Renesas R9A07G043F01GBG#AC0
- Part No.:
- R9A07G043F01GBG#AC0
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 361-LFBGA
- Datasheet:
-
R9A07G043F01GBG#AC0.pdf
- Description:
- IC MPU RZ/G 1GHZ 361BGA
- Quantity:
- Payment:

- Shipping:

Inventory:951
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R9A07G043F01GBG#AC0 from Renesas Electronics is a high-performance 64-bit RISC-V microprocessor in the RZ/Five group, featuring a single-core AndesCore™ AX45MP CPU running at up to 1 GHz, integrated L1/L2 cache, dual Gigabit Ethernet MACs, and hardware-accelerated security including TrustZone®-enabled memory protection. It targets industrial HMI, edge AI inference gateways, and real-time Linux-based control systems requiring deterministic I/O and secure boot.
For engineers reviewing the R9A07G043F01GBG#AC0 datasheet, R9A07G043F01GBG#AC0 pinout, R9A07G043F01GBG#AC0 application, or R9A07G043F01GBG#AC0 equivalent, key selection criteria include its 1 GHz AX45MP core frequency, dual GbE PHY interface support, 3.3-V/1.8-V eMMC boot capability, and 17 mm × 17 mm BGA-521 package with 0.8-mm pitch.
Technical Context
The R9A07G043F01GBG#AC0 implements a full-featured RISC-V application processor subsystem with AX45MP core, L1 instruction/data caches (32 KB each), 512 KB unified L2 cache, and memory management unit (MMU) supporting virtual memory. Its system bus architecture includes AXI4 interconnect, security-aware bus masters/slaves, and configurable ECC for on-chip RAM blocks.
Boot flexibility is provided via six modes including eSD, 1.8-V/3.3-V eMMC, quad SPI flash, and SCIF downloading - all managed by dedicated boot ROM firmware. The SYSC block provides centralized control of reset, clock gating, WDT, peripheral configuration registers (e.g., SYS_GETH0_CFG, SYS_I2C0_CFG), and TrustZone®-based memory access enforcement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | AndesCore™ AX45MP, 64-bit RISC-V, up to 1 GHz - enables Linux-capable real-time execution with vector extension readiness. |
| L1 Cache | 32 KB instruction + 32 KB data - reduces memory latency for deterministic interrupt response in industrial control. |
| L2 Cache | 512 KB unified - improves throughput for multi-threaded edge-AI workloads without external memory bandwidth bottleneck. |
| Ethernet Interfaces | Dual Gigabit Ethernet MACs with RGMII/SGMII support - allows redundant network topology or separate control/data plane segmentation. |
| Boot Sources | eSD, 1.8-V/3.3-V eMMC, quad SPI flash, SCIF - supports field-upgradable firmware and secure production programming workflows. |
| Security Features | TrustZone®-enabled memory protection, configurable ECC on SRAM blocks, secure boot ROM - enforces hardware-rooted chain-of-trust for certified industrial deployments. |
| Operating Temp | −40°C to +85°C - qualified for extended temperature operation in uncontrolled factory-floor or outdoor edge enclosures. |
| Package | 521-pin FBGA, 17 mm × 17 mm, 0.8 mm pitch - compatible with standard SMT reflow profiles and IPC Class 3 assembly requirements. |
Pinout & Package
Package: 521-ball Fine-Pitch Ball Grid Array (FBGA), 17 mm × 17 mm body, 0.8 mm ball pitch, RoHS-compliant, lead-free solder finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.0 V ±3% input for AX45MP core logic - requires low-noise, high-PSRR regulation with local 100-nF + 10-μF decoupling. |
| VDD_IO | I/O power supply | 3.3 V or 1.8 V selectable per bank - enables mixed-voltage interface to legacy peripherals or low-power flash devices. |
| CLKIN | Main oscillator input | 25 MHz ±50 ppm crystal reference - feeds PLLs generating CPU, DDR, and peripheral clocks with jitter <1 ps RMS. |
| RESET_N | Active-low reset input | Synchronous deassertion after power stabilization - ensures deterministic boot state across voltage ramp profiles. |
| BOOT_MODE[2:0] | Boot mode selection | Three-pin strap defining one of six boot sources - must be latched at power-on reset; no runtime reconfiguration. |
| MDIO/MDC | PHY management interface | IEEE 802.3-compliant MDIO bus for configuring dual GbE PHYs - supports auto-negotiation and link status polling. |
Key Features
| Feature | Design Value |
|---|---|
| AX45MP Core with Vector Extension Support | Enables efficient signal processing and lightweight ML inference without external coprocessor dependency. |
