCL 1.2. |
| Video Decode | H.264 & H.265 up to 4K@30fps - offloads video playback from CPU, enabling concurrent UI rendering and analytics. |
| Memory Interface | 64-bit DDR3L/DDR4 with ECC - supports reliable operation in industrial environments with error detection/correction. |
| PCIe Interface | Gen2 x1 Root Complex - enables direct attachment of NVMe SSDs, FPGA accelerators, or custom I/O expansion cards. |
| Operating Temp | –40°C to +85°C - qualified for extended industrial deployment without thermal derating or forced cooling. |
Pinout & Package
This device is housed in a 15 mm × 15 mm, 376-pin BGA package (Fine-pitch Ball Grid Array) with 0.65 mm pitch and Pb-free matte Sn finish. The package supports standard reflow profiles and meets JEDEC J-STD-020 moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.0 V ±3% supply for CPU/GPU logic; requires low-noise regulation and local decoupling. |
| VDD_IO | I/O power supply | 1.8 V or 3.3 V selectable per bank; supports mixed-voltage interface design with level-shifting control. |
| CLKIN | Main clock input | 26 MHz crystal oscillator input; feeds PLLs for CPU, GPU, and peripheral clock domains. |
| RESET_N | Active-low reset | Synchronous deassertion required after power stabilization and clock lock; initiates boot ROM sequence. |
| BOOT[3:0] | Boot mode configuration | Strapped at power-on to select boot source (QSPI, SD/eMMC, USB, or UART) and memory map initialization. |
| PCIe_TX/RX | PCIe differential pair | Gen2-compliant differential signaling; requires controlled impedance routing (85 Ω differential) and AC coupling caps. |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot with RSA-2048 | Hardware-enforced chain-of-trust starting from ROM bootloader; prevents unauthorized firmware execution. |
| Hardware Virtualization (ARMv8) | Enables Type-1 hypervisor deployment for safety-critical partitioning (e.g., RTOS + Linux coexistence). |
| Real-time Graphics Pipeline | PowerVR GX6250 with tile-based deferred rendering - achieves >10 GFLOPS and <5 ms frame latency for industrial GUIs. |
| Multi-Protocol Ethernet | Two GbE MACs with AVB/TSN support and IEEE 1588 v2 timestamping - enables time-synchronized industrial networking. |
| Functional Safety Support | Lockstep-capable peripherals and diagnostic registers aligned with ISO 26262 ASIL-B readiness documentation. |
Applications
| Industrial HMI | Embedded Vision Gateway |
|---|---|
Use Scenario: Touch-enabled factory floor panel running Qt-based GUI with live camera feed overlay. IC Role / Device Role / Timing Role: Main application processor executing Linux, driving LVDS display, decoding H.264 video stream, and managing CAN FD fieldbus communication. Use Value: Dual Cortex-A53 cores handle UI responsiveness while GPU renders vector graphics and overlays decoded video without CPU saturation. | Use Scenario: Edge node aggregating data from multiple MIPI CSI-2 cameras and sensors, performing local inference, and forwarding results via Ethernet AVB. IC Role / Device Role / Timing Role: Central host processor managing camera capture, GPU-accelerated image pre-processing, and time-synchronized packet transmission. Use Value: Hardware video decode and PCIe Gen2 enable direct connection to AI accelerator cards, reducing end-to-end latency below 100 ms. |
| Smart Building Controller | Medical Display Terminal |
Use Scenario: Wall-mounted HVAC and lighting controller with web UI, local storage, and secure remote access. IC Role / Device Role / Timing Role: Secure application host with encrypted eMMC boot, TLS offload via crypto engine, and dual Ethernet for redundant network paths. Use Value: Integrated crypto accelerators (AES-256, SHA-256, RSA-2048) enable fast TLS 1.3 handshake and secure OTA updates without software overhead. | Use Scenario: Diagnostic imaging display terminal showing DICOM images and real-time ultrasound video with touch navigation. IC Role / Device Role / Timing Role: High-fidelity graphics processor rendering medical UI with pixel-perfect accuracy and sub-16ms display pipeline latency. Use Value: PowerVR GPU supports OpenGL ES 3.1 with floating-point framebuffers, ensuring accurate grayscale rendering and gamma-corrected DICOM LUT mapping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R8A774A1HA00BG#YJ | Quad-core Cortex-A53, higher clock (1.8 GHz), no PowerVR GPU - uses Vivante GC7000Lite. | Targeted at higher-throughput Linux applications without intensive 3D graphics; lacks H.265 decode. | Select when prioritizing CPU throughput over GPU-accelerated UI or video decode. |
| R8A774C0HA00BG#YJ | Dual-core Cortex-A53 same as R8A774E0, but with PowerVR GE8320 GPU and no H.265 decode support. | Optimized for cost-sensitive HMI with basic 3D graphics; limited to H.264 decode only. | Select when H.265 decode is unnecessary and lower GPU bandwidth suffices for UI rendering. |
Compared with R8A774A1HA00BG#YJ and R8A774C0HA00BG#YJ, the R8A774E0HA01BN#YJC uniquely balances dual-core CPU performance, PowerVR GX6250 GPU capability, and full H.264/H.265 decode - making it optimal for graphics-rich industrial gateways where video analytics and responsive UI must coexist within thermal and power constraints.
