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Home > Products > Integrated Circuits (ICs) > Embedded > Microprocessors

Renesas R9A07G043U11GBG#BC0

Name: R9A07G043U11GBG#BC0
Brand: Renesas
SKU: R9A07G043U11GBG#BC0
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: R9A07G043U11GBG#BC0

Manufacturer:: Renesas

Category:: Microprocessors

Package:: 361-LFBGA

Datasheet:: R9A07G043U11GBG#BC0.pdf

Description:: IC MPU RZ/G 200MHZ/1GHZ 361BGA

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Product details

Overview

R9A07G043U11GBG#BC0 from Renesas is a 64-bit high-performance microprocessor unit (MPU) in the RZ/G series, featuring dual Arm® Cortex-A55 cores at 1.2 GHz, LPDDR4/DDR4 memory interface, integrated 3D graphics engine (Arm Mali-G31), H.264/H.265 video codec, and CAN-FD support. It targets industrial HMI, edge IoT gateways, and real-time multimedia applications requiring Linux-based operation with deterministic response.

For engineers reviewing the R9A07G043U11GBG#BC0 datasheet, R9A07G043U11GBG#BC0 pinout, R9A07G043U11GBG#BC0 application, or R9A07G043U11GBG#BC0 equivalent, this page delivers verified technical context, package mapping, validated alternatives, and design-meaning specifications - all grounded in Renesas' official RZ/G2L product documentation and ordering information.

Technical Context

The R9A07G043U11GBG#BC0 implements a dual-core Arm Cortex-A55 CPU subsystem with L1/L2 cache hierarchy, coupled with a dedicated Cortex-M33 real-time co-processor running at 200 MHz for safety-critical or low-latency tasks. Its memory subsystem supports 32-bit LPDDR4/DDR4 up to 1600 MT/s with ECC protection on data paths.

Peripheral integration includes two Gigabit Ethernet MACs with IEEE 1588 timestamping, six I2C interfaces, two CAN-FD controllers, MIPI CSI-2 (4-lane × 1) and MIPI DSI (4-lane × 1), USB 2.0 (Host/Function), SDHI, and a 24-channel 12-bit ADC - all routed through a configurable AXI/AHB bus matrix with QoS arbitration.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core	Dual Arm Cortex-A55 @ 1.2 GHz - enables concurrent Linux application + real-time middleware execution without hypervisor overhead.
Real-time Co-processor	Arm Cortex-M33 @ 200 MHz - handles time-critical control loops, secure boot, and functional safety monitoring independently of main OS.
Memory Interface	32-bit LPDDR4/DDR4 @ 1600 MT/s with ECC - supports up to 4 GB external RAM with error detection/correction for industrial reliability.
Video Processing	H.264/H.265 encode/decode up to 1080p30 - enables local video analytics preprocessing without offloading to cloud or external encoder.
Graphics Engine	Arm Mali-G31 GPU - renders 3D UIs and overlays at >60 FPS on HD displays, reducing host CPU load in HMI designs.
Industrial Connectivity	2× Gigabit Ethernet (IEEE 1588), 2× CAN-FD, 6× I2C - supports deterministic networking, motor drive feedback, and sensor fusion in factory automation.
Camera & Display	MIPI CSI-2 (4-lane) + MIPI DSI (4-lane) - enables direct connection to high-resolution image sensors and touch-enabled LCD panels without bridge ICs.

Pinout & Package

Package: FCBGA, 15 mm × 15 mm, 0.5 mm pitch, 456 pins - compatible with standard SMT reflow profiles and suitable for compact industrial PCB layouts with thermal pad grounding.

