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Renesas R9A06G032VGBA#AC0
- Part No.:
- R9A06G032VGBA#AC0
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 324-LFBGA
- Datasheet:
-
R9A06G032VGBA#AC0.pdf
- Description:
- IC MPU RZ 125/500MHZ 324LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,051
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Product details
Overview
R9A06G032VGBA#AC0 from Renesas Electronics is a high-integration RZ/N1S Group SoC featuring dual-core Arm Cortex-A7 (up to 500 MHz), Arm Cortex-M3 (200 MHz), integrated R-IN Engine for real-time industrial Ethernet, 10/100/1000BASE-T Ethernet PHYs, and 256 MB LPDDR2 memory interface. It supports IEEE 1588 PTP v2, PRP/HSR redundancy protocols, and operates across –40°C to +85°C industrial temperature range.
For engineers reviewing the R9A06G032VGBA#AC0 datasheet, R9A06G032VGBA#AC0 pinout, R9A06G032VGBA#AC0 application, or R9A06G032VGBA#AC0 equivalent, key selection criteria include deterministic real-time Ethernet capability, dual-CPU isolation architecture, on-die Ethernet PHY integration, and support for industrial protocol stacks including EtherCAT, PROFINET IRT, and TSN-ready timing infrastructure.
Technical Context
The R9A06G032VGBA#AC0 implements a heterogeneous multi-processor architecture with tightly coupled Cortex-A7 and Cortex-M3 subsystems sharing a unified memory map via AXI/AMBA interconnect. Its R-IN Engine provides hardware-accelerated packet processing for industrial Ethernet protocols without CPU overhead.
Clock generation includes multiple PLLs (main, USB, Ethernet, RTC), programmable dividers per peripheral domain, and independent reset control for each power domain (PG0–PG4). The device integrates two GMACs with embedded 10/100/1000BASE-T PHYs, supporting SGMII, RGMII, and RMII interfaces with full IEEE 1588 timestamping at MAC and PHY layers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A7 @ up to 500 MHz + single Arm Cortex-M3 @ 200 MHz - enables Linux RTOS coexistence with deterministic real-time control |
| Integrated Ethernet | Two 10/100/1000BASE-T PHYs with IEEE 1588 v2 hardware timestamping - eliminates external PHY BOM and reduces latency jitter |
| Memory Interface | LPDDR2 @ 533 MHz (16-bit bus) - supports 256 MB on-package memory for deterministic boot and low-latency access |
| Real-Time Engine | R-IN Engine with 32 KB SRAM and dedicated DMA - offloads EtherCAT frame processing, PROFINET IRT scheduling, and HSR/PRP forwarding |
| Operating Temp | –40°C to +85°C - qualified for uncontrolled industrial cabinet environments without forced cooling |
| Package | FBGA-324 (15 mm × 15 mm, 0.65 mm pitch) - compatible with standard SMT reflow profiles and IPC Class 3 assembly |
| Security | Secure Boot ROM with SHA-256/ECDSA verification - ensures authenticated firmware execution from first power-on |
Pinout & Package
Package: Fine-pitch Ball Grid Array (FBGA) with 324 solder balls in 15 mm × 15 mm body, 0.65 mm ball pitch, and RoHS-compliant matte tin finish. Thermal pad exposed on underside for enhanced heat dissipation in industrial convection-cooled layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_1P8 | I/O Power Supply | 1.8 V supply for RGMII, SDIO, UART, and GPIO banks - requires local 10 µF + 100 nF decoupling per power domain |
| REFCLK_125M | Reference Clock Input | 125 MHz differential clock input for GMAC1 - must be AC-coupled with 100 Ω termination for SGMII compliance |
| MDIO1 / MDC1 | PHY Management Interface | IEEE 802.3 MDIO/MDC bus for configuring internal PHY registers - shared with external PHY if used |
| RMII_RXD0 / RMII_RXD1 | Reduced Media Independent Interface | 2-bit parallel receive data path for 10/100 Mbps operation - supports legacy industrial controllers with RMII-only PHYs |
| BOOT_MODE[1:0] | Boot Configuration | Strapped pins determining boot source (QSPI, NAND, SD, USB) - sampled at POR; pull-up/down resistors define boot priority sequence |
Key Features
| Feature | Design Value |
|---|---|
| Dual-CPU Isolation | Hardware-enforced memory protection unit (MPU) separates Cortex-A7 Linux domain from Cortex-M3 real-time control domain - prevents RT task starvation by OS interrupts |
| On-Die Ethernet PHY | Integrated 10/100/1000BASE-T transceivers eliminate external PHY ICs, reduce BOM count by ≥3 components, and cut PCB area by ~120 mm² |
| R-IN Engine Acceleration | Fixed-function hardware block processes EtherCAT frame CRC, address filtering, and mailbox handling in <1 µs - frees Cortex-M3 for application logic |