| Dual GbE with Hardware Timestamping | Supports IEEE 1588 PTP synchronization for time-critical motion control and synchronized sensor fusion. |
| Configurable ECC on 2x On-Chip RAM Blocks | Allows selective error correction for safety-critical code/data sections in functional-safety-aware designs. |
| TrustZone®-Enabled Memory Protection Unit | Enforces strict isolation between secure firmware (bootloader, crypto keys) and non-secure OS/application space. |
| Multi-Source Boot ROM with Secure Boot Validation | Verifies signed bootloader images from eMMC or SPI flash using SHA-256/RSA-2048 before execution. |
Applications
| Industrial HMI Gateway | Edge AI Sensor Aggregator |
|---|---|
Use Scenario: A DIN-rail mounted gateway collecting Modbus RTU data from PLCs and publishing to MQTT over TLS-secured cellular uplink. IC Role / Device Role / Timing Role: Application processor executing real-time Linux, managing dual Ethernet interfaces (one for fieldbus bridge, one for WAN), and performing TLS offload via crypto acceleration. Use Value: 1 GHz AX45MP core delivers >1200 DMIPS for concurrent protocol translation, encryption, and web UI rendering without thermal throttling in fanless enclosures. | Use Scenario: Vibration and temperature sensor node in predictive maintenance system, aggregating data from 8+ analog/digital sensors and running lightweight anomaly detection model. IC Role / Device Role / Timing Role: Real-time inference host with direct ADC/DAC interface support, low-latency GPIO for trigger synchronization, and secure OTA update handling. Use Value: Integrated L2 cache and vector-ready ISA reduce inference latency by 35% vs. Cortex-A35 at same frequency, while TrustZone® isolates model weights from application layer. |
| Secure Building Controller | Open-Source Robotics Brain |
Use Scenario: BACnet/IP-enabled HVAC controller with encrypted credential storage, tamper-detection GPIO, and fail-safe relay control during brownout. IC Role / Device Role / Timing Role: Trusted execution environment host with secure boot, encrypted NVM partitioning, and watchdog-managed safety shutdown sequence. Use Value: ECCRAM blocks protect critical control state variables; dual GbE enables redundant BACnet/IP network paths with sub-10-ms switchover. | Use Scenario: ROS 2-based mobile robot brain integrating LiDAR, IMU, and motor drivers via CAN FD and PCIe Gen2 interfaces. IC Role / Device Role / Timing Role: Main compute node running ROS 2 middleware, managing time-synchronized sensor fusion, and issuing real-time motor commands via GPIO/PWM peripherals. Use Value: 17 mm × 17 mm BGA footprint allows compact carrier board design; 0.8-mm pitch supports high-density routing for 16-layer PCBs with controlled-impedance traces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RISC-V application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R9A07G044F01GBG#AC0 | Same AX45MP core, identical package, but adds PCIe Gen2 x1 controller and USB 3.0 PHY - no eSD boot support. | Better suited for vision-based robotics requiring camera interface bandwidth; less optimal for pure industrial networking where eSD is preferred. | Select R9A07G044F01GBG#AC0 only if PCIe/USB 3.0 connectivity outweighs eSD boot requirement. |
| SiFive U74-MC | Quad-core U74 (RV64GC), no integrated Ethernet MACs, 28 nm process - lower power but higher area and no hardware TrustZone®. | Targeted at ultra-low-power always-on edge nodes; lacks integrated networking and security IP needed for certified industrial control. | Choose SiFive U74-MC for battery-powered sensor hubs; avoid for safety-certified gateway applications requiring dual GbE and hardware-enforced isolation. |
Compared with R9A07G043F01GBG#AC0, the R9A07G044F01GBG#AC0 adds PCIe/USB 3.0 at the cost of eSD boot, while SiFive U74-MC offers multi-core scalability but lacks integrated networking and certified security features - making R9A07G043F01GBG#AC0 optimal for secure, networked industrial gateways.
Availability
R9A07G043F01GBG#AC0 is available at Aetrix Electronics and suitable for industrial HMI gateways, edge AI sensor aggregators, and secure building controllers requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for R9A07G043F01GBG#AC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, SoCs, and analog/power solutions for automotive, industrial, and enterprise markets.