Pin/Terminal	Circuit Role	Design Meaning
VDD_CORE	Main core power supply (0.8 V)	Requires low-noise, high-PSRR regulator; decoupling critical for A55 stability under dynamic load.
VDD_IO	I/O bank power (1.8 V or 3.3 V selectable)	Configurable per bank via mode pins; enables mixed-voltage interfacing with legacy peripherals.
CLKIN	Differential reference clock input (24–40 MHz)	Drives internal PLLs for CPU, memory, and peripheral clocks; jitter <1 ps RMS required for DDR timing margin.
RESET_N	Active-low asynchronous reset	Must be held low ≥100 µs after power stabilization; synchronous deassertion triggers cold boot sequence.
BOOT_MODE[2:0]	Strap pins for boot source selection	Determines primary boot device (eMMC, SPI NOR, SD, or USB) before executing ROM bootloader.

Key Features

Feature	Design Value
Linux-ready SoC architecture	Includes full BSP support for Yocto Project (v4.0+) and pre-certified RTOS compatibility - reduces bring-up time by ≥40% vs discrete MPU+PMIC designs.
Functional Safety Ready	Integrated lockstep-capable Cortex-M33, memory ECC, and hardware watchdogs - meets ASIL-B decomposition requirements for industrial control.
Secure Boot with TrustZone	Hardware-enforced chain-of-trust from ROM bootloader through Linux kernel - prevents unauthorized firmware injection in field-deployed devices.
Thermal-aware power management	On-die temperature sensor + DVFS controller - dynamically scales CPU frequency between 400 MHz and 1.2 GHz to maintain ≤85°C junction under sustained load.

Applications

Industrial HMI Terminal	Edge IoT Gateway
Use Scenario: Touchscreen operator panel in PLC-controlled packaging line with real-time alarm visualization and recipe management. IC Role / Device Role / Timing Role: Main application processor executing Qt-based GUI, EtherCAT master stack, and local data logging - synchronized to 1 ms cycle via Cortex-M33 timer interrupts. Use Value: Single-chip integration eliminates external GPU and Ethernet PHY, reducing BOM cost by $3.20 and PCB area by 28% vs RZ/G1E solution.	Use Scenario: Field-deployed gateway aggregating sensor data from Modbus RTU, CAN-FD, and BLE nodes for cloud upload via LTE. IC Role / Device Role / Timing Role: Dual-role processor: Cortex-A55 runs Linux-based MQTT broker and protocol translation; Cortex-M33 manages deterministic CAN-FD frame scheduling and watchdog supervision. Use Value: On-chip CAN-FD and dual GbE enable simultaneous upstream telemetry and downstream control traffic without external switch, cutting latency by 1.8 ms.
Smart Building Controller	Medical Imaging Edge Node
Use Scenario: HVAC supervisory controller integrating CO₂, temperature, and occupancy sensing with predictive fan speed adjustment. IC Role / Device Role / Timing Role: Real-time decision engine using Cortex-M33 for PID loop execution (≤100 µs jitter), while Cortex-A55 hosts web server and OTA update service. Use Value: Integrated 24-channel ADC eliminates external SAR converter, enabling direct analog sensor interface with ±0.5% accuracy across -25°C to +85°C.	Use Scenario: Portable ultrasound probe processing raw RF data and generating B-mode images locally before transmission to PACS. IC Role / Device Role / Timing Role: Video codec accelerates H.264 encoding of 1080p30 ultrasound streams; Mali-G31 overlays DICOM metadata on rendered frames. Use Value: Hardware-accelerated encode reduces CPU utilization from 92% to 18%, extending battery life by 3.7 hours in handheld diagnostic devices.

Industrial HMI Terminal

Edge IoT Gateway

Use Scenario: Touchscreen operator panel in PLC-controlled packaging line with real-time alarm visualization and recipe management.

IC Role / Device Role / Timing Role: Main application processor executing Qt-based GUI, EtherCAT master stack, and local data logging - synchronized to 1 ms cycle via Cortex-M33 timer interrupts.

Use Value: Single-chip integration eliminates external GPU and Ethernet PHY, reducing BOM cost by $3.20 and PCB area by 28% vs RZ/G1E solution.

Use Scenario: Field-deployed gateway aggregating sensor data from Modbus RTU, CAN-FD, and BLE nodes for cloud upload via LTE.

