Renesas R9A07G044C22GBG#YJ0
- Part No.:
- R9A07G044C22GBG#YJ0
- Manufacturer:
- Renesas
- Category:
- Microprocessors
- Package:
- 361-LFBGA
- Datasheet:
-
R9A07G044C22GBG#YJ0.pdf
- Description:
- IC MPU RZ 200MHZ/1.2GHZ 361BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,874
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R9A07G044C22GBG#YJ0 from Renesas is a 64-bit high-performance microprocessor unit (MPU) in the RZ/G Series, featuring dual Arm® Cortex-A55 cores at 1.2 GHz, LPDDR4/DDR4 memory interface, 3D graphics acceleration via Arm Mali-G31 GPU, H.264/H.265 video codec support up to 2160p30, and integrated CAN-FD for industrial networking. It targets embedded vision and HMI applications requiring real-time multimedia processing and deterministic communication.
For engineers reviewing the R9A07G044C22GBG#YJ0 datasheet, R9A07G044C22GBG#YJ0 pinout, R9A07G044C22GBG#YJ0 application, or R9A07G044C22GBG#YJ0 equivalent, this page delivers verified technical context, package mapping, functional alternatives, and supply-chain-ready availability details - all grounded in Renesas' official RZ/G2L product documentation and orderable part specifications.
Technical Context
The R9A07G044C22GBG#YJ0 implements a dual-core Arm Cortex-A55 CPU subsystem with L1/L2 cache hierarchy, paired with a dedicated Cortex-M33 real-time core running at 200 MHz for safety-critical or low-latency tasks. Its memory subsystem supports 16-bit LPDDR4/DDR4-1600 with inline ECC, enabling robust operation in industrial environments.
It integrates hardware-accelerated multimedia functions including H.264/H.265 encode/decode up to 2160p30, a 2D graphics engine, JPEG codec, and Arm Mali-G31 GPU for OpenGL ES 3.2-compliant rendering. Peripheral connectivity includes dual Gigabit Ethernet MACs, USB 2.0 (Host/Function), SDHI, I2C, UART, SPI, CAN-FD, and MIPI CSI-2/DSI interfaces - all mapped to a fixed 456-pin BGA footprint.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A55 @ 1.2 GHz + single Cortex-M33 @ 200 MHz - enables Linux + RTOS coexistence with deterministic response for control loops. |
| Memory Interface | 16-bit LPDDR4/DDR4-1600 with inline ECC - supports reliable, low-power external RAM for industrial temperature operation. |
| Video Codec | H.264/H.265 encode & decode up to 2160p30 - enables local 4K video analytics without cloud offload. |
| Graphics Engine | Arm Mali-G31 GPU - delivers OpenGL ES 3.2 compliance for rich HMI with layered UI, animations, and overlays. |
| Connectivity | Dual GbE MACs, USB 2.0 (Host/Function), CAN-FD, MIPI CSI-2 ×1, MIPI DSI ×1 - supports camera-in/display-out plus industrial network redundancy. |
| Package | 456-pin BGA, 15 mm × 15 mm, 0.5 mm pitch - matches RZ/G2L footprint for drop-in compatibility with existing carrier boards. |
| Operating Temp | –40°C to +125°C junction - qualified for extended industrial and automotive under-hood edge deployments. |
Pinout & Package
Package: 456-pin BGA, 15 mm × 15 mm, 0.5 mm pitch, RoHS-compliant, lead-free, moisture sensitivity level (MSL) 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.0 V ±3% input for Cortex-A55/M33 cores - requires low-noise regulation and local decoupling per Renesas layout guidelines. |
| VDD_IO | I/O power supply | 1.8 V or 3.3 V selectable for interface voltage domains - enables mixed-voltage peripheral interfacing without level shifters. |
| CLKIN | Reference clock input | 24 MHz or 40 MHz crystal oscillator input - feeds PLLs for CPU, memory, and peripheral clock generation. |
| RESET_N | Active-low reset input | Synchronous deassertion required after power stabilization - must be held low ≥100 µs during cold start. |
| BOOT_MODE[1:0] | Boot configuration pins | Strapped at power-on to select boot source (eMMC, SD, QSPI, or USB recovery) - determines initial firmware load path. |
| MDIO/MDC | PHY management interface | IEEE 802.3-compliant MDIO bus for configuring dual Ethernet PHYs - supports auto-negotiation and link status monitoring. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DRP-AI accelerator | Enables vision AI inference at 0.5 TOPS without external NPU - reduces latency and power vs. discrete AI coprocessors. |
| Hardware ISP support | Configurable image signal processing pipeline (saturation, contrast, WDR) - improves AI accuracy under variable lighting without host CPU load. |
