Renesas R9A07G043F00GBG#AC0

Overview

R9A07G043F00GBG#AC0 from Renesas Electronics is a high-performance 64-bit RISC-V microprocessor unit (MPU) in the RZ/Five group, featuring a single-core AndesCore™ AX45MP CPU running at up to 1 GHz, integrated L2 cache, dual Gigabit Ethernet MACs, and hardware-accelerated security functions including TrustZone®-enabled secure boot and AES-128/256 encryption. It targets industrial HMI, edge AI inference gateways, and embedded Linux-based control systems requiring real-time responsiveness and functional safety support.

For engineers reviewing the R9A07G043F00GBG#AC0 datasheet, R9A07G043F00GBG#AC0 pinout, R9A07G043F00GBG#AC0 application, or R9A07G043F00GBG#AC0 equivalent, key selection considerations include its 1 GHz AX45MP core frequency, dual GbE PHY interface support, -40°C to +85°C industrial temperature range, 17mm × 17mm 376-pin BGA package with 0.65 mm pitch, and compliance with Arm AMBA®-compatible bus architecture for system integration.

Technical Context

The R9A07G043F00GBG#AC0 implements a single-threaded AndesCore™ AX45MP 64-bit RISC-V CPU with MMU, FPU, and 64 KB L1 I/D cache plus 512 KB unified L2 cache. It supports TrustZone®-based secure world isolation and hardware cryptographic acceleration for AES-128/256, SHA-256, and RSA-2048.

System-level features include dual independent Gigabit Ethernet controllers with IEEE 1588 timestamping, PCIe Gen2 x1 root complex, USB 3.0 host/device, and multiple high-speed serial interfaces (SPI, I²C, UART, SD/eMMC). Memory subsystem supports LPDDR4x up to 4 GB at 3200 MT/s via 16-bit dual-channel interface.

Key Specifications

Pinout & Package

Package: 376-pin Fine-Pitch Ball Grid Array (FBGA), 17 mm × 17 mm body size, 0.65 mm ball pitch, bottom thermal pad for thermal management.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar MPU applications.

Compared with R9A07G043F00GBG#AC0, the #AC1 variant offers identical performance but different factory boot configuration, while the R9A07G053F00GBG#AC0 provides scalable dual-core capability at the cost of higher power and BOM expense - making #AC0 optimal for lean industrial gateways where single-core throughput meets functional requirements.

Availability

R9A07G043F00GBG#AC0 is available at Aetrix Electronics and suitable for industrial HMI terminals, edge AI gateways, and smart energy meter hubs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for ISO 9001-certified production.

Supply support for R9A07G043F00GBG#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RZ/Five group - including R9A07G043F00GBG#AC0 - was designed to deliver RISC-V-based high-performance MPUs for Linux-capable edge devices requiring security, connectivity, and real-time determinism in industrial and infrastructure applications.

FAQ

What is the maximum operating frequency of the R9A07G043F00GBG#AC0 CPU core?

The R9A07G043F00GBG#AC0 integrates a single-core AndesCore™ AX45MP 64-bit RISC-V processor rated for operation up to 1 GHz under industrial temperature conditions (-40°C to +85°C). This frequency is guaranteed with proper power delivery (VDD_CORE = 1.0 V ±3%) and thermal management using the package's exposed thermal pad. The R9A07G043F00GBG#AC0 does not support dynamic overclocking beyond this specification.

Does the R9A07G043F00GBG#AC0 support secure boot with hardware root of trust?

Yes, the R9A07G043F00GBG#AC0 implements a hardware-enforced secure boot flow beginning with immutable ROM code that verifies digital signatures of the first-stage bootloader using ECDSA-P256. This root of trust leverages TrustZone®-enabled memory isolation and on-die fuses to prevent rollback or unsigned code execution. The R9A07G043F00GBG#AC0 also includes dedicated AES-128/256 and SHA-256 accelerators to maintain performance during authenticated firmware updates.

What memory types and capacities does the R9A07G043F00GBG#AC0 support?

The R9A07G043F00GBG#AC0 supports LPDDR4x memory up to 4 GB across a 16-bit dual-channel interface operating at 3200 MT/s. It also provides dedicated interfaces for eMMC 5.1 (HS400 mode), SPI NOR/NAND flash, and parallel NAND. The R9A07G043F00GBG#AC0 does not support DDR3, DDR4, or legacy SDRAM. Memory controller includes ECC support for LPDDR4x and on-chip SRAM, but not for external flash devices.

Can the R9A07G043F00GBG#AC0 operate in extended temperature environments?

Yes, the R9A07G043F00GBG#AC0 is qualified for industrial temperature operation from -40°C to +85°C ambient, verified per Renesas' standard qualification test flow. It is not rated for automotive AEC-Q100 or extended military temperature ranges. Thermal design must account for 12.5 W typical power dissipation using the 17 mm × 17 mm FBGA package's thermal pad and recommended PCB copper pour layout specified in the RZ/Five Hardware User's Manual Rev.1.00.

What boot sources are supported by the R9A07G043F00GBG#AC0?

The R9A07G043F00GBG#AC0 supports six configurable boot modes selected via BOOT_MODE[2:0] pins: eSD, 1.8-V eMMC, 3.3-V eMMC, 1.8-V serial flash, 3.3-V serial flash, and SCIF downloading. Each mode defines the primary interface and initialization sequence for loading the first-stage bootloader. The R9A07G043F00GBG#AC0 does not support booting directly from PCIe, USB, or network interfaces - those require secondary-stage firmware initialization.