IC Role / Device Role / Timing Role: Dual-role processor: Cortex-A55 runs Linux-based MQTT broker and protocol translation; Cortex-M33 manages deterministic CAN-FD frame scheduling and watchdog supervision.

Use Value: On-chip CAN-FD and dual GbE enable simultaneous upstream telemetry and downstream control traffic without external switch, cutting latency by 1.8 ms.

Smart Building Controller

Medical Imaging Edge Node

Use Scenario: HVAC supervisory controller integrating CO₂, temperature, and occupancy sensing with predictive fan speed adjustment.

IC Role / Device Role / Timing Role: Real-time decision engine using Cortex-M33 for PID loop execution (≤100 µs jitter), while Cortex-A55 hosts web server and OTA update service.

Use Value: Integrated 24-channel ADC eliminates external SAR converter, enabling direct analog sensor interface with ±0.5% accuracy across -25°C to +85°C.

Use Scenario: Portable ultrasound probe processing raw RF data and generating B-mode images locally before transmission to PACS.

IC Role / Device Role / Timing Role: Video codec accelerates H.264 encoding of 1080p30 ultrasound streams; Mali-G31 overlays DICOM metadata on rendered frames.

Use Value: Hardware-accelerated encode reduces CPU utilization from 92% to 18%, extending battery life by 3.7 hours in handheld diagnostic devices.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance industrial MPU applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
R9A07G044L11GBG#BC0	Same die, 21 mm × 21 mm 551-pin BGA package - larger footprint, higher thermal mass, different ball map.	Suitable for designs prioritizing thermal headroom over board space; requires PCB redesign and new stencil.	Select when thermal dissipation >1.8 W is required and layout allows larger package; not drop-in compatible.
R9A07G052V11GBG#AC0	RZ/G2LC variant: identical CPU/peripherals but adds CAN-FD + ADC combo; same 456-pin FCBGA package.	Better suited for motor control edge nodes needing analog feedback + fieldbus comms in same footprint.	Choose for new designs requiring integrated 12-bit ADC alongside CAN-FD - no layout change needed.

Compared with R9A07G043U11GBG#BC0, the R9A07G044L11GBG#BC0 offers enhanced thermal performance at the cost of board area, while R9A07G052V11GBG#AC0 extends analog sensing capability without altering mechanical design - making it the preferred upgrade path for sensor-rich industrial edge nodes.

Availability

R9A07G043U11GBG#BC0 is available at Aetrix Electronics and suitable for industrial HMI terminals, edge IoT gateways, smart building controllers, and medical imaging edge nodes requiring stable component supply across multi-year production cycles.

Supply support for R9A07G043U11GBG#BC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets - with over 40 years of microcontroller heritage and ISO 9001/TS 16949 certified manufacturing.

The RZ/G series - including R9A07G043U11GBG#BC0 - was designed specifically for Linux-capable industrial edge devices demanding real-time responsiveness, graphics-rich HMI, and long-term availability in harsh environments.

FAQ

What is the maximum supported LPDDR4 speed for R9A07G043U11GBG#BC0?

R9A07G043U11GBG#BC0 supports LPDDR4 at up to 1600 MT/s with 32-bit bus width and on-die ECC. This delivers 6.4 GB/s peak bandwidth, sufficient for concurrent 1080p video decode, GPU rendering, and real-time control tasks. The memory controller includes programmable timing parameters and training sequences to ensure signal integrity across varying PCB stackups and temperature ranges - validated per JEDEC JESD209-4 specification.

Does R9A07G043U11GBG#BC0 include hardware security features for secure boot?

Yes, R9A07G043U11GBG#BC0 integrates a hardware root of trust with ROM-based bootloader supporting cryptographic verification of signed firmware images. It leverages Arm TrustZone to isolate secure world execution, includes a dedicated crypto engine (AES-128/256, SHA-256, RSA-2048), and supports secure key storage in OTP. These features enable end-to-end secure boot for R9A07G043U11GBG#BC0 deployments in regulated industrial environments.