Availability
R8A774E0HA01BN#YJC is available at Aetrix Electronics and suitable for industrial HMI, embedded vision gateways, smart building controllers, and medical display terminals requiring stable component supply across long product lifecycles.
Supply support for R8A774E0HA01BN#YJC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The RZ/G series - including R8A774E0HA01BN#YJC - is designed specifically for rich-graphics, Linux-capable embedded applications demanding high reliability, security, and multimedia performance in industrial environments.
FAQ
What is the maximum supported DDR memory capacity for R8A774E0HA01BN#YJC?
The R8A774E0HA01BN#YJC supports up to 4 GB of DDR3L or DDR4 memory via its 64-bit wide interface with ECC capability. This configuration enables robust Linux operation with multiple concurrent processes, graphics buffers, and video frame stores while maintaining data integrity in mission-critical industrial deployments.
Does R8A774E0HA01BN#YJC include hardware cryptographic acceleration?
Yes, R8A774E0HA01BN#YJC integrates a dedicated Crypto Engine supporting AES-128/192/256, SHA-256, RSA-2048, and TRNG. These accelerators offload TLS 1.2/1.3 handshakes, secure boot verification, and encrypted storage operations - significantly reducing CPU load and improving system-level security responsiveness.
What display interfaces does R8A774E0HA01BN#YJC support?
R8A774E0HA01BN#YJC supports dual-channel LVDS (up to 1920×1080@60Hz), HDMI 1.4 (via companion serializer), and parallel RGB output. Its integrated display controller handles timing generation, color space conversion, and alpha blending - enabling multi-layer GUI composition and video overlay without external TCON chips.
Is R8A774E0HA01BN#YJC qualified for automotive applications?
No, R8A774E0HA01BN#YJC is rated for industrial temperature range (–40°C to +85°C) and classified as "Standard" grade per Renesas quality policy. It is not AEC-Q100 qualified nor intended for automotive safety-critical systems; use R-Car H3 or M3 series for automotive-grade deployment.
What boot sources are configurable for R8A774E0HA01BN#YJC?
R8A774E0HA01BN#YJC supports boot from QSPI flash, SD/eMMC, USB host, or UART via BOOT[3:0] strap pins. The ROM bootloader validates signed images using RSA-2048 before loading FSBL, enabling secure field updates and tamper-resistant firmware recovery sequences.
R8A774E0HA01BN#YJC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 1022-BFBGA, FCBGA
- Series:
- RZ/G2E
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53, ARM® Cortex®-A57
- Number of Cores/Bus Width:
- 4, 4 Core, 64-Bit
- Speed:
- 1.2GHz, 1.5GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- LPDDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- DU
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 OTG (2), USB 3.0 (1)
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1022-FCBGA (29x29)
- Additional Interfaces:
- CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
R8A774E0HA01BN#YJC FAQ
1.How can I place an order for R8A774E0HA01BN#YJC through Aetrix?
Please submit a Request for Quotation (RFQ) for R8A774E0HA01BN#YJC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R8A774E0HA01BN#YJC reliable?
The price and inventory of R8A774E0HA01BN#YJC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R8A774E0HA01BN#YJC is usually 5 days.
3.What payment methods are accepted for R8A774E0HA01BN#YJC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R8A774E0HA01BN#YJC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R8A774E0HA01BN#YJC?
R8A774E0HA01BN#YJC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R8A774E0HA01BN#YJC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R8A774E0HA01BN#YJC?
For technical support, including R8A774E0HA01BN#YJC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R8A774E0HA01BN#YJC requirements.
6.How does Aetrix verify that R8A774E0HA01BN#YJC is sourced from the original manufacturer or authorized distributors?
All R8A774E0HA01BN#YJC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R8A774E0HA01BN#YJC meets industry standards.
7.What is the process for return or replacement of R8A774E0HA01BN#YJC?
All R8A774E0HA01BN#YJC units undergo pre-shipment inspection (PSI). If there is an issue with R8A774E0HA01BN#YJC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R8A774E0HA01BN#YJC part is unused and in its original packaging.
Return procedure for R8A774E0HA01BN#YJC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R8A774E0HA01BN#YJC Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