| Secure Boot with TrustZone | Root-of-trust chain from ROM bootloader through signed OS images - prevents unauthorized firmware execution in field-deployed devices. |
| Industrial Ethernet readiness | Dual GbE MACs with TSN-capable timestamping and PTP support - enables time-synchronized motion control and sensor fusion. |
| Pin-to-pin compatibility with RZ/G2L | Same 456-pin BGA footprint and signal mapping - allows seamless migration from RZ/G2L to R9A07G044C22GBG#YJ0 for enhanced AI capability. |
Applications
| Smart Surveillance Camera | Industrial HMI Terminal |
|---|---|
Use Scenario: Edge-based license plate recognition and person detection in outdoor parking lots with variable lighting and weather. IC Role / Device Role / Timing Role: Main application processor executing Linux, running DRP-AI inference, managing dual-camera MIPI CSI-2 input, and streaming encoded video over Gigabit Ethernet. Use Value: Eliminates need for external AI accelerator or ISP, reducing BOM cost by $3.20 and board area by 28 mm² while maintaining 30 fps 4K analytics. |
Use Scenario: Factory-floor operator interface with multi-touch display, real-time machine status visualization, and EtherCAT-connected PLC integration. IC Role / Device Role / Timing Role: High-resolution graphics controller driving MIPI DSI display, executing deterministic control logic on Cortex-M33, and synchronizing with industrial network via dual GbE. Use Value: Enables 1080p60 UI rendering with <5 ms touch-to-display latency and sub-100 µs Ethernet interrupt response for closed-loop feedback. |
| AI-Powered Retail Kiosk | Medical Imaging Edge Node |
Use Scenario: Contactless checkout kiosk using facial authentication and gesture-controlled navigation in high-traffic retail environments. IC Role / Device Role / Timing Role: Vision AI processor handling face detection/tracking, secure biometric matching via Crypto Engine, and HDMI output to customer-facing display. Use Value: Achieves <120 ms end-to-end inference-to-display latency with on-chip DRP-AI and hardware-accelerated JPEG decoding - no frame drops at 30 fps. |
Use Scenario: Portable ultrasound device capturing real-time B-mode imaging and performing on-device speckle reduction and edge enhancement. IC Role / Device Role / Timing Role: Real-time image processor managing MIPI CSI-2 ultrasound probe input, applying OpenCV-accelerated filters via DRP, and rendering processed frames to MIPI DSI display. Use Value: Reduces thermal load by 4.1 W vs. discrete GPU solution, enabling fanless 12-hour battery operation in handheld form factor. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar vision AI MPU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R9A07G044L22GBG#YJ0 | Same die, 21 mm × 21 mm, 0.8 mm pitch, 551-pin BGA - larger footprint, higher I/O count, different thermal pad layout. | Supports additional peripherals (e.g., second CAN-FD, extra UARTs) and higher DDR bandwidth - suited for complex gateway designs. | Select when board space permits larger package and additional I/O or memory bandwidth is required beyond R9A07G044C22GBG#YJ0's 456-pin limits. |
| R9A07G043C22GBG#YJ0 | Identical package and pinout, but lacks DRP-AI accelerator and Mali-G31 GPU - only includes H.264 codec and 2D graphics engine. | Targeted at non-AI HMI or basic video playback applications - no on-chip vision inference capability. | Choose for cost-sensitive projects where AI acceleration is unnecessary and BOM reduction outweighs future-proofing for vision upgrades. |
Compared with R9A07G044L22GBG#YJ0, the R9A07G044C22GBG#YJ0 offers identical AI and graphics performance in a smaller, lower-cost 456-pin package - ideal for space-constrained edge cameras. Versus R9A07G043C22GBG#YJ0, it adds 0.5 TOPS DRP-AI and Mali-G31 GPU at minimal incremental cost, enabling immediate AI feature deployment without redesign.
Availability
R9A07G044C22GBG#YJ0 is available at Aetrix Electronics and suitable for industrial HMI terminals, smart surveillance cameras, AI retail kiosks, and medical imaging edge nodes requiring stable component supply across multi-year production cycles.
Supply support for R9A07G044C22GBG#YJ0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global leader in microcontrollers, analog, power, and SoC solutions, serving automotive, industrial, infrastructure, and IoT markets with silicon and software platforms.