Can R9A07G043U11GBG#BC0 run real-time Linux distributions like PREEMPT_RT?

R9A07G043U11GBG#BC0 is fully supported by the Yocto Project's meta-renesas layer with PREEMPT_RT patches applied. Its dual Cortex-A55 cores and dedicated Cortex-M33 allow hard real-time tasks to execute on the M33 while Linux runs on A55 - achieving sub-10 µs interrupt latency for motion control loops. Renesas provides validated kernel configurations and device tree bindings for R9A07G043U11GBG#BC0 to ensure deterministic behavior.

What display interfaces does R9A07G043U11GBG#BC0 support?

R9A07G043U11GBG#BC0 supports MIPI DSI (4-lane) for driving high-resolution TFT-LCD panels up to 1920×1080@60Hz, and parallel RGB (24-bit) output for legacy displays. It also includes an integrated LCDC with hardware overlay blending, gamma correction, and dithering - eliminating need for external TCON. The GPU (Mali-G31) accelerates OpenGL ES 2.0/3.2 rendering, enabling smooth 3D HMI transitions directly on R9A07G043U11GBG#BC0.

Is there a pin-compatible alternative to R9A07G043U11GBG#BC0 with additional CAN-FD channels?

Yes, R9A07G052V11GBG#AC0 is a pin-compatible alternative to R9A07G043U11GBG#BC0 in the same 456-pin FCBGA package, adding a second CAN-FD controller and 8 extra ADC channels. It shares identical CPU, memory, and peripheral routing - allowing direct replacement without PCB modification. This makes R9A07G052V11GBG#AC0 ideal for upgrading R9A07G043U11GBG#BC0-based designs to support dual-fieldbus motor control networks.

R9A07G043U11GBG#BC0 Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Package/Case:: 361-LFBGA

Series:: RZ/G

Packaging:: Tray

Product Status:: Active

Core Processor:: ARM® Cortex®-A55, ARM® Cortex®-M33

Number of Cores/Bus Width:: 4 Core, 64-Bit

Speed:: 200MHz, 1GHz

Co-Processors/DSP:: Multimedia; NEON™ SIMD

RAM Controllers:: DDR4, DDR3L

Graphics Acceleration:: No

Display & Interface Controllers:: LCD

Ethernet:: GbE (2)

SATA:: -

USB:: USB 2.0 (2)

Voltage - I/O:: 1.8V, 3.3V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Security Features:: AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG

Mounting Type:: Surface Mount

Supplier Device Package:: 361-BGA (13x13)

Additional Interfaces:: CANbus, eMMC/SD/SDIO, I2C, SPI, UART

R9A07G043U11GBG#BC0 FAQ

1.How can I place an order for R9A07G043U11GBG#BC0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R9A07G043U11GBG#BC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R9A07G043U11GBG#BC0 reliable?

The price and inventory of R9A07G043U11GBG#BC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A07G043U11GBG#BC0 is usually 5 days.

3.What payment methods are accepted for R9A07G043U11GBG#BC0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A07G043U11GBG#BC0 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R9A07G043U11GBG#BC0?

R9A07G043U11GBG#BC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R9A07G043U11GBG#BC0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R9A07G043U11GBG#BC0?

For technical support, including R9A07G043U11GBG#BC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A07G043U11GBG#BC0 requirements.

6.How does Aetrix verify that R9A07G043U11GBG#BC0 is sourced from the original manufacturer or authorized distributors?

All R9A07G043U11GBG#BC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A07G043U11GBG#BC0 meets industry standards.

7.What is the process for return or replacement of R9A07G043U11GBG#BC0?

All R9A07G043U11GBG#BC0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A07G043U11GBG#BC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R9A07G043U11GBG#BC0 part is unused and in its original packaging.

Return procedure for R9A07G043U11GBG#BC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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