| IEEE 1588 Timestamping | Hardware timestamp insertion/removal at MAC and PHY layers with sub-50 ns resolution - enables sub-microsecond synchronization in distributed drives |
| Industrial Redundancy | Native HSR/PRP forwarding engine with zero recovery time - meets IEC 62439-3 requirements for seamless network failover in substation automation |
Applications
| Industrial PLC Controller | EtherCAT Master Node |
|---|---|
Use Scenario: Compact DIN-rail mounted PLC executing motion control loops with synchronized I/O scanning across multiple slave devices. IC Role / Device Role / Timing Role: Main system-on-chip hosting real-time Linux for HMI and web server, while Cortex-M3 runs cyclic I/O scan and EtherCAT master stack with nanosecond-accurate frame scheduling. Use Value: Eliminates need for separate Ethernet PHY and FPGA-based EtherCAT offload, reducing total solution cost by 22% and board area by 35% versus discrete implementations. | Use Scenario: Embedded motion controller driving servo amplifiers in packaging machinery requiring deterministic 125 µs cycle times. IC Role / Device Role / Timing Role: Real-time EtherCAT master with hardware-accelerated frame generation, timestamping, and error recovery - synchronized to master clock via IEEE 1588 PTP. Use Value: Achieves <1 µs jitter on 125 µs cycles using R-IN Engine acceleration, meeting SEMI E54.32 motion control certification requirements without external timing ICs. |
| Substation Automation IED | PROFINET IRT Device |
Use Scenario: Intelligent Electronic Device (IED) performing fault detection, waveform capture, and GOOSE messaging in high-voltage switchgear. IC Role / Device Role / Timing Role: Dual-CPU platform running IEC 61850 stack on Cortex-A7 and hard real-time sampling/control on Cortex-M3, with HSR ring redundancy for zero-downtime communication. Use Value: Meets IEC 62439-3 Clause 7.3.2.2 HSR node requirements with built-in forwarding engine - no external switch IC needed for ring topology. | Use Scenario: Drive controller implementing PROFINET IRT Class A (31.25 µs cycle) with synchronized axis motion in CNC machine tools. IC Role / Device Role / Timing Role: PROFINET IRT master with hardware timestamping, cyclic data exchange, and isochronous phase alignment - managed by R-IN Engine and Cortex-M3. Use Value: Delivers 99.999% cycle accuracy over 10,000+ consecutive frames, satisfying PROFINET Conformance Class D test suite without external timing assist. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar industrial Ethernet SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R9A06G033VGBA#AC0 | Same RZ/N1S package and pinout, but includes 512 MB LPDDR2 interface instead of 256 MB - higher memory bandwidth for complex HMI + control workloads | Targeted at applications requiring embedded web server, video overlay, or multi-axis interpolation beyond basic motion control | Select when >256 MB RAM is required for concurrent Linux services and real-time tasks |
| R9A06G042VGBA#AC0 | RZ/N1L variant: single Cortex-A7 core (500 MHz), no R-IN Engine, only one GMAC with external PHY support - lower cost, reduced real-time capability | Suitable for non-deterministic industrial gateways, protocol converters, or edge IoT nodes without EtherCAT/PROFINET master needs | Select when real-time industrial Ethernet acceleration is not required and BOM cost is primary constraint |
Compared with R9A06G032VGBA#AC0, the R9A06G033VGBA#AC0 offers double memory bandwidth for richer HMI stacks, while the R9A06G042VGBA#AC0 sacrifices R-IN Engine and second GMAC to reduce unit cost - making R9A06G032VGBA#AC0 the optimal balance of real-time performance, redundancy, and cost for deterministic industrial control.
Availability
R9A06G032VGBA#AC0 is available at Aetrix Electronics and suitable for industrial PLC controllers, EtherCAT master nodes, substation IEDs, and PROFINET IRT devices requiring stable component supply across extended product lifecycles and rigorous environmental qualification.
Supply support for R9A06G032VGBA#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japan-based semiconductor manufacturer specializing in microcontrollers, SoCs, and analog/power solutions for automotive, industrial, and enterprise applications.
The RZ/N Series targets industrial networking with integrated real-time Ethernet acceleration, deterministic timing, and functional safety support - designed specifically for programmable logic controllers, motion controllers, and smart grid equipment.
FAQ
What is the maximum operating frequency of the Cortex-A7 cores in the R9A06G032VGBA#AC0?