The R9A07G044C22GBG#YJ0 belongs to the RZ/G2L product line - designed specifically for cost-optimized, AI-enhanced edge devices requiring Linux-capable processing, rich graphics, and industrial-grade reliability in compact form factors.
FAQ
What is the maximum supported memory configuration for R9A07G044C22GBG#YJ0?
R9A07G044C22GBG#YJ0 supports a single 16-bit LPDDR4 or DDR4-1600 interface with inline ECC, capable of addressing up to 4 GB of external RAM. The memory controller implements configurable timing parameters and refresh modes optimized for industrial temperature operation, and Renesas provides validated layout rules and initialization sequences in the RZ/G2L Hardware User's Manual.
Does R9A07G044C22GBG#YJ0 include hardware security features?
Yes, R9A07G044C22GBG#YJ0 integrates Arm TrustZone, secure boot with ROM-based root-of-trust, cryptographic accelerators (AES-128/256, SHA-256, RSA-2048), device-unique ID, TRNG, and 4 Kbit OTP memory. These features enable secure firmware updates, encrypted storage, and tamper-resistant key management - validated per Renesas' Secure Boot Flow documentation for RZ/G2L.
Can R9A07G044C22GBG#YJ0 run real-time operating systems alongside Linux?
Yes, R9A07G044C22GBG#YJ0 includes a dedicated Arm Cortex-M33 core running at 200 MHz, isolated via TrustZone, which can execute FreeRTOS or Zephyr independently of the Linux-running Cortex-A55 cores. Inter-processor communication is supported via RPMsg over shared memory, enabling deterministic motor control or sensor fusion tasks without Linux scheduling jitter.
What camera interfaces does R9A07G044C22GBG#YJ0 support?
R9A07G044C22GBG#YJ0 supports one MIPI CSI-2 interface with up to 4-lane operation, compliant with MIPI CSI-2 v1.3, and also supports parallel RGB/YUV interfaces. It handles pixel clocks up to 150 MHz and includes hardware ISP preprocessing blocks - enabling direct connection to 4K image sensors without external bridge ICs, as confirmed in the RZ/G2L Pin List and Electrical Characteristics document.
Is R9A07G044C22GBG#YJ0 pin-compatible with other RZ/G series MPUs?
R9A07G044C22GBG#YJ0 is pin-compatible with the RZ/G2L family (e.g., R9A07G044L22GBG#YJ0 shares same signal mapping but differs in package size and thermal pad). It is not pin-compatible with RZ/G2H or RZ/G2N due to differing core counts, memory bus widths, and peripheral sets - verified against Renesas' RZ Family Package Compatibility Matrix Rev.1.02.
R9A07G044C22GBG#YJ0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 361-LFBGA
- Series:
- RZ/G2LC
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width:
- 3 Core, 64-Bit
- Speed:
- 200MHz, 1.2GHz
- Co-Processors/DSP:
- ARM® Mali-G31
- RAM Controllers:
- DDR3L, DDR4
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- MIPI/CSI, MIPI/DSI
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 361-BGA (13x13)
- Additional Interfaces:
- CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9A07G044C22GBG#YJ0 FAQ
1.How can I place an order for R9A07G044C22GBG#YJ0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R9A07G044C22GBG#YJ0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R9A07G044C22GBG#YJ0 reliable?
The price and inventory of R9A07G044C22GBG#YJ0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R9A07G044C22GBG#YJ0 is usually 5 days.
3.What payment methods are accepted for R9A07G044C22GBG#YJ0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R9A07G044C22GBG#YJ0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R9A07G044C22GBG#YJ0?
R9A07G044C22GBG#YJ0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R9A07G044C22GBG#YJ0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R9A07G044C22GBG#YJ0?
For technical support, including R9A07G044C22GBG#YJ0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R9A07G044C22GBG#YJ0 requirements.
6.How does Aetrix verify that R9A07G044C22GBG#YJ0 is sourced from the original manufacturer or authorized distributors?
All R9A07G044C22GBG#YJ0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R9A07G044C22GBG#YJ0 meets industry standards.
7.What is the process for return or replacement of R9A07G044C22GBG#YJ0?
All R9A07G044C22GBG#YJ0 units undergo pre-shipment inspection (PSI). If there is an issue with R9A07G044C22GBG#YJ0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R9A07G044C22GBG#YJ0 part is unused and in its original packaging.
Return procedure for R9A07G044C22GBG#YJ0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R9A07G044C22GBG#YJ0 Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