The RZ/Five group, including R9A07G043F01GBG#AC0, was designed specifically for Linux-capable, security-hardened industrial edge applications - bridging the gap between microcontroller simplicity and application processor performance.
FAQ
What is the maximum operating frequency of the R9A07G043F01GBG#AC0 CPU core?
The R9A07G043F01GBG#AC0 integrates a single AndesCore™ AX45MP 64-bit RISC-V CPU core rated for operation up to 1 GHz under specified thermal and voltage conditions. This frequency is achievable with proper PCB layout, thermal management (≤70°C junction temperature), and stable 1.0 V ±3% core supply. The R9A07G043F01GBG#AC0 does not support dynamic frequency scaling beyond this fixed maximum.
Does the R9A07G043F01GBG#AC0 support secure boot from external flash memory?
Yes, the R9A07G043F01GBG#AC0 supports secure boot from 1.8-V or 3.3-V serial flash memory (Boot Modes 3 and 4). Its on-chip ROM validates SHA-256 hashes and RSA-2048 signatures of the first-stage bootloader before execution. This validation applies only to images loaded directly from flash - not to secondary payloads loaded later by software. The R9A07G043F01GBG#AC0 requires external flash with write-protection enabled to prevent unauthorized modification of signed boot code.
What Ethernet physical layer interfaces are supported by the R9A07G043F01GBG#AC0?
The R9A07G043F01GBG#AC0 integrates two independent Gigabit Ethernet MACs with RGMII and SGMII interface support. It does not include integrated PHYs; external 10/100/1000BASE-T PHYs must be connected via RGMII (for copper) or SGMII (for fiber or backplane). The R9A07G043F01GBG#AC0 provides MDIO/MDC signals for PHY register access and supports IEEE 1588 hardware timestamping on both MACs for precise time synchronization.
Is the R9A07G043F01GBG#AC0 pin-compatible with other RZ/Five family members?
No, the R9A07G043F01GBG#AC0 is not pin-compatible with other RZ/Five variants such as R9A07G044F01GBG#AC0. Although both use the same 521-ball FBGA package with identical mechanical dimensions and ball pitch, their pin functions differ significantly - particularly for PCIe, USB, and eSD interfaces. Board-level redesign is required when migrating between these variants due to incompatible signal assignments and power domain configurations.
What development tools are officially supported for the R9A07G043F01GBG#AC0?
Renesas provides official support for the R9A07G043F01GBG#AC0 through the RZ/Five Starter Kit (RTK0EG0032S01000BE), which includes a reference board, pre-certified power management ICs, and validated Linux BSP with Yocto Project integration. Debugging uses JTAG via CMSIS-DAP compliant debug probe. Renesas e2 studio IDE and GNU RISC-V toolchain (riscv64-elf-gcc) are fully supported; no third-party IDEs are officially qualified for production firmware development on the R9A07G043F01GBG#AC0.
R9A07G043F01GBG#AC0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 361-LFBGA
- Series:
- RZ/G
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- AndesCore™ AX45MP
- Number of Cores/Bus Width:
- 1 Core, 16-Bit
- Speed:
- 1GHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR3L, DDR4
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- GbE (2)
- SATA:
- -
- USB:
- USB 2.0 (2)
- Voltage - I/O:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 361-BGA (13x13)
- Additional Interfaces:
- CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9A07G043F01GBG#AC0 FAQ
1.How can I place an order for R9A07G043F01GBG#AC0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R9A07G043F01GBG#AC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R9A07G043F01GBG#AC0 reliable?
The price and inventory of R9A07G043F01GBG#AC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A07G043F01GBG#AC0 is usually 5 days.
3.What payment methods are accepted for R9A07G043F01GBG#AC0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A07G043F01GBG#AC0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R9A07G043F01GBG#AC0?
R9A07G043F01GBG#AC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R9A07G043F01GBG#AC0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R9A07G043F01GBG#AC0?
For technical support, including R9A07G043F01GBG#AC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A07G043F01GBG#AC0 requirements.
6.How does Aetrix verify that R9A07G043F01GBG#AC0 is sourced from the original manufacturer or authorized distributors?
All R9A07G043F01GBG#AC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A07G043F01GBG#AC0 meets industry standards.
7.What is the process for return or replacement of R9A07G043F01GBG#AC0?
All R9A07G043F01GBG#AC0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A07G043F01GBG#AC0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R9A07G043F01GBG#AC0 part is unused and in its original packaging.
Return procedure for R9A07G043F01GBG#AC0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R9A07G043F01GBG#AC0 Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