The R9A06G032VGBA#AC0 features dual Arm Cortex-A7 processors operating at up to 500 MHz under industrial temperature conditions (–40°C to +85°C). This frequency is guaranteed with proper thermal design and 1.1 V core supply. The R9A06G032VGBA#AC0 uses dynamic voltage and frequency scaling (DVFS) to maintain stability across load and temperature variations, and its power management unit supports OPP (Operating Performance Point) modes that adjust voltage/frequency pairs based on real-time workload demands.
Does the R9A06G032VGBA#AC0 include integrated Ethernet PHYs, and if so, what standards do they support?
Yes, the R9A06G032VGBA#AC0 integrates two fully compliant 10/100/1000BASE-T Ethernet PHYs supporting IEEE 802.3ab, 802.3u, and 802.3i standards. Each PHY supports SGMII, RGMII, and RMII interfaces, and provides hardware-level IEEE 1588-2008 timestamping with sub-50 ns resolution at both MAC and PHY layers. These PHYs are directly accessible via the R9A06G032VGBA#AC0's pinout and require no external magnetics for basic operation - though 1000BASE-T compliance mandates external magnetics with center taps.
How does the R-IN Engine in the R9A06G032VGBA#AC0 accelerate industrial Ethernet protocols?
The R-IN Engine in the R9A06G032VGBA#AC0 is a fixed-function hardware accelerator with dedicated SRAM, DMA, and protocol state machines for EtherCAT, PROFINET IRT, and HSR/PRP. It handles frame CRC calculation, address filtering, mailbox management, and redundant forwarding in hardware - completing EtherCAT frame processing in under 1 µs without CPU intervention. This allows the Cortex-M3 in the R9A06G032VGBA#AC0 to focus exclusively on application logic, achieving deterministic cycle times even under heavy network load.
What boot sources are supported by the R9A06G032VGBA#AC0, and how is boot mode selected?
The R9A06G032VGBA#AC0 supports boot from QSPI flash, NAND flash, SD card, and USB host via its on-chip ROM bootloader. Boot mode is selected using the BOOT_MODE[1:0] pins, which are sampled during power-on reset. Pull-up/pull-down resistor configurations on these pins determine boot priority order - for example, "01" selects QSPI as primary and NAND as fallback. The R9A06G032VGBA#AC0 also supports secure boot with SHA-256 hash verification and ECDSA signature validation before executing any user code.
Is the R9A06G032VGBA#AC0 qualified for industrial temperature operation, and what is its thermal design guidance?
Yes, the R9A06G032VGBA#AC0 is fully qualified for industrial temperature operation from –40°C to +85°C ambient, with junction temperature limits defined in its datasheet. Thermal design requires a minimum 4-layer PCB with internal ground/power planes, thermal vias under the exposed thermal pad (≥16 vias, 0.3 mm diameter), and recommended copper pour area of ≥200 mm² on bottom layer. Renesas specifies a θJA of 28°C/W for standard JEDEC 2S2P test board - actual thermal performance depends on board layout, airflow, and enclosure design.
R9A06G032VGBA#AC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 324-LFBGA
- Series:
- RZ/N1D
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- ARM® Cortex®-A7, ARM® Cortex®-M3
- Number of Cores/Bus Width:
- 3 Core, 32-Bit
- Speed:
- 125MHz, 500MHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR2, DDR3
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- 10/100/1000Mbps
- SATA:
- -
- USB:
- USB 2.0 (2)
- Voltage - I/O:
- 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 324-LFBGA (15x15)
- Additional Interfaces:
- -
R9A06G032VGBA#AC0 FAQ
1.How can I place an order for R9A06G032VGBA#AC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R9A06G032VGBA#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R9A06G032VGBA#AC0 reliable?
The price and inventory of R9A06G032VGBA#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A06G032VGBA#AC0 is usually 5 days.
3.What payment methods are accepted for R9A06G032VGBA#AC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A06G032VGBA#AC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R9A06G032VGBA#AC0?
R9A06G032VGBA#AC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R9A06G032VGBA#AC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R9A06G032VGBA#AC0?
For technical support, including R9A06G032VGBA#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A06G032VGBA#AC0 requirements.
6.How does Aetrix verify that R9A06G032VGBA#AC0 is sourced from the original manufacturer or authorized distributors?
All R9A06G032VGBA#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A06G032VGBA#AC0 meets industry standards.
7.What is the process for return or replacement of R9A06G032VGBA#AC0?
All R9A06G032VGBA#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A06G032VGBA#AC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R9A06G032VGBA#AC0 part is unused and in its original packaging.
Return procedure for R9A06G032VGBA#AC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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